US20050269063A1 - Heat pipe having a wick structure containing phase change materials - Google Patents

Heat pipe having a wick structure containing phase change materials Download PDF

Info

Publication number
US20050269063A1
US20050269063A1 US10/882,980 US88298004A US2005269063A1 US 20050269063 A1 US20050269063 A1 US 20050269063A1 US 88298004 A US88298004 A US 88298004A US 2005269063 A1 US2005269063 A1 US 2005269063A1
Authority
US
United States
Prior art keywords
heat
particles
wick
micro
phase change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/882,980
Inventor
Jon Zuo
Donald Ernst
Original Assignee
Jon Zuo
Ernst Donald M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US10/370,349 priority Critical patent/US6889755B2/en
Application filed by Jon Zuo, Ernst Donald M filed Critical Jon Zuo
Priority to US10/882,980 priority patent/US20050269063A1/en
Publication of US20050269063A1 publication Critical patent/US20050269063A1/en
Application status is Abandoned legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/023Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage
    • Y02E60/14Thermal storage
    • Y02E60/145Latent heat storage

Abstract

A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

Description

    FIELD OF THE INVENTION
  • The present invention relates to heat pipes for heat dissipation, and more particularly, to heat pipes having a wick structure comprised of micro-encapsulated phase change materials.
  • BACKGROUND OF THE INVENTION
  • Heat pipes are highly efficient devices for transferring large quantities of heat from a heat source to an area where the heat can be dissipated. A heat pipe generally consists of a vacuum tight envelope, a wick structure and a working fluid. The heat pipe is evacuated and then back-filled with a small quantity of working fluid, typically just enough to saturate the wick. The atmosphere inside the heat pipe is set by an equilibrium of liquid and vapor. As heat enters at the evaporator, this equilibrium is upset generating vapor at a slightly higher pressure. This higher pressure vapor travels to the condenser end where the slightly lower temperatures cause the vapor to condense giving up its latent heat of vaporization. The condensed fluid is then pumped back to the evaporator by the capillary forces developed in the wick structure. This continuous cycle transfers large quantities of heat with very low thermal gradients. A heat pipe's operation is passive being driven only by the heat that is transferred.
  • Heat pipes are currently used for a variety of applications including lasers, nuclear energy, dehumidification and air conditioning, thermal control in spacecrafts, cooling of electronics systems and cryogenics. Heat pipes can be designed to operate over a broad range of temperatures from cryogenic applications (<−243° C.) to high temperature applications (>2000° C.). The material for the heat pipe container, wick structure and working fluid are selected based on the application for which the heat pipe will be used.
  • Heat pipes are generally designed to perform within a particular operating temperature range, which is dependent on the application. When operating within this range, a heat pipe will provide highly reliable heat transfer for years. However, operation outside of this range causes degradation or even failure. Such a limitation is a disadvantage in applications where there may be peak loads which can cause a sudden temperature rise outside of the operating range of the heat pipe. Not only can this cause failure of the heat pipe, but also may cause damage to the system which is being cooled.
  • Temperature control devices using phase change materials (PCMs) have been employed in a variety of temperature stabilization applications including automotive, electronics and clothing applications. Often, PCMs, e.g., wax, are encapsulated in a durable, thermally conductive shell. PCMs provide a temperature load-leveling capability via the latent heat effect. PCMs store or release heat as they change phase between a liquid and solid state or, in the case of solid-solid PCMs, as they undergo reversible crystal structure transitions. The relatively high thermal capacity of PCMs make them advantageous for temperature control in high heat generating systems and for systems prone to transient peak loads. Electronics systems are one such system where PCMs may be particularly advantageous.
  • The increasing miniaturization of electronic components has made heat transfer a critical design concern as these systems create very high heat fluxes. In order for electronic devices to perform correctly and reliably, suitable operating temperatures must be maintained and temperature variations must be minimized. Due to the increasingly high heat generated from these systems, and their proneness for transient peak loads, common heat transfer technologies such as heat sinks, cold plates, direct impingement cooling systems and conventional heat pipes are approaching their heat transfer limits.
  • The use of PCMs in heat transfer devices is known in the art. For example, in U.S. Pat. No. 5,224,356 to Colvin et al., a method is disclosed whereby a plurality of microcapsules in the form of a powder are placed in contact with an object to be cooled. The microcapsules have a shell and contain an enhanced thermal energy absorbing material. The absorbing material may be a phase change material.
  • U.S. Pat. No. 5,007,478 to Sengupta, discloses a heat sink device adjacent to an article to be thermally controlled. The heat sink defines a chamber which contains a slurry of micro-encapsulated PCMs.
  • U.S. Pat. No. 5,831,831 to Freeland, discloses a bonding material/phase change material system for electronic device heat burst dissipation. The system comprises a phase change material disposed on a substrate and encircled by a bonding material. An electronic device having a heatspreader portion is positioned atop the phase change material and bonding material.
  • U.S. Pat. No. 5,555,932 to Dudley, discloses a heat shield for an automotive vehicle. The heat shield utilizes a phase change material to absorb excess heat generated by a heat source within the vehicle. The heat shield insulates a component adjacent to the heat source and prevents the transmission of heat to the component.
  • U.S. Pat. No. 4,911,232 to Colvin et al., discloses a method of obtaining enhanced heat transfer in a closed loop thermodynamic system. The system includes a two-component heat transfer fluid comprising a carrier fluid and a plurality of discrete reversible latent energy transition material particles. The fluid slurry is circulated about the loop and the loop is tuned so that a minimum temperature differential exists between the thermal source and sink in order to maximize the latent heat transport by adjustment of the heat transfer fluid flow rate, the rate of thermal energy input into the heat transfer fluid and the rate of cooling of heat transfer fluid. This method has the disadvantage of needing an outside energy source to pump the heat transferring slurry.
  • The above disclosures all relate to thermal regulating systems wherein the PCMs are contained within a structure which is substantially completely adjacent to the heat source. Thus, the PCMs release the absorbed heat, as well as absorb the heat, at a location proximate the heat source. They lack the advantage of having the heat released at a location distant from the heat source.
  • SUMMARY OF THE INVENTION
  • The present invention provides a wick for use in a heat pipe comprising particles comprising micro-encapsulated phase change materials (PCMs). The particles are bonded together to form a wick structure for the heat pipe. The micro-encapsulated PCM particles may be of uniform or varying sizes and may be bonded together using different techniques including sintering or gluing.
  • The present invention also provides a heat transfer device comprising a heat pipe which includes an envelope, a working fluid and a wick formed from micro-encapsulated PCM particles. The heat transfer device may also include a heat sink. The heat sink may have micro-encapsulated PCM particles attached to an outside surface of the heat sink or, alternatively, have micro-encapsulated PCM particles contained within the heat sink.
  • According to another aspect of the invention, the heat transfer device may include a first heat pipe and a second heat pipe having an envelope, a working fluid and a wick formed from or comprising micro-encapsulated PCM particles. The first heat pipe may be a conventional heat pipe or may have a wick comprised of micro-encapsulated PCM particles. The heat transfer device may further include a heat sink.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • These and other features and advantages of the present invention will be more fully disclosed in, or rendered obvious by, the following detailed description of the preferred embodiments of the invention, which are to be considered together with the accompanying drawings wherein like numbers refer to like parts and further wherein:
  • FIG. 1 is a perspective view, partially in cross-section, of a heat pipe formed according to the present invention;
  • FIG. 2 is a transverse cross-sectional view of a micro-encapsulated phase change material particle;
  • FIG. 3 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention;
  • FIG. 4 is a longitudinal cross-sectional view of a first heat pipe and secondary heat pipe formed according to one embodiment of the present invention;
  • FIG. 5 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention; and
  • FIG. 6 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus viscosities, high surface tension and acceptable freezing or pour point. Preferably, the quantity of working fluid 120 in heat transfer device 10 should be just enough to saturate wick 130.
  • In one embodiment, wick 130 comprises a plurality of micro-encapsulated PCM particles 132 (FIGS. 2 and 3-6). Micro-encapsulated PCM particles 132 have an outer shell wall 134 surrounding a phase change material 136. Shell 134 may be formed from materials that are suitable for heat transfer applications of the type known to those in the art, e.g., metals such as, silver, gold, copper, aluminum, titanium or their alloys. Polymeric materials useful in this invention include any material useful in the electronics industry for heat transfer applications, including, without limitation, thermoplastics (crystalline or non-crystalline, cross-linked or non-cross-linked), thermosetting resins, elastomers or blends or composites thereof.
  • Illustrative examples of useful thermoplastic polymers include, without limitation, polyolefins, such as polyethylene or polypropylene, copolymers (including terpolymers, etc.) of olefins such as ethylene and propylene, with each other and with other monomers such as vinyl esters, acids or esters of unsaturated organic acids or mixtures thereof, halogenated vinyl or vinylidene polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride and copolymers of these monomers with each other or with other unsaturated monomers, polyesters, such as poly(hexamethylene adipate or sebacate), poly(ethylene terephthalate) and poly(tetramethylene terephthalate), polyamides such as Nylon-6, Nylon-6,6, Nylon-6,10, Versamids, polystyrene, polyacrylonitrile, thermoplastic silicone resins, thermoplastic polyethers, thermoplastic modified cellulose, polysulphones and the like.
  • Examples of some useful elastomeric resins include, without limitation, rubbers, elastomeric gums and thermoplastic elastomers. The term “elastomeric gum”, refers to polymers which are noncrystalline and which exhibit after cross-linking rubbery or elastomeric characteristics. The term “thermoplastic elastomer” refers to materials which exhibit, in various temperature ranges, at least some elastomer properties. Such materials generally contain thermoplastic and elastomeric moieties. For purposes of this invention, the elastomer resin can be cross-linked or non cross-linked when used in the inventive compositions.
  • Illustrative examples of some suitable elastomeric gums for use in this invention include, without limitation, polyisoprene (both natural and synthetic), ethylene-propylene random copolymers, poly(isobutylene), styrene-butadiene random copolymer rubbers, styrene-acrylonitrile-butadiene terpolymer rubbers with and without added copolymerized amounts of unsaturated carboxylic acids, polyacrylate rubbers, polyurethane gums, random copolymers of vinylidene fluoride and, for example, hexafluoropropylene, polychloroprene, chlorinated polyethylene, chlorosulphonated polyethylene, polyethers, plasticized poly(vinyl chloride), substantially non-crystalline random co- or ter-polymers of ethylene with vinyl esters or acids and esters of unsaturated acids, silicone gums and base polymers, for example, poly(dimethyl siloxane), poly(methylphenyl siloxane) and poly(dimethyl vinyl siloxanes).
  • Some illustrative examples of thermoplastic elastomers suitable for use in the invention include, without limitation, graft and block copolymers, such as random copolymers of ethylene and propylene grafted with polyethylene or polypropylene side chains, and block copolymers of—olefins such as polyethylene or polypropylene with ethylene/propylene or ethylene/propylene/diene rubbers, polystyrene with polybutadiene, polystyrene with polyisoprene, polystyrene with ethylene-propylene rubber, poly(vinylcyclohexane) with ethylene-propylene rubber, poly(-methylstyrene) with polysiloxanes, polycarbonates with polysiloxanes, poly(tetramethylene terephthalate) with poly(tetramethylene oxide) and thermoplastic polyurethane rubbers.
  • Examples of some thermosetting resins useful herein include, without limitation, epoxy resins, such as resins made from epichlorohydrin and bisphenol A or epichlorohydrin and aliphatic polyols, such as glycerol, and which can be conventionally cured using amine or amide curing agents. Other examples include phenolic resins obtained by condensing a phenol with an aldehyde, e.g., phenol-formaldehyde resin. Other additives can also be present in the composition, including for example fillers, pigments, antioxidants, fire retardants, cross-linking agents, adjuvants and the like.
  • Shell 134 will possess a melting point that is substantially higher than the melting point of PCM 136, and higher than the expected temperature of the heat generating source. Thus, selection of the shell material will be dependent upon the application. Shell 134 should also be resilient so as to withstand cyclic expansions and contractions of PCM 136. The thickness of shell 134 may vary depending upon the material used.
  • PCM 136 may comprise a variety of materials depending on the application and the operating temperature range. Suitable materials include, without limitation, organic waxes and paraffins, inorganic multi-phase metal alloys, eutectic salts, and other materials known in the art. Selection and quantity of PCM 136 will depend upon the desired PCM melting point and how much heat will need to be absorbed. PCM 136 may also be a blend of different compounds to obtain the desired phase transition temperature or range. Also, different types of PCMs may be used in a single wick structure to increase the temperature range over which the heat pipe will be effective.
  • In addition to the liquid-solid PCMs listed, solid-solid PCMs, such as, polymer crystals, may also be used in connection with the present invention. Solid-solid PCMs undergo reversible solid-state crystal structure transitions at temperatures ranging from ambient up to about 100° C. Various of the polumer materials identified herein above are suitable for this application. Transition temperatures can be selected by forming solid solutions of different organic compounds. In one embodiment of the invention, a solid-solid PCM is employed without the use of shell 134. Transition of these solid-solid PCMs can occur over a fairly limited temperature range.
  • PCMs 136 can be encapsulated by any means known to those in the art. Such methods include coacervation, interfacial polymerization, air suspension and centrifugal extrusion. The size of particles 132 may be fairly uniform or, may be variable as desired. Preferably, the size ranges for particles 132 vary from about one micron to about one mm. The size of particles 132 will dictate the size of pores 138 between the particles (See FIG. 3). Pore size often determines the maximum capilliary pumping pressure of the wick and also effects wick permeability. Thus, a wick comprising particles having different sizes can be utilized depending upon the application of the heat pipe and its required orientation. PCM particles 132 are very often spherical in shape, but also may be cylindrically shaped, or may be elongated particles, cubes, monofilaments or fibers.
  • Referring to FIG. 3, micro-encapsulated PCM particles 132 are bonded together to form a wick structure 130. The method by which micro-encapsulated PCM particles 132 are bonded will depend on the composition of shell 134. Where shells 134 comprise a metal, the particles are preferably sintered together. Where shells 134 comprise a polymer material, the particles are preferably adhered together by means of an adhesive or binder. Other methods known to those skilled in the art may also be employed.
  • Wick 130 formed from a plurality of micro-encapsulated PCM particles 132 functions in much the same way as a conventional heat pipe wick structure, i.e., capillary pressure is employed to pump working fluid from a condenser portion of the heat pipe to an evaporator portion. However, use of a wick structure comprising micro-encapsulated PCM particles has the added advantage of using the wick structure as an additional heat absorber and repository. This feature greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak loads. Also, micro-encapsulated PCM particles may be incorporated into a conventional screen mesh type wick structure. In addition, PCM particles may also be bonded to a pre-sintered metal powder wick structure.
  • Heat transfer device 10 also may include a heat sink 200 that is mounted to a portion of envelope 110 of heat pipe 100 for further dissipating the absorbed thermal energy. Heat sink 200 may be in the form of folded of stamped fins 210, as shown in FIG. 3, or may take any other shape or form known to those skilled in the art.
  • Wick 130 may be formed separately from envelope 120, and then placed in the envelope 110 where it lines an inner surface 112 of envelope 110 just as with a conventional wick. Alternatively, PCM particles 132 may be formed into a wick in situ. Envelope 110 is then evacuated and back-filled with a small quantity of working fluid 120, preferably just enough to wet the wick 130. Heat pipe 100 is then hermetrically sealed. Fins 210 may be attached to heat pipe 100 to act as a heat sink 200 for further dissipation of heat.
  • Referring to FIG. 4, another embodiment of heat transfer device 10 comprises a first heat pipe 300, a second heat pipe 400 and a heat sink 200. First heat pipe 300 may be a conventional heat pipe, i.e., containing a wick structure previously known and used in the art such as sintered powdered metal, screen meshes, grooved tube, or cable/fibers. Alternatively, first heat pipe 300 may be a heat pipe as described above, containing a wick 330 comprising micro-encapsulated PCM particles 332.
  • Second heat pipe 400 comprises an envelope 410, a working fluid (not shown) and a wick 430 comprising micro-encapsulated PCM particles 432, wherein wick structure 430 preferably essentially fills the entire volume of heat pipe 400. Preferably, wick structure 430 is made from small and large encapsulated PCM particles 432 (as shown in FIG. 4) so as to have small and large pore sizes in between the individual particles 432. The pores may range from 10−3 mm to 2 mm more or less. The large pores facilitate transport of the vapor, while the small pores provide capillary action for the heat pipe working fluid. Preferably, the working fluid will not entirely fill up the voids between the micro-encapsulated PCM particles 432. A heat sink 200 may also be attached to first heat pipe 300, such as fins 210 as shown in FIG. 4.
  • Referring to FIG. 5, another embodiment of heat transfer device 10 comprises a heat pipe 100 and a heat sink 200. Heat pipe 100 may be a conventional heat pipe containing a traditional wick, or may have a wick structure comprising micro-encapsulated PCM particles 232 as described above, and as shown in FIG. 5. Heat sink 200 (shown as fins 210 in FIG. 5) includes micro-encapsulated PCM particles 232 attached to the outside surface 212 of heat sink 200. PCM particles 232 enhance the heat absorption capacity of the heat sink. In an alternative embodiment (FIG. 6) heat sink, 200 comprises a hollow material and contains micro-encapsulated PCM particles 232 within it.
  • It is to be understood that the present invention is by no means limited only to the particular constructions herein disclosed and shown in the drawings, but also comprises any modifications or equivalents within the scope of the claims.

Claims (16)

1. A wick for use in a heat pipe, including a plurality of particles wherein said particles comprise micro-encapsulated phase change materials.
2. The wick of claim 1 wherein said particles of micro encapsulated phase change material are of varying sizes.
3. The wick of claim 1 wherein said particles are adhered to one another.
4. The wick of claim 1 wherein said particles are sintered.
5. A heat pipe comprising:
an envelope;
a wick including particles comprising micro-encapsulated phase change materials secured within said envelope; and
a working fluid disposed within said envelope.
6. A heat transfer device comprising:
a heat pipe having an envelope, a working fluid and a wick comprising micro-encapsulated phase change particles bonded together to form said wick; and
a heat sink mounted to said heat pipe.
7. The heat transfer device of claim 6 wherein said heat sink includes particles of micro-encapsulated phase change material attached to an outside surface of said heat sink.
8. The heat transfer device of claim 6 wherein said heat sink includes particles of micro-encapsulated phase change material contained within said heat sink.
9-13. (canceled)
14. A heat transfer device comprising:
a heat pipe comprising an envelope, a wick secured within the envelope, and a working fluid; and
a heat sink adjacent to said heat pipe, said heat sink including particles of micro-encapsulated phase change material.
15. The heat transfer device of claim 14 wherein said particles of micro-encapsulated phase change material are attached to an outside surface of said heat sink.
16. The heat transfer device of claim 14 wherein said heat sink is hollow and further wherein said particles of micro-encapsulated phase change material are contained within said heat sink.
17. A wick for use in a heat pipe formed from a plurality of micro-encapsulated phase change particles.
18. The wick of claim 17 wherein said particles of micro-encapsulated phase change particles are of varying sizes.
19. The wick of claim 17 wherein said particles are adhered to one another.
20. The wick of claim 17 wherein said particles are sintered.
US10/882,980 2003-02-18 2004-07-01 Heat pipe having a wick structure containing phase change materials Abandoned US20050269063A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/370,349 US6889755B2 (en) 2003-02-18 2003-02-18 Heat pipe having a wick structure containing phase change materials
US10/882,980 US20050269063A1 (en) 2003-02-18 2004-07-01 Heat pipe having a wick structure containing phase change materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/882,980 US20050269063A1 (en) 2003-02-18 2004-07-01 Heat pipe having a wick structure containing phase change materials

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/370,349 Continuation US6889755B2 (en) 2003-02-18 2003-02-18 Heat pipe having a wick structure containing phase change materials

Publications (1)

Publication Number Publication Date
US20050269063A1 true US20050269063A1 (en) 2005-12-08

Family

ID=32850417

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/370,349 Expired - Fee Related US6889755B2 (en) 2003-02-18 2003-02-18 Heat pipe having a wick structure containing phase change materials
US10/882,980 Abandoned US20050269063A1 (en) 2003-02-18 2004-07-01 Heat pipe having a wick structure containing phase change materials

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/370,349 Expired - Fee Related US6889755B2 (en) 2003-02-18 2003-02-18 Heat pipe having a wick structure containing phase change materials

Country Status (1)

Country Link
US (2) US6889755B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008118417A1 (en) * 2007-03-27 2008-10-02 Dk Innovations Inc. Heat- removal device
US20100294467A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
WO2011025487A1 (en) * 2009-08-27 2011-03-03 Hewlett-Packard Development Company, L.P. Heat storage by phase-change material
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
US20130327501A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device
US20150060017A1 (en) * 2013-09-05 2015-03-05 National Central University Cooling apparatus using solid-liquid phase change material
US20150204612A1 (en) * 2014-01-21 2015-07-23 Drexel University Systems and Methods of Using Phase Change Material in Power Plants

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078269A (en) * 2001-09-04 2003-03-14 Hitachi Ltd Electronic apparatus
DE10157671A1 (en) * 2001-11-24 2003-06-05 Merck Patent Gmbh Optimized use of PCM in cooling devices
JP2005268658A (en) * 2004-03-19 2005-09-29 Denso Corp Boiling cooler
CN100413061C (en) * 2004-06-07 2008-08-20 鸿富锦精密工业(深圳)有限公司 Thermal tube and producing method thereof
US20050284614A1 (en) * 2004-06-22 2005-12-29 Machiroutu Sridhar V Apparatus for reducing evaporator resistance in a heat pipe
US7713849B2 (en) * 2004-08-20 2010-05-11 Illuminex Corporation Metallic nanowire arrays and methods for making and using same
TWI275770B (en) * 2004-12-24 2007-03-11 Foxconn Tech Co Ltd Heat dissipation device with heat pipes
US8109324B2 (en) * 2005-04-14 2012-02-07 Illinois Institute Of Technology Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
JP4928749B2 (en) * 2005-06-30 2012-05-09 株式会社東芝 Cooling system
US20070032610A1 (en) * 2005-08-08 2007-02-08 General Electric Company Energy responsive composition and associated method
WO2007035295A1 (en) * 2005-09-16 2007-03-29 University Of Cincinnati Silicon mems based two-phase heat transfer device
US7548421B2 (en) * 2005-10-25 2009-06-16 Hewlett-Packard Development Company, L.P. Impingement cooling of components in an electronic system
US20070151709A1 (en) * 2005-12-30 2007-07-05 Touzov Igor V Heat pipes utilizing load bearing wicks
CN100529640C (en) * 2006-04-14 2009-08-19 富准精密工业(深圳)有限公司 Heat pipe
US20070268668A1 (en) * 2006-05-19 2007-11-22 I-Ming Lin Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
FR2903222B1 (en) * 2006-06-28 2008-12-26 Eads Astrium Sas Soc Par Actio Passive thermal control arrangement based on diphasic fluid loop with capillary pumping with thermal capacity.
US7433190B2 (en) * 2006-10-06 2008-10-07 Honeywell International Inc. Liquid cooled electronic chassis having a plurality of phase change material reservoirs
US8073096B2 (en) * 2007-05-14 2011-12-06 Stc.Unm Methods and apparatuses for removal and transport of thermal energy
US9188086B2 (en) * 2008-01-07 2015-11-17 Mcalister Technologies, Llc Coupled thermochemical reactors and engines, and associated systems and methods
US7810965B2 (en) * 2008-03-02 2010-10-12 Lumenetix, Inc. Heat removal system and method for light emitting diode lighting apparatus
US9102857B2 (en) * 2008-03-02 2015-08-11 Lumenetix, Inc. Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
EP2318779A2 (en) * 2008-07-10 2011-05-11 Infinia Corporation Thermal energy storage device
US8188595B2 (en) 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
TWM362513U (en) * 2009-01-22 2009-08-01 Yeh Chiang Technology Corp Packaging structure for LED
US7969075B2 (en) * 2009-02-10 2011-06-28 Lumenetix, Inc. Thermal storage system using encapsulated phase change materials in LED lamps
US20110203776A1 (en) * 2009-02-17 2011-08-25 Mcalister Technologies, Llc Thermal transfer device and associated systems and methods
TWI372596B (en) * 2009-03-19 2012-09-11 Acbel Polytech Inc
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
CN101900503A (en) * 2009-05-27 2010-12-01 富瑞精密组件(昆山)有限公司 Heat pipe
US8123389B2 (en) * 2010-02-12 2012-02-28 Lumenetix, Inc. LED lamp assembly with thermal management system
US8441361B2 (en) 2010-02-13 2013-05-14 Mcallister Technologies, Llc Methods and apparatuses for detection of properties of fluid conveyance systems
TWI415305B (en) * 2010-05-25 2013-11-11 Neobulb Technologies Inc Led illumination device
US8953314B1 (en) * 2010-08-09 2015-02-10 Georgia Tech Research Corporation Passive heat sink for dynamic thermal management of hot spots
TWI498074B (en) * 2010-09-23 2015-08-21 Foxconn Tech Co Ltd Heat dissipation apparatus for portable consumer electronic device
US20110081134A1 (en) * 2010-12-15 2011-04-07 Salyer Ival O Water heating unit with integral thermal energy storage
US20110083827A1 (en) * 2010-12-15 2011-04-14 Salyer Ival O Cooling system with integral thermal energy storage
US20110083459A1 (en) * 2010-12-15 2011-04-14 Salyer Ival O Heat exchanger with integral phase change material for heating and cooling applications
US9071098B2 (en) * 2011-03-29 2015-06-30 Asia Vital Components Co., Ltd. Centrifugal heat dissipation device and motor using same
TWI506405B (en) * 2011-03-29 2015-11-01
CN102723810A (en) * 2011-03-29 2012-10-10 奇鋐科技股份有限公司 Centrifugal type heat radiation structure and motor equipped with centrifugal type heat radiation structure
GB201110569D0 (en) * 2011-06-22 2011-08-03 Wellstream Int Ltd Method and apparatus for maintaining a minimum temperature in a fluid
GB2493387A (en) * 2011-08-04 2013-02-06 Isis Innovation Thermal buffer unit comprising a heat pipe having a thermal store contained therein
US9039327B2 (en) 2011-08-12 2015-05-26 Mcalister Technologies, Llc Systems and methods for collecting and processing permafrost gases, and for cooling permafrost
US8671870B2 (en) 2011-08-12 2014-03-18 Mcalister Technologies, Llc Systems and methods for extracting and processing gases from submerged sources
WO2013025650A1 (en) 2011-08-12 2013-02-21 Mcalister Technologies, Llc Mobile transport platforms for producing hydrogen and structural materials and associated systems and methods
US8734546B2 (en) 2011-08-12 2014-05-27 Mcalister Technologies, Llc Geothermal energization of a non-combustion chemical reactor and associated systems and methods
WO2013025655A2 (en) 2011-08-12 2013-02-21 Mcalister Technologies, Llc Systems and methods for providing supplemental aqueous thermal energy
WO2013025659A1 (en) 2011-08-12 2013-02-21 Mcalister Technologies, Llc Reducing and/or harvesting drag energy from transport vehicles, includings for chemical reactors, and associated systems and methods
US8911703B2 (en) 2011-08-12 2014-12-16 Mcalister Technologies, Llc Reducing and/or harvesting drag energy from transport vehicles, including for chemical reactors, and associated systems and methods
US8694065B2 (en) * 2011-09-23 2014-04-08 General Electric Company Cryogenic cooling system with wicking structure
US9223138B2 (en) 2011-12-23 2015-12-29 Microsoft Technology Licensing, Llc Pixel opacity for augmented reality
US9606586B2 (en) 2012-01-23 2017-03-28 Microsoft Technology Licensing, Llc Heat transfer device
US8934235B2 (en) * 2012-01-23 2015-01-13 Microsoft Corporation Heat transfer device with phase change material
US9726887B2 (en) 2012-02-15 2017-08-08 Microsoft Technology Licensing, Llc Imaging structure color conversion
US9779643B2 (en) 2012-02-15 2017-10-03 Microsoft Technology Licensing, Llc Imaging structure emitter configurations
US9297996B2 (en) 2012-02-15 2016-03-29 Microsoft Technology Licensing, Llc Laser illumination scanning
US9599408B1 (en) * 2012-03-03 2017-03-21 Advanced Cooling Technologies, Inc. Loop heat pipe evaporator including a second heat pipe
US9578318B2 (en) 2012-03-14 2017-02-21 Microsoft Technology Licensing, Llc Imaging structure emitter calibration
US9205515B2 (en) * 2012-03-22 2015-12-08 Shenzhen China Star Optoelectronics Technology Co., Ltd. Heat dissipation substrate and method for manufacturing the same
US9558590B2 (en) 2012-03-28 2017-01-31 Microsoft Technology Licensing, Llc Augmented reality light guide display
US10191515B2 (en) 2012-03-28 2019-01-29 Microsoft Technology Licensing, Llc Mobile device light guide display
US9717981B2 (en) 2012-04-05 2017-08-01 Microsoft Technology Licensing, Llc Augmented reality and physical games
US10502876B2 (en) 2012-05-22 2019-12-10 Microsoft Technology Licensing, Llc Waveguide optics focus elements
US8989535B2 (en) 2012-06-04 2015-03-24 Microsoft Technology Licensing, Llc Multiple waveguide imaging structure
US9311909B2 (en) 2012-09-28 2016-04-12 Microsoft Technology Licensing, Llc Sensed sound level based fan speed adjustment
US10192358B2 (en) 2012-12-20 2019-01-29 Microsoft Technology Licensing, Llc Auto-stereoscopic augmented reality display
US8926719B2 (en) 2013-03-14 2015-01-06 Mcalister Technologies, Llc Method and apparatus for generating hydrogen from metal
US10356945B2 (en) * 2015-01-08 2019-07-16 General Electric Company System and method for thermal management using vapor chamber
US9304235B2 (en) 2014-07-30 2016-04-05 Microsoft Technology Licensing, Llc Microfabrication
US10254942B2 (en) 2014-07-31 2019-04-09 Microsoft Technology Licensing, Llc Adaptive sizing and positioning of application windows
JP5788069B1 (en) * 2014-08-29 2015-09-30 古河電気工業株式会社 Flat type heat pipe
US9827209B2 (en) 2015-02-09 2017-11-28 Microsoft Technology Licensing, Llc Display system
US9429692B1 (en) 2015-02-09 2016-08-30 Microsoft Technology Licensing, Llc Optical components
US9372347B1 (en) 2015-02-09 2016-06-21 Microsoft Technology Licensing, Llc Display system
US10317677B2 (en) 2015-02-09 2019-06-11 Microsoft Technology Licensing, Llc Display system
US9423360B1 (en) 2015-02-09 2016-08-23 Microsoft Technology Licensing, Llc Optical components
US9535253B2 (en) 2015-02-09 2017-01-03 Microsoft Technology Licensing, Llc Display system
US9513480B2 (en) 2015-02-09 2016-12-06 Microsoft Technology Licensing, Llc Waveguide
US10018844B2 (en) 2015-02-09 2018-07-10 Microsoft Technology Licensing, Llc Wearable image display system
US9909448B2 (en) 2015-04-15 2018-03-06 General Electric Company Gas turbine engine component with integrated heat pipe
US10386127B2 (en) 2015-09-09 2019-08-20 General Electric Company Thermal management system
US9897393B2 (en) * 2016-05-27 2018-02-20 Asia Vital Components Co., Ltd. Heat dissipating module
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US10575393B1 (en) * 2018-11-13 2020-02-25 International Business Machines Corporation Heat-shielding microcapsules for protecting temperature sensitive components

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596713A (en) * 1969-01-27 1971-08-03 Astro Dynamics Inc Liquid-solid heat transport system
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US3788388A (en) * 1971-02-19 1974-01-29 Q Dot Corp Heat exchange system
US4046190A (en) * 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4489777A (en) * 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
US4756958A (en) * 1987-08-31 1988-07-12 Triangle Research And Development Corporation Fiber with reversible enhanced thermal storage properties and fabrics made therefrom
US4819719A (en) * 1987-01-20 1989-04-11 Mcdonnell Douglas Corporation Enhanced evaporator surface
US4830097A (en) * 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
US4911232A (en) * 1988-07-21 1990-03-27 Triangle Research And Development Corporation Method of using a PCM slurry to enhance heat transfer in liquids
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US5053446A (en) * 1985-11-22 1991-10-01 University Of Dayton Polyolefin composites containing a phase change material
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US5224356A (en) * 1991-09-30 1993-07-06 Triangle Research & Development Corp. Method of using thermal energy absorbing and conducting potting materials
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US5446318A (en) * 1992-09-08 1995-08-29 Hitachi, Ltd. Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
US5456852A (en) * 1992-02-28 1995-10-10 Mitsubishi Paper Mills Limited Microcapsule for heat-storing material
US5555932A (en) * 1993-04-02 1996-09-17 Ford Motor Company Heat shield for an automotive vehicle
US5621615A (en) * 1995-03-31 1997-04-15 Hewlett-Packard Company Low cost, high thermal performance package for flip chips with low mechanical stress on chip
US5662161A (en) * 1995-08-10 1997-09-02 The United States Of America As Represented By The Secretary Of The Navy Breathing gas cooling and heating device
US5767573A (en) * 1995-10-26 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US5826645A (en) * 1997-04-23 1998-10-27 Thermal Corp. Integrated circuit heat sink with rotatable heat pipe
US5831831A (en) * 1997-03-27 1998-11-03 Ford Motor Company Bonding material and phase change material system for heat burst dissipation
US5883426A (en) * 1996-04-18 1999-03-16 Nec Corporation Stack module
US5986884A (en) * 1998-07-13 1999-11-16 Ford Motor Company Method for cooling electronic components
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6139783A (en) * 1999-02-12 2000-10-31 Chip Coolers, Inc. Method of molding a thermally conductive article
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
US6310775B1 (en) * 1999-03-24 2001-10-30 Mitsubishi Materials Corporation Power module substrate
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
US20020033247A1 (en) * 2000-06-08 2002-03-21 Merck Patent Gmbh Use of PCMs in heat sinks for electronic components
US6381845B2 (en) * 1998-10-21 2002-05-07 Furakawa Electric Co., Ltd. Method of manufacturing plate type heat pipe
US6387482B1 (en) * 1996-10-25 2002-05-14 Vought Aircraft Industries, Inc. Heat absorbing surface coating
US6550530B1 (en) * 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766028B2 (en) 1989-12-26 1995-07-19 安藤電気株式会社 Cooling structure of the test Ic tester head

Patent Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596713A (en) * 1969-01-27 1971-08-03 Astro Dynamics Inc Liquid-solid heat transport system
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3788388A (en) * 1971-02-19 1974-01-29 Q Dot Corp Heat exchange system
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US4046190A (en) * 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4489777A (en) * 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
US5053446A (en) * 1985-11-22 1991-10-01 University Of Dayton Polyolefin composites containing a phase change material
US4819719A (en) * 1987-01-20 1989-04-11 Mcdonnell Douglas Corporation Enhanced evaporator surface
US4830097A (en) * 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
US4756958A (en) * 1987-08-31 1988-07-12 Triangle Research And Development Corporation Fiber with reversible enhanced thermal storage properties and fabrics made therefrom
US4911232A (en) * 1988-07-21 1990-03-27 Triangle Research And Development Corporation Method of using a PCM slurry to enhance heat transfer in liquids
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US5224356A (en) * 1991-09-30 1993-07-06 Triangle Research & Development Corp. Method of using thermal energy absorbing and conducting potting materials
US5456852A (en) * 1992-02-28 1995-10-10 Mitsubishi Paper Mills Limited Microcapsule for heat-storing material
US5446318A (en) * 1992-09-08 1995-08-29 Hitachi, Ltd. Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5555932A (en) * 1993-04-02 1996-09-17 Ford Motor Company Heat shield for an automotive vehicle
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
US5621615A (en) * 1995-03-31 1997-04-15 Hewlett-Packard Company Low cost, high thermal performance package for flip chips with low mechanical stress on chip
US5662161A (en) * 1995-08-10 1997-09-02 The United States Of America As Represented By The Secretary Of The Navy Breathing gas cooling and heating device
US5767573A (en) * 1995-10-26 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5947193A (en) * 1996-01-29 1999-09-07 Sandia Corporation Heat pipe with embedded wick structure
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US5883426A (en) * 1996-04-18 1999-03-16 Nec Corporation Stack module
US6387482B1 (en) * 1996-10-25 2002-05-14 Vought Aircraft Industries, Inc. Heat absorbing surface coating
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5831831A (en) * 1997-03-27 1998-11-03 Ford Motor Company Bonding material and phase change material system for heat burst dissipation
US5826645A (en) * 1997-04-23 1998-10-27 Thermal Corp. Integrated circuit heat sink with rotatable heat pipe
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US5986884A (en) * 1998-07-13 1999-11-16 Ford Motor Company Method for cooling electronic components
US6381845B2 (en) * 1998-10-21 2002-05-07 Furakawa Electric Co., Ltd. Method of manufacturing plate type heat pipe
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6139783A (en) * 1999-02-12 2000-10-31 Chip Coolers, Inc. Method of molding a thermally conductive article
US6310775B1 (en) * 1999-03-24 2001-10-30 Mitsubishi Materials Corporation Power module substrate
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
US20020033247A1 (en) * 2000-06-08 2002-03-21 Merck Patent Gmbh Use of PCMs in heat sinks for electronic components
US6550530B1 (en) * 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008118417A1 (en) * 2007-03-27 2008-10-02 Dk Innovations Inc. Heat- removal device
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
US20100294467A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
WO2011025487A1 (en) * 2009-08-27 2011-03-03 Hewlett-Packard Development Company, L.P. Heat storage by phase-change material
US9019704B2 (en) 2009-08-27 2015-04-28 Hewlett-Packard Development Company, L.P. Heat storage by phase-change material
US20130327501A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device
US20150060017A1 (en) * 2013-09-05 2015-03-05 National Central University Cooling apparatus using solid-liquid phase change material
US20150204612A1 (en) * 2014-01-21 2015-07-23 Drexel University Systems and Methods of Using Phase Change Material in Power Plants
US9476648B2 (en) * 2014-01-21 2016-10-25 Drexel University Systems and methods of using phase change material in power plants

Also Published As

Publication number Publication date
US6889755B2 (en) 2005-05-10
US20040159422A1 (en) 2004-08-19

Similar Documents

Publication Publication Date Title
KR102023228B1 (en) Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US9423192B2 (en) Heat spreading device and method with sectioning forming multiple chambers
US7484553B2 (en) Heat pipe incorporating outer and inner pipes
US7730605B2 (en) Method of fabricating heat dissipating apparatus
US20160190037A1 (en) Heat spreader with high heat flux and high thermal conductivity
US7732918B2 (en) Vapor chamber heat sink having a carbon nanotube fluid interface
US7846778B2 (en) Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7013958B2 (en) Sintered grooved wick with particle web
CN1213476C (en) Electronic device having fibrous interface
CN100447991C (en) Cooling device of thin plate type for preventing dry-out
US7369410B2 (en) Apparatuses for dissipating heat from semiconductor devices
US5523260A (en) Method for heatsinking a controlled collapse chip connection device
KR0159980B1 (en) Heat-pipe type cooling apparatus
US6793009B1 (en) CTE-matched heat pipe
JP2012119725A (en) Systems and methods for thermal management of electronic components
US9273910B2 (en) Fluid circuit heat transfer device for plural heat sources
US7225860B2 (en) Compact heat battery
CN1304807C (en) Cooling device, electronic device and method of manufacturing cooling device
TWI235906B (en) Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same
US7392836B2 (en) Flat-plate heat pipe containing channels
EP0006445B1 (en) Methods of fabricating electrical apparatus comprising one or more heat generating electrical components
US20140368992A1 (en) Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
EP2495760A2 (en) Thermal spreader with phase change thermal capacitor for electrical cooling
US6675872B2 (en) Heat energy dissipation device for a flywheel energy storage system (FESS), an FESS with such a dissipation device and methods for dissipating heat energy
EP1264343B1 (en) Apparatus and method for passive phase change thermal management

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION