US20020072301A1 - Apparatus and method for detecting a work piece in an automatic processing apparatus - Google Patents

Apparatus and method for detecting a work piece in an automatic processing apparatus Download PDF

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Publication number
US20020072301A1
US20020072301A1 US09/962,412 US96241201A US2002072301A1 US 20020072301 A1 US20020072301 A1 US 20020072301A1 US 96241201 A US96241201 A US 96241201A US 2002072301 A1 US2002072301 A1 US 2002072301A1
Authority
US
United States
Prior art keywords
work piece
ultrasound
holder
ultrasound waves
intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/962,412
Other languages
English (en)
Inventor
Stephan Bradl
Olaf Heitzsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20020072301A1 publication Critical patent/US20020072301A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/006—Arrangements for observing, indicating or measuring on machine tools for indicating the presence of a work or tool in its holder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
US09/962,412 1999-03-24 2001-09-24 Apparatus and method for detecting a work piece in an automatic processing apparatus Abandoned US20020072301A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19913365A DE19913365C2 (de) 1999-03-24 1999-03-24 Verfahren und Vorrichtung zur Erkennung der Anwesenheit eines Wafers in einer automatischen Poliervorrichtung
DE19913365.4 1999-03-24
PCT/DE2000/000943 WO2000057251A1 (de) 1999-03-24 2000-03-24 Vorrichtung und verfahren zur detektion eines werkstückes in einer automatischen bearbeitungsvorrichtung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/000943 Continuation WO2000057251A1 (de) 1999-03-24 2000-03-24 Vorrichtung und verfahren zur detektion eines werkstückes in einer automatischen bearbeitungsvorrichtung

Publications (1)

Publication Number Publication Date
US20020072301A1 true US20020072301A1 (en) 2002-06-13

Family

ID=7902252

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/962,412 Abandoned US20020072301A1 (en) 1999-03-24 2001-09-24 Apparatus and method for detecting a work piece in an automatic processing apparatus

Country Status (8)

Country Link
US (1) US20020072301A1 (de)
EP (1) EP1169671B1 (de)
JP (1) JP3464459B2 (de)
KR (1) KR100438459B1 (de)
AT (1) ATE224071T1 (de)
DE (2) DE19913365C2 (de)
TW (1) TW467790B (de)
WO (1) WO2000057251A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004011327B3 (de) * 2004-03-09 2005-11-10 S-Y Systems Technologies Europe Gmbh Vorrichtung und Verfahren zum Bestimmen, ob ein Bauteil fehlt.
KR100711937B1 (ko) * 2005-07-28 2007-05-02 삼성전자주식회사 초음파를 이용한 기판 검사 방법 및 이를 수행하기 위한장치
DE102016116012A1 (de) * 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
DE102017118422B4 (de) * 2017-08-11 2020-12-31 Carl Zeiss Industrielle Messtechnik Gmbh Vorrichtung zur vermessung und / oder bearbeitung von werkstücken und verfahren zur erfassung von werkstücken in koordinatenmessgeräten oder bearbeitungsmaschinen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4562756A (en) * 1983-07-19 1986-01-07 Matsushita Electric Industrial Co., Ltd. Numerical control screw tightening machine
US5540098A (en) * 1993-02-16 1996-07-30 Tokyo Electron Limited Transfer device
US5823853A (en) * 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5967505A (en) * 1997-03-21 1999-10-19 Levi Strauss & Co. Automatic feeder and inverter for fabric workpieces

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4562756A (en) * 1983-07-19 1986-01-07 Matsushita Electric Industrial Co., Ltd. Numerical control screw tightening machine
US5540098A (en) * 1993-02-16 1996-07-30 Tokyo Electron Limited Transfer device
US5823853A (en) * 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source

Also Published As

Publication number Publication date
JP3464459B2 (ja) 2003-11-10
KR100438459B1 (ko) 2004-07-03
KR20010108385A (ko) 2001-12-07
DE50000500D1 (de) 2002-10-17
ATE224071T1 (de) 2002-09-15
EP1169671B1 (de) 2002-09-11
EP1169671A1 (de) 2002-01-09
WO2000057251A1 (de) 2000-09-28
TW467790B (en) 2001-12-11
DE19913365A1 (de) 2000-10-26
JP2002540409A (ja) 2002-11-26
DE19913365C2 (de) 2002-07-18

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STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE