CN114214713A - Circuit board electroplating process of electroplating hanger based on cathode frame structure - Google Patents
Circuit board electroplating process of electroplating hanger based on cathode frame structure Download PDFInfo
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- CN114214713A CN114214713A CN202210028789.6A CN202210028789A CN114214713A CN 114214713 A CN114214713 A CN 114214713A CN 202210028789 A CN202210028789 A CN 202210028789A CN 114214713 A CN114214713 A CN 114214713A
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- electroplating
- circuit board
- plate
- conductive frame
- electroplating process
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- 238000009713 electroplating Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000002791 soaking Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000005406 washing Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 238000007781 pre-processing Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 4
- 239000003814 drug Substances 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims 1
- 238000007602 hot air drying Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 30
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a circuit board electroplating process of an electroplating hanger based on a cathode frame structure, wherein the electroplating hanger comprises a conductive frame and a fixed plate, the side surface of the conductive frame is attached to the surface of the fixed plate, the conductive frame is connected with a current lead, and the fixed plate is provided with a plurality of knob pressing blocks arranged beside the conductive frame; the circuit board electroplating process comprises the following steps: s1, plate pretreatment, S2, electroplating solution preparation, S3, plate surface hanging, S4, soaking and standing, S5, electrifying for copper plating, S6, plate taking, S7, cleaning, S8, plate surface drying, S9, plate feeding, S10 and plating solution replacement. The electroplating process disclosed by the invention has the advantages that the pollution of the plate surface is avoided, the flow is shortened, the plate surface is prevented from being oxidized, and the uniformity of the formed plating layer is high.
Description
Technical Field
The invention relates to the technical field of circuit board electroplating processes, in particular to a circuit board electroplating process of an electroplating hanger based on a cathode frame structure.
Background
The electroplating is a surface processing method for forming a coating by taking a plated base metal as a cathode and depositing cations of the pre-plated metal in the plating solution on the surface of the base metal through electrolysis in a salt solution containing the pre-plated metal.
The electroplating process of the existing circuit board needs to carry out a plurality of procedures before electroplating, such as procedures of water washing, acid degreasing, micro-etching, coarsening, pickling and the like, sulfuric acid with 3% -5% concentration is adopted to act on the board surface to remove an oxide layer, the board surface flow is too long in transfer, the procedures are complex, the board surface is polluted after being exposed in the air for too long time, meanwhile, the surface oxide layer of the board surface is too thick, and the electroplating effect is poor.
Disclosure of Invention
The invention aims to provide a circuit board electroplating process of an electroplating hanger based on a cathode frame structure, which can solve the technical problems in the background technology.
The embodiment of the invention is realized by the following technical scheme: a circuit board electroplating process of an electroplating hanger based on a cathode frame structure is characterized in that the electroplating hanger comprises a conductive frame and a fixed plate, the side surface of the conductive frame is attached to the surface of the fixed plate, the conductive frame is connected with a current lead, and a plurality of knob pressing blocks arranged beside the conductive frame are arranged on the fixed plate;
the circuit board electroplating process comprises the following steps:
s1, preprocessing a board, namely preprocessing a circuit board to be electroplated;
s2, preparing electroplating solution, and preparing the electroplating solution in the electroplating bath according to the corresponding proportion;
s3, hoisting the plate surface, fixing the plate to be electroplated on an electroplating hanger through a knob pressing block, hoisting the unpowered electroplating hanger by a crane and putting the unpowered electroplating hanger into an electroplating bath;
s4, soaking and standing, wherein the board surface is soaked in the electroplating solution and stands for a certain time under the condition that the conductive frame is not electrified;
s5, electrifying copper, electrifying the conductive frame by a current lead, electrifying the conductive frame and the four side edges of the board by electricity, and coppering the board in the electroplating bath;
s6, taking out the electroplating hanger from the electroplating bath, sequentially rotating the knob pressing block, and taking down the plate surface after the fixation is released;
s7, washing, namely directly washing the board surface with pressure water to remove residual liquid medicine on the board surface;
s8, drying the board, firstly absorbing water on the board by absorbent cotton, and then drying water stain on the board by hot air;
s9, sending the board to a dry film process for pattern transfer;
and S10, replacing the plating solution, and replacing and preparing new plating solution in the plating bath after the plating bath is plated with copper for multiple times.
Further, in the step S4, the soaking time is controlled to be 1-2min, and the temperature of the electroplating solution is controlled to be 20-25 ℃.
Further, in the step S4, the plating solution is aerated to be stirred by the flowing liquid while the circuit board is left standing in the plating tank.
Further, in S7, ionized water is used for cleaning.
Further, the drying time of the hot wind in the S8 is 10-15min, and the drying temperature is 55-70 ℃.
Further, the plating solution in S2 is a copper sulfate solution.
Furthermore, a high-pressure air blowing pipe is installed on the fixing plate, and faces between the fixing plate and the conductive frame.
Furthermore, the current wires are provided with a plurality of equal lengths and are connected to the edge side of the conductive frame at uniform intervals.
The technical scheme of the embodiment of the invention at least has the following advantages and beneficial effects: compared with the prior art, when in electroplating,
1. the operations of pickling, oil removal, water washing and the like are not carried out before electroplating, and the circuit board is directly hung into the electroplating tank by a crane, so that the process is shortened, the degree of pollution of the board surface by impurities in the air is reduced, the time is short, and an oxide layer is not easy to generate;
2. when the circuit board is placed into the electroplating bath by the hanger, the circuit board is in an unpowered state and is soaked firstly, if the board surface is provided with the oxide layer, the copper sulfate, the sulfuric acid and other acidity in the electroplating solution can be removed, and then the electroplating solution is electrified after a certain time, so that the cleanness and tidiness of the board surface are ensured, then the electroplating is conducted, the current of each point contacted with the board surface by the conductive wire frame is the same, and the uniformity of the plating layer formed on the board surface is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of an electroplating process according to the present invention;
FIG. 2 is a schematic structural view of an electroplating hanger according to the present invention;
FIG. 3 is a schematic structural diagram of a fixing plate according to the present invention;
fig. 4 is a side view of a plating hanger of the present invention.
Icon: 1-a fixing plate, 2-a conductive frame, 3-a current lead, 4-a knob pressing block and 5-a high-pressure air blowing pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Example 1
To further explain in combination with the specific embodiment, referring to fig. 1-4, embodiment 1 is a circuit board electroplating process of an electroplating hanger based on a cathode frame structure, the electroplating hanger includes a conductive frame 2 and a fixing plate 1, a side surface of the conductive frame 2 is attached to a surface of the fixing plate 1, the conductive frame 2 is connected with a current lead 3, and the fixing plate 1 is provided with a plurality of knob pressing blocks 4 arranged beside the conductive frame 2;
the circuit board electroplating process comprises the following steps: s1, preprocessing a board, namely preprocessing a circuit board to be electroplated;
s2, preparing electroplating solution, and preparing the electroplating solution in the electroplating bath according to the corresponding proportion;
s3, hoisting the plate surface, fixing the plate to be electroplated on an electroplating hanger through a knob pressing block 4, hoisting the unpowered electroplating hanger by a crane and putting the unpowered electroplating hanger into an electroplating bath;
and S4, soaking and standing, wherein the conductive frame 2 is soaked in the electroplating solution and stands for a certain time under the condition that the conductive frame is not electrified, and specifically, soaking is firstly carried out, and the board is cleaned and the oxide layer is removed.
S5, electrifying copper plating, electrifying the conductive frame 2 by the current lead 3, electrifying the conductive frame 2 and the four side edges of the board by the electric current, and electroplating the board in the electroplating bath, specifically, ensuring the uniformity and the even brightness of the plating layer.
S6, taking out the electroplating hanger from the electroplating bath, sequentially rotating the knob pressing block 4, and taking down the plate surface after the fixation is released;
s7, washing, namely directly washing the board surface with pressure water to remove residual liquid medicine on the board surface;
s8, drying the board, firstly absorbing water on the board by absorbent cotton, and then drying water stain on the board by hot air;
s9, sending the board to a dry film process for pattern transfer;
s10, replacing the plating solution, replacing and preparing a new plating solution in the plating bath after the plating bath is plated with copper for multiple times, specifically, after the plating solution is used for multiple times, the impurity content is excessive, and the copper content is gradually reduced;
in S4, the soaking time is controlled to be 1-2min, the temperature of the electroplating solution is controlled to be 20-25 ℃, and particularly, the oxide layer can be sufficiently and effectively removed within the temperature and time range.
S4, when the circuit board is placed in the plating bath, the electroplating solution is aerated to flow liquid to stir, and particularly, the reaction effect and the reaction speed of the electroplating solution and the oxide layer are improved.
In S7, the cleaning is performed with ionized water.
S8, drying with hot wind for 10-15min at 55-70 deg.C.
The plating solution in S2 was a copper sulfate solution.
It is worth mentioning that before the plate is electroplated, the plate is directly pressed on the fixed plate 1 through the knob pressing block 4 without operations of oil removal cleaning, water washing, coarsening and pickling, then the electroplating hanger is lifted and placed into the electroplating bath, the working procedures are reduced, the distance is short, the air contact of the plate surface is reduced, the pollution of the plate surface is reduced, the plate surface is clean, the oil removal operation is not needed, and the plate surface is not easy to oxidize, even if a certain oxidation layer is arranged on the plate surface, the electroplating hanger with the electroplated part is placed into the electroplating bath for 1min-2min, the acid soaking removal of copper sulfate solution in the electroplating solution can be utilized, the removal efficiency of the oxidation layer is improved by matching with ventilation and stirring, divalent copper ions in the electroplating solution have a micro-rough effect on the surface of the plate surface, compared with the prior art, the electroplating hanger with a lower electric tank is provided, the lower end of the circuit board is contacted with the electroplating solution first, the invention firstly puts in and cleans the board surface and then electrifys the board surface, so that copper ions are reduced on the board surface, and the plating uniformity is better.
Install high pressure gas blow pipe 5 on fixed plate 1 in this embodiment, high pressure gas blow pipe 5 keeps inclining through high pressure gas blow pipe 5 towards between fixed plate 1 and the electrically conductive frame 2, clears up the liquid medicine in the gap between fixed plate 1 and the electrically conductive frame 2 to carry out next electroplating process.
The current wires 3 in this embodiment are provided with a plurality of equal lengths, and the current wires 3 are connected to the edge sides of the conductive frame 2 at uniform intervals around the conductive frame, which means that the current of the current wires 3 is the same, and when the conductive frame 2 is powered on, the current of each point is the same, and when the conductive frame contacts with the four side edges of the plate surface to perform copper plating operation, the uniformity of the formed plating layer is higher.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure is characterized in that: the electroplating hanger comprises a conductive frame and a fixed plate, wherein the side surface of the conductive frame is attached to the surface of the fixed plate, the conductive frame is connected with a current lead, and the fixed plate is provided with a plurality of knob pressing blocks arranged beside the conductive frame;
the circuit board electroplating process comprises the following steps:
s1, pre-treating the plate,
preprocessing a circuit board to be electroplated;
s2, preparing the electroplating solution,
preparing electroplating solution in an electroplating bath according to a corresponding proportion;
s3, hanging the plate surface,
fixing a plate to be electroplated on an electroplating hanger through a knob pressing block, and then hoisting the unpowered electroplating hanger by a crane and putting the unpowered electroplating hanger into an electroplating bath;
s4, soaking and standing the mixture,
under the condition that the conductive frame is not electrified, the board surface is soaked in the electroplating solution and stands for a certain time;
s5, electrifying to plate copper,
the current conducting wire is electrified to the conductive frame, the conductive frame and the four side edges of the board surface are electrified by equal current, and the board surface is plated with copper in the electroplating bath;
s6, taking the plate out of the box,
taking the electroplating hanger out of the electroplating bath, sequentially rotating the knob pressing block, and taking down the plate surface after the fixation is released;
s7, cleaning the glass fiber reinforced plastic pipe,
washing the board surface with pressure water directly to remove residual liquid medicine on the board surface;
s8, drying the board surface,
firstly, absorbing water on the board surface by using absorbent cotton, and then drying water stains on the board surface by using hot air;
s9, sending the board to the plate,
sending the film to a dry film process for pattern transfer;
s10, replacing the plating solution,
after the plating bath is plated with copper for a plurality of times, the plating bath is replaced and prepared with new plating solution.
2. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: in the step S4, the soaking time is controlled to be 1-2min, and the temperature of the electroplating solution is controlled to be 20-25 ℃.
3. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure as claimed in claim 2, wherein: in the step S4, the plating solution is aerated with flowing liquid and stirred while the circuit board is left standing in the plating tank.
4. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: and in the step S7, washing with ionized water.
5. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: and in the S8, the hot air drying time is 10-15min, and the drying temperature is 55-70 ℃.
6. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: the plating solution in S2 is a copper sulfate solution.
7. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: and the fixing plate is provided with a high-pressure air blowing pipe, and the high-pressure air blowing pipe faces between the fixing plate and the conductive frame.
8. A circuit board electroplating process of an electroplating hanger based on a cathode frame structure according to claim 1, wherein the electroplating process comprises the following steps: the current wires are provided with a plurality of equal lengths and are connected to the edge sides of the conductive frame at uniform intervals in a surrounding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210028789.6A CN114214713A (en) | 2022-01-11 | 2022-01-11 | Circuit board electroplating process of electroplating hanger based on cathode frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210028789.6A CN114214713A (en) | 2022-01-11 | 2022-01-11 | Circuit board electroplating process of electroplating hanger based on cathode frame structure |
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| Publication Number | Publication Date |
|---|---|
| CN114214713A true CN114214713A (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210028789.6A Pending CN114214713A (en) | 2022-01-11 | 2022-01-11 | Circuit board electroplating process of electroplating hanger based on cathode frame structure |
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| CN111826695A (en) * | 2020-08-04 | 2020-10-27 | 天水华洋电子科技股份有限公司 | Electroplating process for LED lead frame |
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2022
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| CN110402034A (en) * | 2019-07-29 | 2019-11-01 | 华芯电子(天津)有限责任公司 | A method of improving the equal property in PCB graphic plating face |
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