CN111826695A - Electroplating process for LED lead frame - Google Patents
Electroplating process for LED lead frame Download PDFInfo
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- CN111826695A CN111826695A CN202010773052.8A CN202010773052A CN111826695A CN 111826695 A CN111826695 A CN 111826695A CN 202010773052 A CN202010773052 A CN 202010773052A CN 111826695 A CN111826695 A CN 111826695A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating process of an LED lead frame, belonging to the technical field of lead frame electroplating. The process comprises the following steps: preprocessing a surface; copper plating treatment is carried out; performing nickel plating treatment; fourthly, silver plating treatment; and fifthly, silver protection. The invention combines the full immersion plating and the local plating to form a plurality of plating layers, thereby greatly improving the electroplating precision and reducing the production cost; the plating layer of the silver plating functional area is uniform and bright, and the quality of the LED product is improved.
Description
Technical Field
The invention belongs to the technical field of lead frame electroplating, and particularly relates to an LED lead frame electroplating process.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural component for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical loop, is an important discrete device for packaging electronic components such as a diode, a triode, a potentiometer and the like, plays a role of a bridge connected with an external lead, and needs to be electroplated on the surface of the lead frame in order to ensure that the chip, a welding wire and the lead frame have good weldability. The current common electroplating mode comprises full immersion plating, selective immersion plating, brush plating, local plating and the like, wherein the full immersion plating is suitable for carrying out comprehensive electroplating on the whole lead frame, bottoming electroplating and functional layer full plating are carried out, but when the functional layer is plated completely, a non-functional area is also plated with a functional plating layer to cause cost waste, particularly to lead frames which have more complex structures and are required to be plated with multiple plating layers and electroplated in multiple areas, the market demand can not be met by adopting the traditional single or two plating modes at present, the production efficiency of the existing lead frame product is difficult to improve, and the outline of the finished product electroplating area is not clear.
Disclosure of Invention
The invention aims to provide the electroplating process of the LED lead frame, aiming at the defects in the existing lead frame electroplating technology, the process can be used for efficiently plating various coatings, the coatings of the functional areas are uniform and bright, the electroplating cost is reduced, and the quality of LED products is improved.
In order to achieve the purpose, the invention adopts the technical scheme that the electroplating process of the LED lead frame comprises the following steps:
surface pretreatment
Soaking the lead frame in an electrolytic solution to remove oil, cleaning the lead frame with tap water, drying the lead frame by blowing, soaking the lead frame in an aminosulfonic acid activation solution, cleaning the lead frame with tap water, cleaning the lead frame with deionized water, and drying the lead frame by blowing;
the copper plating treatment is carried out
Putting the lead frame with the pretreated surface into a pre-plating copper solution for full immersion pre-plating copper, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into the copper plating solution for partial copper plating, cleaning the lead frame by using the deionized water, and drying the lead frame by blowing;
performing nickel plating treatment
Putting the lead frame subjected to the partial copper plating treatment into a nickel pre-plating solution for full immersion nickel pre-plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel plating solution for partial plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel-copper alloy plating solution for partial plating of nickel-copper alloy, cleaning the lead frame by using deionized water, and drying the lead frame by blowing;
silver plating treatment
Plating pre-silver plating: putting the lead frame into a pre-silver plating solution to be fully soaked with the pre-silver plating solution, cleaning the lead frame by using deionized water, and then drying the lead frame by blowing, putting the functional area of the lead frame into a silver plating solution to be partially silver plated, and then cleaning the lead frame by using the deionized water, and then drying the lead frame by blowing;
silver protection is passed to fife
And (3) putting the lead frame subjected to the partial silver plating treatment into silver protection liquid medicine for soaking treatment, cleaning with deionized water, and drying.
Further, in one embodiment of the present invention, in the degreasing of the electrolyte in the step of performing, an electrolytic solution is used which contains 95 to 105g/L of alkaline degreasing powder and has a current density of 10 to 20A/dm2The temperature of the electrolytic solution is 55-65 ℃.
Further, in one embodiment of the invention, the pre-copper plating solution contains cuprous cyanide 20-30 g/L, sodium cyanide 35-40 g/L and current density 10-20A/dm2The temperature of the pre-copper plating solution is room temperature; the copper plating solution contains 80-120 g/L cuprous cyanide and 20-35 g/L sodium cyanide, and the current density is 10-20A/dm2The temperature of the copper plating solution is 55-65 ℃.
Further, in one embodiment of the invention, the nickel pre-plating solution contains 2-5 g/L of nickel sulfamate, 10-12 g/L of boric acid and 5-10A/dm of current density2The temperature of the nickel preplating solution is room temperature; the nickel plating solution contains 55-70 g/L of nickel sulfamate, 5-7 g/L of nickel chloride, 35-45 g/L of boric acid, 45-55 g/L of trisodium citrate and has a current density of 5-10A/dm2The temperature of the nickel plating solution is 50-60 ℃.
Further, in an embodiment of the invention, the nickel-copper alloy plating solution contains 30-50 g/L of nickel sulfate, 30-40 g/L of copper sulfate, 35-65 g/L of trisodium citrate, 5-10 g/L of sodium chloride, 30-40 g/L of boric acid, and has a current density of 5-15A/dm2The temperature of the nickel-copper alloy plating solution is 50-60 ℃.
Further, in an embodiment of the invention, the pre-plating silver solution contains 3-5 g/L of silver potassium cyanide, 10-15 g/L of potassium cyanide, 0.2-1 g/L of brightener and 3-8A/dm of current density2The temperature of the pre-plating silver solution is room temperature.
Further, in one embodiment of the invention, the silver plating solution comprises 30-50 g/L of silver nitrate, 10-30 g/L of potassium citrate, 15-25 g/L of ammonium acetate, 5-10 g/L of potassium tetraborate, 2-5 g/L of thiourea, 0.2-1 g/L of brightener, and the current density is 3-8A/dm2The temperature of the pre-silver plating solution is 50-60 ℃.
Further, in one embodiment of the invention, the concentration of the silver protective solution is 5-10 ml/L, and the treatment time is 10-20 s.
Compared with the prior art, the invention combines the full immersion plating and the local plating to form a plurality of plating layers, thereby greatly improving the electroplating precision and reducing the production cost; the plating layer of the silver plating functional area is uniform and bright, and the quality of the LED product is improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail with reference to the following embodiments, which are only preferred embodiments of the present invention to explain the technical solutions of the present invention, and those skilled in the art can make routine modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention.
Example 1
An electroplating process of an LED lead frame comprises the following steps:
surface pretreatment
The lead frame is immersed into electrolytic solution for oil removal, the adopted electrolytic solution contains 95g/L of alkaline oil removal powder, and the current density is 10A/dm2The temperature of the electrolytic solution is 55 ℃, then the electrolytic solution is cleaned by tap water and dried, then the electrolytic solution is put into sulfamic acid activation solution for soaking treatment, then the electrolytic solution is cleaned by tap water, and then the electrolytic solution is cleaned by deionized water and dried;
the copper plating treatment is carried out
Putting the lead frame with the pretreated surface into a pre-plating copper solution for full immersion pre-plating copper, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into the copper plating solution for partial copper plating, cleaning the lead frame by using the deionized water, and drying the lead frame by blowing; the pre-plating copper solution contains 20g/L cuprous cyanide and 35g/L sodium cyanide, and the current density is 10A/dm2The temperature of the pre-copper plating solution is room temperature; the copper plating solution contains 80g/L cuprous cyanide, 20g/L sodium cyanide and 10A/dm current density2The temperature of the copper plating solution was 55 ℃.
Performing nickel plating treatment
Putting the lead frame subjected to the local copper plating treatment into a pre-plating devicePre-plating nickel in a nickel plating solution in a full-immersion manner, cleaning with deionized water, drying by blowing, immersing the functional area of the lead frame in the nickel plating solution for local plating, cleaning with deionized water, drying by blowing, immersing the functional area of the lead frame in the nickel-copper alloy plating solution for local plating of nickel-copper alloy, cleaning with deionized water, and drying by blowing; the nickel preplating solution contains 2g/L of nickel sulfamate and 10g/L of boric acid, and has the current density of 5A/dm2The temperature of the nickel preplating solution is room temperature; the nickel plating solution contains 55g/L of nickel sulfamate, 5g/L of nickel chloride, 35g/L of boric acid and 45g/L of trisodium citrate, and the current density is 5A/dm2The temperature of the nickel plating solution is 50 ℃; the nickel-copper alloy plating solution contains 30g/L of nickel sulfate, 30g/L of copper sulfate, 35g/L of trisodium citrate, 5g/L of sodium chloride, 30g/L of boric acid and 5A/dm of current density2The temperature of the nickel-copper alloy plating solution is 50 ℃.
Silver plating treatment
Plating pre-silver plating: putting the lead frame into a pre-silver plating solution to be fully soaked with the pre-silver plating solution, cleaning the lead frame by using deionized water, and then drying the lead frame by blowing, putting the functional area of the lead frame into a silver plating solution to be partially silver plated, and then cleaning the lead frame by using the deionized water, and then drying the lead frame by blowing; the pre-plating silver solution contains 3g/L of silver potassium cyanide, 10g/L of potassium cyanide, 0.2g/L of brightener and 3A/dm of current density2The temperature of the pre-plating silver solution is room temperature; the silver plating solution comprises 30g/L of silver nitrate, 10g/L of potassium citrate, 15g/L of ammonium acetate, 5g/L of potassium tetraborate, 2g/L of thiourea, 0.2g/L of brightener and the current density of 3A/dm2The temperature of the silver preplating solution is 50 ℃; the brightener is AG-1 provided by Shenzhen Huililong science and technology Limited.
Silver protection: putting the lead frame subjected to the partial silver plating treatment into silver protection liquid medicine for soaking treatment, cleaning the lead frame by using deionized water and drying the lead frame; the silver protection liquid medicine AG-106 is treated for 10-20 s, and the concentration of the silver protection liquid medicine is 5-10 ml/L.
Example 2
An electroplating process of an LED lead frame comprises the following steps:
surface pretreatment
Immersing lead frame in electrolytic solution to remove oil, washing with tap water, drying, and adding ammoniaSoaking in a sulfonic acid activating solution, cleaning with tap water, cleaning with deionized water, and blow-drying; the adopted electrolytic solution contains alkaline deoiling powder 105g/L and the current density is 20A/dm2The temperature of the electrolytic solution is 65 ℃;
the copper plating treatment is carried out
Putting the lead frame with the pretreated surface into a pre-plating copper solution for full immersion pre-plating copper, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into the copper plating solution for partial copper plating, cleaning the lead frame by using the deionized water, and drying the lead frame by blowing; the pre-plating copper solution contains 30g/L cuprous cyanide and 40g/L sodium cyanide, and the current density is 20A/dm2The temperature of the pre-copper plating solution is room temperature; the copper plating solution contains 120g/L cuprous cyanide and 35g/L sodium cyanide, and the current density is 20A/dm2The temperature of the copper plating solution is 65 ℃;
performing nickel plating treatment
Putting the lead frame subjected to the partial copper plating treatment into a nickel pre-plating solution for full immersion nickel pre-plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel plating solution for partial plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel-copper alloy plating solution for partial plating of nickel-copper alloy, cleaning the lead frame by using deionized water, and drying the lead frame by blowing; the nickel preplating solution contains 5g/L nickel sulfamate and 12g/L boric acid, and has the current density of 10A/dm2The temperature of the nickel preplating solution is room temperature; the nickel plating solution contains 70g/L of nickel sulfamate, 7g/L of nickel chloride, 45g/L of boric acid and 55g/L of trisodium citrate, and the current density is 10A/dm2The temperature of the nickel plating solution is 60 ℃; the nickel-copper alloy plating solution contains 50g/L of nickel sulfate, 40g/L of copper sulfate, 65g/L of trisodium citrate, 10g/L of sodium chloride, 40g/L of boric acid and 15A/dm of current density2The temperature of the nickel-copper alloy plating solution is 60 ℃;
silver plating treatment
Plating pre-silver plating: putting the lead frame into a pre-silver plating solution to be fully soaked with the pre-silver plating solution, cleaning the lead frame by using deionized water, and then drying the lead frame by blowing, putting the functional area of the lead frame into a silver plating solution to be partially silver plated, and then cleaning the lead frame by using the deionized water, and then drying the lead frame by blowing; the pre-plating silver solution contains 5g/L of silver potassium cyanide,15g/L potassium cyanide, 1g/L brightener and 8A/dm current density2The temperature of the pre-plating silver solution is room temperature; 50g/L of silver nitrate, 30g/L of potassium citrate, 25g/L of ammonium acetate, 10g/L of potassium tetraborate, 5g/L of thiourea, 1g/L of brightener and 8A/dm of current density2The temperature of the silver preplating solution is 60 ℃; the brightener is AG-1 provided by Shenzhen Huililong science and technology Limited.
Silver protection: and (3) putting the lead frame subjected to the partial silver plating treatment into silver protection liquid medicine for soaking treatment, cleaning with deionized water, and drying. The concentration of the silver protective liquid medicine AG-106 is 10ml/L, and the treatment time is 20 s.
Example 3
An electroplating process of an LED lead frame comprises the following steps:
surface pretreatment
Soaking the lead frame in an electrolytic solution to remove oil, cleaning the lead frame with tap water, drying the lead frame by blowing, soaking the lead frame in an aminosulfonic acid activation solution, cleaning the lead frame with tap water, cleaning the lead frame with deionized water, and drying the lead frame by blowing; the adopted electrolytic solution contains 100g/L of alkaline degreasing powder and has the current density of 15A/dm2The temperature of the electrolytic solution is 60 ℃;
the copper plating treatment is carried out
Putting the lead frame with the pretreated surface into a pre-plating copper solution for full immersion pre-plating copper, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into the copper plating solution for partial copper plating, cleaning the lead frame by using the deionized water, and drying the lead frame by blowing; the pre-plating copper solution contains 25g/L of cuprous cyanide and 35g/L of sodium cyanide, and the current density is 15A/dm2The temperature of the pre-copper plating solution is room temperature; the copper plating solution contains 100g/L of cuprous cyanide, 30g/L of sodium cyanide and 15A/dm of current density2The temperature of the copper plating solution is 60 ℃;
performing nickel plating treatment
Putting the lead frame subjected to the partial copper plating treatment into a nickel pre-plating solution for full immersion nickel pre-plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel plating solution for partial plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, and immersing the functional area of the lead frame into a nickel-copper alloy plating solutionPlating nickel-copper alloy locally, cleaning with deionized water and drying; the nickel preplating solution contains 3.5g/L of nickel sulfamate and 11g/L of boric acid, and has the current density of 8A/dm2The temperature of the nickel preplating solution is room temperature; the nickel plating solution contains 65g/L of nickel sulfamate, 6g/L of nickel chloride, 40g/L of boric acid and 50g/L of trisodium citrate, and the current density is 8A/dm2The temperature of the nickel plating solution is 55 ℃; the nickel-copper alloy plating solution contains 40g/L of nickel sulfate, 35g/L of copper sulfate, 50g/L of trisodium citrate, 7.5g/L of sodium chloride and 35g/L of boric acid, and the current density is 10A/dm2The temperature of the nickel-copper alloy plating solution is 55 ℃;
silver plating treatment
Plating pre-silver plating: putting the lead frame into a pre-silver plating solution to be fully soaked with the pre-silver plating solution, cleaning the lead frame by using deionized water, and then drying the lead frame by blowing, putting the functional area of the lead frame into a silver plating solution to be partially silver plated, and then cleaning the lead frame by using the deionized water, and then drying the lead frame by blowing; the pre-plating silver solution contains 4g/L of silver potassium cyanide, 12.5g/L of potassium cyanide, 0.5g/L of brightener and 5A/dm of current density2The temperature of the pre-plating silver solution is room temperature; 40g/L of silver nitrate, 20g/L of potassium citrate, 20g/L of ammonium acetate, 7.5g/L of potassium tetraborate, 3.5g/L of thiourea, 0.6g/L of brightener and 5.5A/dm of current density2The temperature of the silver preplating solution is 55 ℃; the brightener is AG-1 provided by Shenzhen Huililong science and technology Limited.
Silver protection: and (3) putting the lead frame subjected to the partial silver plating treatment into silver protection liquid medicine for soaking treatment, cleaning with deionized water, and drying. The concentration of the silver protective liquid medicine AG-106 is 8ml/L, and the treatment time is 12 s.
Claims (8)
1. The electroplating process of the LED lead frame is characterized by comprising the following steps of:
surface pretreatment
Soaking the lead frame in an electrolytic solution to remove oil, cleaning the lead frame with tap water, drying the lead frame by blowing, soaking the lead frame in an aminosulfonic acid activation solution, cleaning the lead frame with tap water, cleaning the lead frame with deionized water, and drying the lead frame by blowing;
the copper plating treatment is carried out
Putting the lead frame with the pretreated surface into a pre-plating copper solution for full immersion pre-plating copper, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into the copper plating solution for partial copper plating, cleaning the lead frame by using the deionized water, and drying the lead frame by blowing;
performing nickel plating treatment
Putting the lead frame subjected to the partial copper plating treatment into a nickel pre-plating solution for full immersion nickel pre-plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel plating solution for partial plating, cleaning the lead frame by using deionized water, drying the lead frame by blowing, immersing the functional area of the lead frame into a nickel-copper alloy plating solution for partial plating of nickel-copper alloy, cleaning the lead frame by using deionized water, and drying the lead frame by blowing;
silver plating treatment
Plating pre-silver plating: putting the lead frame into a pre-silver plating solution to be fully soaked with the pre-silver plating solution, cleaning the lead frame by using deionized water, and then drying the lead frame by blowing, putting the functional area of the lead frame into a silver plating solution to be partially silver plated, and then cleaning the lead frame by using the deionized water, and then drying the lead frame by blowing;
silver protection is passed to fife
And (3) putting the lead frame subjected to the partial silver plating treatment into silver protection liquid medicine for soaking treatment, cleaning with deionized water, and drying.
2. The LED lead frame plating process of claim 1, wherein: when the electrolyte is used for removing oil, the adopted electrolytic solution contains 95-105 g/L of alkaline oil removal powder and has the current density of 10-20A/dm2The temperature of the electrolytic solution is 55-65 ℃.
3. The LED lead frame plating process of claim 1, wherein: the pre-copper plating solution contains 20-30 g/L cuprous cyanide and 35-40 g/L sodium cyanide, and the current density is 10-20A/dm2The temperature of the pre-copper plating solution is room temperature; the copper plating solution contains 80-120 g/L cuprous cyanide and 20-35 g/L sodium cyanide, and the current density is 10-20A/dm2The temperature of the copper plating solution is 55-65 ℃.
4. The LED lead frame plating process of claim 1, wherein:the nickel preplating solution contains 2-5 g/L of nickel sulfamate and 10-12 g/L of boric acid, and the current density is 5-10A/dm2The temperature of the nickel preplating solution is room temperature; the nickel plating solution contains 55-70 g/L of nickel sulfamate, 5-7 g/L of nickel chloride, 35-45 g/L of boric acid, 45-55 g/L of trisodium citrate and has a current density of 5-10A/dm2The temperature of the nickel plating solution is 50-60 ℃.
5. The LED lead frame plating process of claim 1, wherein: the nickel-copper alloy plating solution contains 30-50 g/L of nickel sulfate, 30-40 g/L of copper sulfate, 35-65 g/L of trisodium citrate, 5-10 g/L of sodium chloride, 30-40 g/L of boric acid, and the current density is 5-15A/dm2The temperature of the nickel-copper alloy plating solution is 50-60 ℃.
6. The LED lead frame plating process of claim 1, wherein: the pre-plating silver solution contains 3-5 g/L of silver potassium cyanide, 10-15 g/L of potassium cyanide, 0.2-1 g/L of brightener and 3-8A/dm of current density2The temperature of the pre-plating silver solution is room temperature.
7. The LED lead frame plating process of claim 1, wherein: the silver plating solution contains 30-50 g/L of silver nitrate, 10-30 g/L of potassium citrate, 15-25 g/L of ammonium acetate, 5-10 g/L of potassium tetraborate, 2-5 g/L of thiourea, 0.2-1 g/L of brightener and the current density is 3-8A/dm2The temperature of the pre-silver plating solution is 50-60 ℃.
8. The LED lead frame plating process of claim 1, wherein: the concentration of the silver protective liquid medicine is 5-10 ml/L, and the treatment lasts for 10-20 s.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114214713A (en) * | 2022-01-11 | 2022-03-22 | 成都明天高新产业有限责任公司 | Circuit board electroplating process of electroplating hanger based on cathode frame structure |
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