US20020033247A1 - Use of PCMs in heat sinks for electronic components - Google Patents

Use of PCMs in heat sinks for electronic components Download PDF

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Publication number
US20020033247A1
US20020033247A1 US09/876,227 US87622701A US2002033247A1 US 20020033247 A1 US20020033247 A1 US 20020033247A1 US 87622701 A US87622701 A US 87622701A US 2002033247 A1 US2002033247 A1 US 2002033247A1
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United States
Prior art keywords
heat
phase change
change material
absorbing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/876,227
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English (en)
Inventor
Mark Neuschutz
Ralf Glausch
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Merck Patent GmbH
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Merck Patent GmbH
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Filing date
Publication date
Priority claimed from DE10114998A external-priority patent/DE10114998A1/de
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Assigned to MERCK PATENT GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG reassignment MERCK PATENT GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GLAUSCH, RALF, NEUSCHUETZ, MARK
Publication of US20020033247A1 publication Critical patent/US20020033247A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the present invention relates to the use of phase change materials in cooling devices for electrical and electronic components.
  • heat peaks or deficits often have to be avoided, i.e. temperature control must be provided. This is usually achieved using heat exchangers. In the simplest case, they may consist merely of a heat conduction plate, which dissipates the heat and releases it to the ambient air, or alternatively contain heat transfer media, which firstly transport the heat from one location or medium to another.
  • the convection at the cooling fins is almost always supported by fans.
  • Heat sinks of this type must always be designed for the most unfavorable case of high outside temperatures and full load of the component in order to avoid overheating, which would reduce the service life and reliability of the components.
  • the maximum working temperature for CPUs is between 60 and 90° C., depending on the design.
  • heat sinks In which the heat emitted by electronic components is absorbed in phase change materials, for example in the form of heat of melting, have been described (U.S. Pat. No. 4,673,030, EP 1 16503A, U.S. Pat. No. 4,446,916). These PCM heat sinks serve for short-term replacement of dissipation of the energy into the environment and cannot (and must not) be re-used.
  • Known storage media for the storage of sensible heat are, for example, water or stones/concrete or phase change materials (PCMs), such as salts, salt hydrates or mixtures thereof, or organic compounds (for example paraffin) for the storage of heat in the form of heat of melting (latent heat).
  • PCMs phase change materials
  • salts salt hydrates or mixtures thereof
  • organic compounds for example paraffin
  • the charging of a heat storage system basically requires a higher temperature than can be obtained during discharging, since a temperature difference is necessary for the transport/flow of heat.
  • the quality of the heat is dependent on the temperature at which it is available: the higher the temperature, the better the heat can be dissipated. For this reason, it is desirable for the temperature level during storage to drop as little as possible.
  • Latent heat storage therefore has the advantage over sensible heat storage that the temperature loss is restricted to the loss during heat transport from and to the storage system.
  • the storage media employed hitherto in latent heat storage systems are usually substances which have a solid-liquid phase transition in the temperature range which is essential for the use, i.e. substances which melt during use.
  • U.S. Pat. No. 5,728,316 recommends salt mixtures based on magnesium nitrate and lithium nitrate for the storage and utilization of thermal energy.
  • the heat storage here is carried out in the melt at above the melting point of 75° C.
  • phase change materials are solid-solid phase change materials. Since these substances remain solid during the entire use, there is no longer a requirement for encapsulation. Loss of the storage medium or contamination of the environment by the melt of the storage medium in latent heat storage systems can thus be excluded. This group of phase change materials is finding many new areas of application.
  • PCM heat sinks described above are not suitable for absorbing the peak output of components having an irregular output profile since they do not ensure optimized discharge of the PCM or also absorb the base load.
  • the present invention enables cooling electronic and electrical components effectively and absorbing temperature peaks.
  • the invention provides devices for cooling heat-generating electrical and electronic components having an irregular output profile, comprising a heat-conducting unit and a heat-absorbing unit which contains a phase change material (PCM).
  • PCM phase change material
  • This invention relates to devices for cooling electrical and electronic components (e.g., microprocessors in desktop and laptop computers both on the motherboard and on the graphics card, power-supply parts and other components which emit heat during operation) which have a non-uniform output profile.
  • electrical and electronic components e.g., microprocessors in desktop and laptop computers both on the motherboard and on the graphics card, power-supply parts and other components which emit heat during operation
  • Cooling devices are, for example, heat sinks.
  • Conventional heat sinks can be improved by the use of PCMs if the heat flow from the electronic component to the heat sink is not interrupted. An interruption in this sense exists if the PCM, owing to the design of the heat sink, firstly has to absorb the heat before the heat can be dissipated via the cooling fins—which results in an impairment of the performance of the heat sink for a given design.
  • PCMs in the manner according to the invention allows the use of heat sinks of lower capacity since extreme heat peaks do not have to be dissipated.
  • phase change materials are those whose phase change temperature T PC is suitably below the critical maximum temperature for the component.
  • PCMs are suitable. Suitable for use of the PCMs in a heat transfer medium are encapsulated materials or solid-solid PCMs which are insoluble in the heat transfer medium.
  • FIG. 1 represents a conventional heat sink.
  • FIGS. 2 - 5 represent various embodiments of the heat-dissipating devices according to the invention.
  • the PCM ( 4 ) is arranged in or on the heat sink ( 1 ) in such a way that significant heat flow from the CPU ( 2 ) on the support ( 3 ) to the PCM ( 4 ) only occurs if the heat sink exceeds the phase change temperature T PC of the PCM. It is thus ensured that the PCM only absorbs the output peaks.
  • PCMs are suitable for this application.
  • PCMs whose phase change temperature is between about ⁇ 100° C. and 150° C.
  • PCMs for use in electrical and electronic components, PCMs in the range of about 40° C. to 95° C. are preferred.
  • the materials can be selected from paraffins (C 20 -C 45 ), inorganic salts, salt hydrates and mixtures thereof, carboxylic acids and/or sugar alcohols. A non-limiting selection is shown in Table 1.
  • solid-solid PCMs such as diethylammonium chloride, dipropylammonium chloride, dibutylammonium chloride, dipentylammonium chloride, dihexylammonium chloride, dioctylammonium chloride, didecylammonium chloride, didodecylammonium chloride, dioctadecylammonium chloride, diethylammonium bromide, dipropylammonium bromide, dibutylammonium bromide, dipentylammonium bromide, dihexylammonium bromide, dioctylammonium bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dipropylammonium nitrate, dibutylam
  • Particularly suitable PCMs for use in electrical and electronic components are those whose T PC is between 40° C. and 95° C., such as, for example, didecylammonium chloride, didodecylammonium chloride, dioctadecylammonium chloride, diethylammonium bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dioctylammonium nitrate, didecylammonium nitrate and didodecylammonium nitrate.
  • didecylammonium chloride didodecylammonium chloride, dioctadecylammonium chloride, diethylammonium bromide, didecylammonium bromide, didodecylammonium bromide
  • the PCMs preferably comprise at least one auxiliary.
  • the at least one auxiliary is preferably a substance or composition having good thermal conductivity, in particular a metal powder, metal granules or graphite.
  • the heat storage material is preferably in the form of an intimate mixture with the auxiliary, the entire composition preferably being in the form of either a loose bed or moldings.
  • moldings here is taken to mean, in particular, all structures which can be produced by compaction methods, such as pelleting, tabletting, roll compaction or extrusion.
  • the moldings here can adopt a very wide variety of spatial shapes, such as, for example, spherical, cubic or cuboid shapes.
  • the mixtures or moldings described here may comprise paraffin as an additional auxiliary.
  • Paraffin is employed in particular if intimate contact between the heat storage composition and a component is to be established during use.
  • latent heat storage systems can be installed with a precise fit in this way for the cooling of electronic components.
  • the handling of, in particular, a molding described above is simple; the paraffin melts during use, expels air at the contact surfaces and so ensures close contact between the heat storage material and the component. Compositions of this type are therefore preferably used in devices for cooling electronic components.
  • binders preferably a polymeric binder
  • the crystallites of the heat storage material are preferably in finely divided form in the binder.
  • the preferably polymeric binders which may be present can be the polymers which are suitable as binder in accordance with the application.
  • the polymeric binder is preferably selected from curable polymers or polymer precursors, which in turn are preferably selected from the group consisting of polyurethanes, nitrile rubber, chloroprene, polyvinyl chloride, silicones, ethylene-vinyl acetate copolymers and polyacrylates.
  • nucleating agents such as, for example, borax or various metal oxides, are preferably employed in addition.
  • the heat transfer in the heat sink may also be implemented in the form of a heat pipe (for example U.S. Pat. No. 5,770,903 for motor cooling incl. PCM).
  • a heat sink with heat pipe (FIG. 3)
  • the interior of the heat sink ( 1 ) then has, for example, a cavity ( 6 ), which is partially filled with a liquid and/or gaseous medium.
  • the liquid/gaseous heat transfer medium ( 5 ) is selected from the group consisting of the halogenated hydrocarbons (for example ethyl bromide, trichloroethylene or freons) and their equivalents.
  • halogenated hydrocarbons for example ethyl bromide, trichloroethylene or freons
  • the cavity also contains PCM particles ( 4 ), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature T PC .
  • FIG. 4 A further possibility has been found through a mixed form (FIG. 4).
  • the CPU ( 2 ) is again mounted on a support ( 3 ).
  • cooling fins ( 7 ) are run through the cavity ( 6 ), which is in turn partially filled with a liquid/gaseous heat transfer medium ( 5 ). Continuous cooling fins are preferred.
  • the cavity besides the liquid/gaseous heat transfer medium, here too contains PCM particles ( 4 ), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature T PC .
  • the PCM can be compression molded into any desired shapes.
  • the material can be compression molded in pure form, compression molded after comminution (for example grinding), or compression molded in mixtures with other binders and/or auxiliaries.
  • the moldings can be stored, transported and employed in a variety of ways without problems.
  • the moldings can be inserted directly into electronic components (FIG. 5).
  • the CPU ( 2 ) is mounted on a support ( 3 ).
  • the moldings are installed between the cooling fins in such a way that they are in intimate contact with the surfaces of the cooling fins.
  • the thickness of the moldings is selected so that a frictional connection is formed between the fins and the molding.
  • the moldings can also be inserted between cooling fins/heat exchangers before the latter are connected to form a stack.
  • Cooling ribs 2 Central processing unit (CPU) 3 Support 4 Phase change material (PCM) 5 Liquid/gaseous heat exchange medium 6 Cavity 7 Cooling fins in cavity Z Entire component
  • a heat sink as shown in FIG. 2 is designed for a processor whose maximum operating temperature is 75° C.
  • a phase change material having a T PC of between 60° C. and 65° C. is selected in the cavities in the heat sink.
  • Sodium hydroxide monohydrate having a T PC of 64° C. is used.
  • a heat sink as shown in FIG. 3 is designed for a processor having a maximum operating temperature of 75° C.
  • the cavities of the heat sink contain trichloroethylene as heat transfer fluid.
  • the PCM used is an encapsulated paraffin. Nonacosane, which has a T PC of 63° C., is used. However, solid-solid PCMs are also suitable as phase change material here. Didoceylammonium nitrate is suitable for this processor as it has a T PC of 66° C.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
US09/876,227 2000-06-08 2001-06-08 Use of PCMs in heat sinks for electronic components Abandoned US20020033247A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10027803.5 2000-06-08
DE10027803 2000-06-08
DE10114998.0 2001-03-26
DE10114998A DE10114998A1 (de) 2000-06-08 2001-03-26 Einsatz von PCM in Kühlern für elektronische Batterie

Publications (1)

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US20020033247A1 true US20020033247A1 (en) 2002-03-21

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US09/876,227 Abandoned US20020033247A1 (en) 2000-06-08 2001-06-08 Use of PCMs in heat sinks for electronic components

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US (1) US20020033247A1 (ja)
EP (1) EP1162659A3 (ja)
JP (1) JP2002057262A (ja)
CN (1) CN1329361A (ja)
CA (1) CA2349870A1 (ja)
TW (1) TW533455B (ja)

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