CA2349870A1 - Use of pcms in heat sinks for electronic components - Google Patents
Use of pcms in heat sinks for electronic components Download PDFInfo
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- CA2349870A1 CA2349870A1 CA002349870A CA2349870A CA2349870A1 CA 2349870 A1 CA2349870 A1 CA 2349870A1 CA 002349870 A CA002349870 A CA 002349870A CA 2349870 A CA2349870 A CA 2349870A CA 2349870 A1 CA2349870 A1 CA 2349870A1
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- pcm
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- cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to the use of phase change materials in devices for cooling electrical and electronic components.
Description
2001 IOOB262.doc I/20 Use of PCMs in heat sinks for electronic components The present invention relates to the use of phase change materials in cooling devices for electrical and electronic components.
In industrial processes, heat peaks or deficits often have to be avoided, i.e.
temperature control must be provided. This is usually achieved using heat exchangers. In the simplest case, they may consist merely of a heat conduction plate, which dissipates the heat and releases it to the ambient air, or alternatively contain heat transfer media, which firstly transport the heat from one location or medium to another.
The state of the art (Figure 1 ) for the cooling of electronic components, such as, for example, microprocessors (central processing units = CPUs) (2), are heat sinks made from extruded aluminium, which absorb the heat from the electronic component, which is mounted on support (3), and release it to the environment via cooling fins (1 ). The convection at the cooling fins is almost always supported by fans.
Heat sinks of this type must always be designed for the most unfavourable case of high outside temperatures and full load of the component in order to avoid overheating, which would reduce the service life and reliability of the components. The maximum working temperature for CPUs is between 60 and 90°C, depending on the design.
As the clock speed of CPUs becomes ever faster, the amount of heat they emit jumps with each new generation. While hitherto peak outputs of a maximum of 30 watts had to be dissipated, it is expected that in the next 8 to 12 months cooling capacities of up to 90 watts will be necessary. These outputs can no longer be dissipated using conventional cooling systems.
For extreme ambient conditions, as occur, for example, in remote-controlled missiles, heat sinks, in which the heat emitted by electronic components is absorbed in phase change materials, for example in the form of heat of melting, have been described (US 4673030A, EP 116503A, US 4446916A). These PCM heat sinks serve for short-term replacement of dissipation of the energy into the environment and cannot (and must not) be re-used.
2001 100B262.doc 2/20 Known storage media are, for example, water or stones/concrete for the storage of sensible heat or phase change materials (PCMs), such as salts, salt hydrates or mixtures thereof, or organic compounds (for example paraffin) for the storage of heat in the form of heat of melting (latent heat).
It is known that when a substance melts, i.e. is converted from the solid phase into the liquid phase, heat is consumed, i.e. absorbed, and is stored as latent heat so long as the substance remains in the liquid state, and that this latent heat is liberated again on solidification, i.e. on conversion from the liquid phase into the solid phase.
The charging of a heat storage system basically requires a higher temper-ature than can be obtained during discharging, since a temperature difference is necessary for the transport/flow of heat. The quality of the heat is dependent on the temperature at which it is available: the higher the temperature, the better the heat can be dissipated. For this reason, it is desirable for the temperature level during storage to drop as little as possible.
In the case of storage of sensible heat (for example by heating water), the input of heat is associated with constant heating of the storage material (and the opposite during discharging), while latent heat is stored and discharged at the melting point of the PCM. Latent heat storage therefore has the advantage over sensible heat storage that the temperature loss is restricted to the loss during heat transport from and to the storage system.
The storage media employed hitherto in latent heat storage systems are usually substances which have a solid-liquid phase transition in the tem-perature range which is essential for the use, i.e. substances which melt during use.
Thus, the literature discloses the use of paraffins as storage medium in latent heat storage systems. International patent application WO 93/15625 describes shoe soles which contain PCM-containing microcapsules. The PCMs proposed here are either paraffins or crystalline 2,2-dimethyl-1,3-propanediol or 2-hydroxymethyl-2-methyl-1,3-propanediol. The application Wp 83/24241 describes fabrics having a coating comprising microcap-sules of this type and binders. Preference is given here to paraffinic ?001 100B262.doc 3/20 CA 02349870 2001-06-06 hydrocarbons having from 13 to 28 carbon atoms. European Patent EP-B-306 202 describes fibres having heat-storage properties in which the storage medium is a paraffinic hydrocarbon or a crystalline plastic, and the storage material is integrated into the basic fibre material in the form of microcapsules.
US Patent 5,728,316 recommends salt mixtures based on magnesium nitrate and lithium nitrate for the storage and utilisation of thermal energy.
The heat storage here is carried out in the melt at above the melting point of 75°C.
In the said storage media in latent heat storage systems, a transition into the liquid state takes place during use. This is accompanied by problems in the case of industrial use of storage media in latent heat storage sys-tems since sealing or encapsulation is always necessary in order to pre-vent leakage of liquid resulting in loss of substance or contamination of the environment. Especially in the case of use in or on flexible structures, such as, for example, fibres, fabrics or foams, this generally requires micro-encapsulation of the heat storage materials.
In addition, the vapour pressure of many potentially suitable compounds increases greatly during melting, and consequently the volatility of the melts often stands in the way of long-term use of the storage materials. On industrial use of melting PCMs, problems frequently arise due to considerable volume changes during melting of many substances.
A new area of phase change materials is therefore provided with a particu-lar focus. These are solid-solid phase change materials. Since these sub-stances remain solid during the entire use, there is no longer a require-ment for encapsulation. Loss of the storage medium or contamination of the environment by the melt of the storage medium in latent heat storage systems can thus be excluded. This group of phase change materials is finding many new areas of application.
US 5831831 A, J P 10135381 A and SU 570131 A describe the use of similar PCM heat sinks in non-military applications. A common feature of the inventions is the omission of conventional heat sinks (for example with cooling fins and fans).
24)01 IOOD262.doC 4/20 CA 02349870 2001-06-06 The PCM heat sinks described above are not suitable for absorbing the peak output of components having an irregular output profile since they do not ensure optimised discharge of the PCM or also absorb the base load.
The object is to cool electronic and electrical components effectively and to absorb temperature peaks.
The object is achieved by devices for cooling heat-generating electrical and electronic components having an irregular output profile, essentially consisting of a heat-conducting unit and a heat-absorbing unit which contains a phase change material (PCM).
This invention relates to devices for cooling electrical and electronic components (microprocessors in desktop and laptop computers both on the motherboard and on the graphics card, power-supply parts and other components which emit heat during operation) which have a non-uniform output profile.
Cooling devices are, for example, heat sinks. Conventional heat sinks can be improved by the use of PCMs if the heat flow from the electronic com-ponent to the heat sink is not interrupted. An interruption in this sense exists if the PCM, owing to the design of the heat sink, firstly has to absorb the heat before the heat can be dissipated via the cooling fins - which results in an impairment of the performance of the heat sink for a given design.
There are various ways of ensuring that the PCM only absorbs the output peaks.
Electrical and electronic components are usually cooled using heat sinks (Figure 1 ) having cooling fins.
It has been found that it is advantageous to arrange the PCM in or on the heat sink in such a way that a significant heat flow to the PCM only occurs if the heat sink exceeds the phase change temperature TPC of the PCM
(Figure 2, Figure 3, Figure 4 and Figure 5).
It has been found that on reaching this temperature, the cooling capacity of the cooling fins is supplemented by the heat absorption by the PCM. This 2001 IOOB262.doc 5/20 CA 02349870 2001-06-06 causes a jump in the efficiency of the heat sink. It is thus achieved that the electrical or electronic component is not overheated.
The use of PCMs in the manner according to the invention allows the use of heat sinks of lower capacity since extreme heat peaks do not have to be dissipated.
It has been found that particularly suitable phase change materials are those whose phase change temperature TP~ is suitably below the critical maximum temperature for the component.
Depending on the desired maximum temperature, all known PCMs are suitable. Suitable for use of the PCMs in a heat transfer medium are encapsulated materials or solid-solid PCMs which are insoluble in the heat transfer medium.
A general example of the invention is explained in greater detail below.
The devices according to the invention are described with reference to an example of the cooling of CPUs (central processing units) for computers.
In the device according to the invention (Figure 2), the PCM (4) is arranged in or on the heat sink (1 ) in such a way that significant heat flow from the CPU (2) on the support (3) to the PCM (4) only occurs if the heat sink exceeds the phase change temperature TP~ of the PCM. It is thus ensured that the PCM only absorbs the output peaks.
Various PCMs are available for this application. It is possible to use PCMs whose phase change temperature is between -100°C and 150°C. For use in electrical and electronic components, PCMs in the range from 40°C to 95°C are preferred. In this case, the materials can be selected from the group consisting of the paraffins (C2o-C45), inorganic salts, salt hydrates and mixtures thereof, carboxylic acids and sugar alcohols. A selection is shown in Table 1.
2001 IOOB2G2.doc 6/20 Material Melting pointMelting Group C~ enthal J/
Heneicosane 40 213 Paraffins Docosane 44 252 Paraffins Tricosane 48 234 Paraffins Sodium thiosulfate48 210 Salt hydrates entah drate M ristic acid 52 190 Carbox lic acids Tetracosane 53 255 Paraffins Hexacosane 56 250 Paraffins Sodium acetate 58 265 Salt hydrates trih drate Nonacosane 63 239 Paraffins Sodium hydroxide64 272 Salt hydrates monoh drate Stearic acid 69 200 Carbox lic acids Mixture of lithium75 180 Salt hydrates nitrate and magnesium nitrate hexah drate Trisodium 75 216 Salt hydrates phosphate dodecah drate Magnesium nitrate89 160 Salt hydrates hexah drate X litol 93-95 270 Su ar alcohols Table 1 Also suitable are solid-solid PCMs selected from the group consisting of diethylammonium chloride, dipropylammonium chloride, dibutylammonium chloride, dipentylammonium chloride, dihexylammonium chloride, dioctyl-ammonium chloride, didecylammonium chloride, didodecylammonium chloride, dioctadecylammonium chloride, diethylammonium bromide, dipropylammonium bromide, dibutylammonium bromide, dipentyl-ammonium bromide, dihexylammonium bromide, dioctylammonium 30 bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dipropyl-ammonium nitrate, dibutylammonium nitrate, dipentylammonium nitrate, dihexylammonium nitrate, dioctylammonium nitrate, didecylammonium nitrate, dioctylammonium chlorate, dioctylammonium acetate, dioctyl-35 ammonium formate, didecylammonium chlorate, didecylammonium acetate, didecylammonium formate, didodecylammonium chlorate, 2001 1008262.doc 7/20 CA 02349870 2001-06-06 -didodecylammonium formate, didodecylammonium hydrogensulfate, didodecylammonium propionate, dibutylammonium 2-nitrobenzoate, diundecylammonium nitrate and didodecylammonium nitrate.
Particularly suitable PCMs for use in electrical and electronic components are those whose TPC is between 40°C and 95°C, such as, for example, didecylammonium chloride, didodecylammonium chloride, dioctadecyl-ammonium chloride, diethylammonium bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dioctylammonium nitrate, didecylammonium nitrate and didodecylammonium nitrate.
Besides the actual heat storage material, the PCMs preferably comprise at least one auxiliary. The at least one auxiliary is preferably a substance or composition having good thermal conductivity, in particular a metal pow-der, metal granules or graphite. The heat storage material is preferably in the form of an intimate mixture with the auxiliary, the entire composition preferably being in the form of either a loose bed or mouldings. The term mouldings here is taken to mean, in particular, all structures which can be produced by compaction methods, such as pelleting, tabletting, roll com-paction or extrusion. The mouldings here can adopt a very wide variety of spatial shapes, such as, for example, spherical, cubic or cuboid shapes. In addition, the mixtures or mouldings described here may comprise paraffin as an additional auxiliary. Paraffin is employed in particular if intimate contact between the heat storage composition and a component is to be established during use. For example, latent heat storage systems can be installed with a precise fit in this way for the cooling of electronic compo-nents. During installation of the heat storage system, the handling of, in particular, a moulding described above is simple; the paraffin melts during use, expels air at the contact surfaces and so ensures close contact between the heat storage material and the component. Compositions of this type are therefore preferably used in devices for cooling electronic components.
In addition, binders, preferably a polymeric binder, may be present as auxiliaries. In this case, the crystallites of the heat storage material are preferably in finely divided form in the binder. The preferably polymeric OOl 100B262.doc 8/20 CA 02349870 2001-06-06 binders which may be present can be the polymers which are suitable as binder in accordance with the application. The polymeric binder is prefer-ably selected from curable polymers or polymer precursors, which in turn are preferably selected from the group consisting of polyurethanes, nitrite rubber, chloroprene, polyvinyl chloride, silicones, ethylene-vinyl acetate copolymers and polyacrylates. The suitable methods for incorporation of the heat storage materials into these polymeric binders are well known to the person skilled in the art in this area. He has no difficulties in finding, where appropriate, the requisite additives, such as, for example, emulsi-fiers, which stabilise a mixture of this type.
For liquid-solid PCMs, nucleating agents, such as, for example, borax or various metal oxides, are preferably employed in addition.
Besides ensuring good heat transfer through metals (aluminium, copper, etc.) or other heat conduction structures (metal powders, graphite, etc.), the heat transfer in the heat sink may also be implemented in the form of a heat pipe (for example US 5770903A for motor cooling incl. PCM).
In a heat sink with heat pipe (Figure 3), the interior of the heat sink (1 ) then has, for example, a cavity (6), which is partially filled with a liquid and/or gaseous medium. The liquid/gaseous heat transfer medium (5) is selected from the group consisting of the halogenated hydrocarbons (for example ethyl bromide, trichloroethylene or freons) and their equivalents. The design of a heat pipe and the choice of a suitable medium presents no problems to the person skilled in the art.
Besides this medium, the cavity also contains PCM particles (4), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature TP~.
It has been found that encapsulated or microencapsulated PCMs and solid-solid PCMs which are insoluble in the medium are particularly suitable. All known PCMs can be used.
Surprisingly, it has been found that, due to the good mixing of the PCM/
medium suspension, the dynamics of the heat sink are particularly great.
'_001 100B2G2.doc 9/20 CA 02349870 2001-06-06 A further possibility has been found through a mixed form (Figure 4). The CPU (2) is again mounted on a support (3). In order to improve the heat conduction, cooling fins (7) are run through the cavity (6), which is in turn partially filled with a liquid/gaseous heat transfer medium (5). Continuous cooling fins are preferred. As in the previous variants, the cavity, besides the liquid/gaseous heat transfer medium, here too contains PCM particles (4), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature TPC.
The PCM can be compression moulded into any desired shapes. The material can be compression moulded in pure form, compression moulded after comminution (for example grinding), or compression moulded in mixtures with other binders and/or auxiliaries. The mouldings can be stored, transported and employed in a variety of ways without problems.
For example, the mouldings can be inserted directly into electronic components (Figure 5). Here too, the CPU (2) is mounted on a support (3).
The mouldings are installed between the cooling fins in such a way that they are in intimate contact with the surfaces of the cooling fins. The thickness of the mouldings is selected so that a frictional connection is formed between the fins and the moulding. The mouldings can also be inserted between cooling fins/heat exchangers before the latter are connected to form a stack.
However, these types of cooling with the aid of PCMs for absorbing heat peaks are not restricted to use in computers. These systems can be used in power switches and power circuits for mobile communications, trans-mission circuits for mobile telephones and fixed transmitters, control circuits for electromechanical actuators in industrial electronics and in motor vehicles, high-frequency circuits for satellite communications and radar applications, single-board computers, and for actuators and control units for domestic appliances and industrial electronics.
These cooling devices can be applied to all applications in which heat peaks are to be absorbed (for example motors for elevators, in electrical substations and in internal-combustion engines).
2001 IOOA262.doc 10/20 CA 02349870 2001-06-06 Symbol Explanation 1 Cooling ribs 2 Central processing unit (CPU) 3 Support 4 Phase change material (PCM) 5 Liquid/gaseous heat exchange medium 6 Cavity ~ Cooling fins in cavity Z Entire component Table 2: Explanation of the symbols in the figures Examples Example 1 A heat sink as shown in Figure 2 is designed for a processor whose maximum operating temperature is 75°C. A phase change material having a TP~ of between 60°C and 65°C is selected in the cavities in the heat sink.
Sodium hydroxide monohydrate having a TP~ of 64°C was used here.
Example 2 A heat sink as shown in Figure 3 is designed for a processor having a maximum operating temperature of 75°C. The cavities of the heat sink contain trichloroethylene as heat transfer fluid. The PCM used is an encapsulated paraffin. Nonacosane, which has a TPC of 63°C, is used.
2001 100B262.doc 11/20 CA 02349870 2001-06-06 However, solid-solid PCMs are also suitable as phase change material here. Didoceylammonium nitrate is suitable for this processor as it has a TP~ of 66°C.
In industrial processes, heat peaks or deficits often have to be avoided, i.e.
temperature control must be provided. This is usually achieved using heat exchangers. In the simplest case, they may consist merely of a heat conduction plate, which dissipates the heat and releases it to the ambient air, or alternatively contain heat transfer media, which firstly transport the heat from one location or medium to another.
The state of the art (Figure 1 ) for the cooling of electronic components, such as, for example, microprocessors (central processing units = CPUs) (2), are heat sinks made from extruded aluminium, which absorb the heat from the electronic component, which is mounted on support (3), and release it to the environment via cooling fins (1 ). The convection at the cooling fins is almost always supported by fans.
Heat sinks of this type must always be designed for the most unfavourable case of high outside temperatures and full load of the component in order to avoid overheating, which would reduce the service life and reliability of the components. The maximum working temperature for CPUs is between 60 and 90°C, depending on the design.
As the clock speed of CPUs becomes ever faster, the amount of heat they emit jumps with each new generation. While hitherto peak outputs of a maximum of 30 watts had to be dissipated, it is expected that in the next 8 to 12 months cooling capacities of up to 90 watts will be necessary. These outputs can no longer be dissipated using conventional cooling systems.
For extreme ambient conditions, as occur, for example, in remote-controlled missiles, heat sinks, in which the heat emitted by electronic components is absorbed in phase change materials, for example in the form of heat of melting, have been described (US 4673030A, EP 116503A, US 4446916A). These PCM heat sinks serve for short-term replacement of dissipation of the energy into the environment and cannot (and must not) be re-used.
2001 100B262.doc 2/20 Known storage media are, for example, water or stones/concrete for the storage of sensible heat or phase change materials (PCMs), such as salts, salt hydrates or mixtures thereof, or organic compounds (for example paraffin) for the storage of heat in the form of heat of melting (latent heat).
It is known that when a substance melts, i.e. is converted from the solid phase into the liquid phase, heat is consumed, i.e. absorbed, and is stored as latent heat so long as the substance remains in the liquid state, and that this latent heat is liberated again on solidification, i.e. on conversion from the liquid phase into the solid phase.
The charging of a heat storage system basically requires a higher temper-ature than can be obtained during discharging, since a temperature difference is necessary for the transport/flow of heat. The quality of the heat is dependent on the temperature at which it is available: the higher the temperature, the better the heat can be dissipated. For this reason, it is desirable for the temperature level during storage to drop as little as possible.
In the case of storage of sensible heat (for example by heating water), the input of heat is associated with constant heating of the storage material (and the opposite during discharging), while latent heat is stored and discharged at the melting point of the PCM. Latent heat storage therefore has the advantage over sensible heat storage that the temperature loss is restricted to the loss during heat transport from and to the storage system.
The storage media employed hitherto in latent heat storage systems are usually substances which have a solid-liquid phase transition in the tem-perature range which is essential for the use, i.e. substances which melt during use.
Thus, the literature discloses the use of paraffins as storage medium in latent heat storage systems. International patent application WO 93/15625 describes shoe soles which contain PCM-containing microcapsules. The PCMs proposed here are either paraffins or crystalline 2,2-dimethyl-1,3-propanediol or 2-hydroxymethyl-2-methyl-1,3-propanediol. The application Wp 83/24241 describes fabrics having a coating comprising microcap-sules of this type and binders. Preference is given here to paraffinic ?001 100B262.doc 3/20 CA 02349870 2001-06-06 hydrocarbons having from 13 to 28 carbon atoms. European Patent EP-B-306 202 describes fibres having heat-storage properties in which the storage medium is a paraffinic hydrocarbon or a crystalline plastic, and the storage material is integrated into the basic fibre material in the form of microcapsules.
US Patent 5,728,316 recommends salt mixtures based on magnesium nitrate and lithium nitrate for the storage and utilisation of thermal energy.
The heat storage here is carried out in the melt at above the melting point of 75°C.
In the said storage media in latent heat storage systems, a transition into the liquid state takes place during use. This is accompanied by problems in the case of industrial use of storage media in latent heat storage sys-tems since sealing or encapsulation is always necessary in order to pre-vent leakage of liquid resulting in loss of substance or contamination of the environment. Especially in the case of use in or on flexible structures, such as, for example, fibres, fabrics or foams, this generally requires micro-encapsulation of the heat storage materials.
In addition, the vapour pressure of many potentially suitable compounds increases greatly during melting, and consequently the volatility of the melts often stands in the way of long-term use of the storage materials. On industrial use of melting PCMs, problems frequently arise due to considerable volume changes during melting of many substances.
A new area of phase change materials is therefore provided with a particu-lar focus. These are solid-solid phase change materials. Since these sub-stances remain solid during the entire use, there is no longer a require-ment for encapsulation. Loss of the storage medium or contamination of the environment by the melt of the storage medium in latent heat storage systems can thus be excluded. This group of phase change materials is finding many new areas of application.
US 5831831 A, J P 10135381 A and SU 570131 A describe the use of similar PCM heat sinks in non-military applications. A common feature of the inventions is the omission of conventional heat sinks (for example with cooling fins and fans).
24)01 IOOD262.doC 4/20 CA 02349870 2001-06-06 The PCM heat sinks described above are not suitable for absorbing the peak output of components having an irregular output profile since they do not ensure optimised discharge of the PCM or also absorb the base load.
The object is to cool electronic and electrical components effectively and to absorb temperature peaks.
The object is achieved by devices for cooling heat-generating electrical and electronic components having an irregular output profile, essentially consisting of a heat-conducting unit and a heat-absorbing unit which contains a phase change material (PCM).
This invention relates to devices for cooling electrical and electronic components (microprocessors in desktop and laptop computers both on the motherboard and on the graphics card, power-supply parts and other components which emit heat during operation) which have a non-uniform output profile.
Cooling devices are, for example, heat sinks. Conventional heat sinks can be improved by the use of PCMs if the heat flow from the electronic com-ponent to the heat sink is not interrupted. An interruption in this sense exists if the PCM, owing to the design of the heat sink, firstly has to absorb the heat before the heat can be dissipated via the cooling fins - which results in an impairment of the performance of the heat sink for a given design.
There are various ways of ensuring that the PCM only absorbs the output peaks.
Electrical and electronic components are usually cooled using heat sinks (Figure 1 ) having cooling fins.
It has been found that it is advantageous to arrange the PCM in or on the heat sink in such a way that a significant heat flow to the PCM only occurs if the heat sink exceeds the phase change temperature TPC of the PCM
(Figure 2, Figure 3, Figure 4 and Figure 5).
It has been found that on reaching this temperature, the cooling capacity of the cooling fins is supplemented by the heat absorption by the PCM. This 2001 IOOB262.doc 5/20 CA 02349870 2001-06-06 causes a jump in the efficiency of the heat sink. It is thus achieved that the electrical or electronic component is not overheated.
The use of PCMs in the manner according to the invention allows the use of heat sinks of lower capacity since extreme heat peaks do not have to be dissipated.
It has been found that particularly suitable phase change materials are those whose phase change temperature TP~ is suitably below the critical maximum temperature for the component.
Depending on the desired maximum temperature, all known PCMs are suitable. Suitable for use of the PCMs in a heat transfer medium are encapsulated materials or solid-solid PCMs which are insoluble in the heat transfer medium.
A general example of the invention is explained in greater detail below.
The devices according to the invention are described with reference to an example of the cooling of CPUs (central processing units) for computers.
In the device according to the invention (Figure 2), the PCM (4) is arranged in or on the heat sink (1 ) in such a way that significant heat flow from the CPU (2) on the support (3) to the PCM (4) only occurs if the heat sink exceeds the phase change temperature TP~ of the PCM. It is thus ensured that the PCM only absorbs the output peaks.
Various PCMs are available for this application. It is possible to use PCMs whose phase change temperature is between -100°C and 150°C. For use in electrical and electronic components, PCMs in the range from 40°C to 95°C are preferred. In this case, the materials can be selected from the group consisting of the paraffins (C2o-C45), inorganic salts, salt hydrates and mixtures thereof, carboxylic acids and sugar alcohols. A selection is shown in Table 1.
2001 IOOB2G2.doc 6/20 Material Melting pointMelting Group C~ enthal J/
Heneicosane 40 213 Paraffins Docosane 44 252 Paraffins Tricosane 48 234 Paraffins Sodium thiosulfate48 210 Salt hydrates entah drate M ristic acid 52 190 Carbox lic acids Tetracosane 53 255 Paraffins Hexacosane 56 250 Paraffins Sodium acetate 58 265 Salt hydrates trih drate Nonacosane 63 239 Paraffins Sodium hydroxide64 272 Salt hydrates monoh drate Stearic acid 69 200 Carbox lic acids Mixture of lithium75 180 Salt hydrates nitrate and magnesium nitrate hexah drate Trisodium 75 216 Salt hydrates phosphate dodecah drate Magnesium nitrate89 160 Salt hydrates hexah drate X litol 93-95 270 Su ar alcohols Table 1 Also suitable are solid-solid PCMs selected from the group consisting of diethylammonium chloride, dipropylammonium chloride, dibutylammonium chloride, dipentylammonium chloride, dihexylammonium chloride, dioctyl-ammonium chloride, didecylammonium chloride, didodecylammonium chloride, dioctadecylammonium chloride, diethylammonium bromide, dipropylammonium bromide, dibutylammonium bromide, dipentyl-ammonium bromide, dihexylammonium bromide, dioctylammonium 30 bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dipropyl-ammonium nitrate, dibutylammonium nitrate, dipentylammonium nitrate, dihexylammonium nitrate, dioctylammonium nitrate, didecylammonium nitrate, dioctylammonium chlorate, dioctylammonium acetate, dioctyl-35 ammonium formate, didecylammonium chlorate, didecylammonium acetate, didecylammonium formate, didodecylammonium chlorate, 2001 1008262.doc 7/20 CA 02349870 2001-06-06 -didodecylammonium formate, didodecylammonium hydrogensulfate, didodecylammonium propionate, dibutylammonium 2-nitrobenzoate, diundecylammonium nitrate and didodecylammonium nitrate.
Particularly suitable PCMs for use in electrical and electronic components are those whose TPC is between 40°C and 95°C, such as, for example, didecylammonium chloride, didodecylammonium chloride, dioctadecyl-ammonium chloride, diethylammonium bromide, didecylammonium bromide, didodecylammonium bromide, dioctadecylammonium bromide, diethylammonium nitrate, dioctylammonium nitrate, didecylammonium nitrate and didodecylammonium nitrate.
Besides the actual heat storage material, the PCMs preferably comprise at least one auxiliary. The at least one auxiliary is preferably a substance or composition having good thermal conductivity, in particular a metal pow-der, metal granules or graphite. The heat storage material is preferably in the form of an intimate mixture with the auxiliary, the entire composition preferably being in the form of either a loose bed or mouldings. The term mouldings here is taken to mean, in particular, all structures which can be produced by compaction methods, such as pelleting, tabletting, roll com-paction or extrusion. The mouldings here can adopt a very wide variety of spatial shapes, such as, for example, spherical, cubic or cuboid shapes. In addition, the mixtures or mouldings described here may comprise paraffin as an additional auxiliary. Paraffin is employed in particular if intimate contact between the heat storage composition and a component is to be established during use. For example, latent heat storage systems can be installed with a precise fit in this way for the cooling of electronic compo-nents. During installation of the heat storage system, the handling of, in particular, a moulding described above is simple; the paraffin melts during use, expels air at the contact surfaces and so ensures close contact between the heat storage material and the component. Compositions of this type are therefore preferably used in devices for cooling electronic components.
In addition, binders, preferably a polymeric binder, may be present as auxiliaries. In this case, the crystallites of the heat storage material are preferably in finely divided form in the binder. The preferably polymeric OOl 100B262.doc 8/20 CA 02349870 2001-06-06 binders which may be present can be the polymers which are suitable as binder in accordance with the application. The polymeric binder is prefer-ably selected from curable polymers or polymer precursors, which in turn are preferably selected from the group consisting of polyurethanes, nitrite rubber, chloroprene, polyvinyl chloride, silicones, ethylene-vinyl acetate copolymers and polyacrylates. The suitable methods for incorporation of the heat storage materials into these polymeric binders are well known to the person skilled in the art in this area. He has no difficulties in finding, where appropriate, the requisite additives, such as, for example, emulsi-fiers, which stabilise a mixture of this type.
For liquid-solid PCMs, nucleating agents, such as, for example, borax or various metal oxides, are preferably employed in addition.
Besides ensuring good heat transfer through metals (aluminium, copper, etc.) or other heat conduction structures (metal powders, graphite, etc.), the heat transfer in the heat sink may also be implemented in the form of a heat pipe (for example US 5770903A for motor cooling incl. PCM).
In a heat sink with heat pipe (Figure 3), the interior of the heat sink (1 ) then has, for example, a cavity (6), which is partially filled with a liquid and/or gaseous medium. The liquid/gaseous heat transfer medium (5) is selected from the group consisting of the halogenated hydrocarbons (for example ethyl bromide, trichloroethylene or freons) and their equivalents. The design of a heat pipe and the choice of a suitable medium presents no problems to the person skilled in the art.
Besides this medium, the cavity also contains PCM particles (4), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature TP~.
It has been found that encapsulated or microencapsulated PCMs and solid-solid PCMs which are insoluble in the medium are particularly suitable. All known PCMs can be used.
Surprisingly, it has been found that, due to the good mixing of the PCM/
medium suspension, the dynamics of the heat sink are particularly great.
'_001 100B2G2.doc 9/20 CA 02349870 2001-06-06 A further possibility has been found through a mixed form (Figure 4). The CPU (2) is again mounted on a support (3). In order to improve the heat conduction, cooling fins (7) are run through the cavity (6), which is in turn partially filled with a liquid/gaseous heat transfer medium (5). Continuous cooling fins are preferred. As in the previous variants, the cavity, besides the liquid/gaseous heat transfer medium, here too contains PCM particles (4), which absorb heat as soon as the internal temperature in the heat pipe reaches the phase change temperature TPC.
The PCM can be compression moulded into any desired shapes. The material can be compression moulded in pure form, compression moulded after comminution (for example grinding), or compression moulded in mixtures with other binders and/or auxiliaries. The mouldings can be stored, transported and employed in a variety of ways without problems.
For example, the mouldings can be inserted directly into electronic components (Figure 5). Here too, the CPU (2) is mounted on a support (3).
The mouldings are installed between the cooling fins in such a way that they are in intimate contact with the surfaces of the cooling fins. The thickness of the mouldings is selected so that a frictional connection is formed between the fins and the moulding. The mouldings can also be inserted between cooling fins/heat exchangers before the latter are connected to form a stack.
However, these types of cooling with the aid of PCMs for absorbing heat peaks are not restricted to use in computers. These systems can be used in power switches and power circuits for mobile communications, trans-mission circuits for mobile telephones and fixed transmitters, control circuits for electromechanical actuators in industrial electronics and in motor vehicles, high-frequency circuits for satellite communications and radar applications, single-board computers, and for actuators and control units for domestic appliances and industrial electronics.
These cooling devices can be applied to all applications in which heat peaks are to be absorbed (for example motors for elevators, in electrical substations and in internal-combustion engines).
2001 IOOA262.doc 10/20 CA 02349870 2001-06-06 Symbol Explanation 1 Cooling ribs 2 Central processing unit (CPU) 3 Support 4 Phase change material (PCM) 5 Liquid/gaseous heat exchange medium 6 Cavity ~ Cooling fins in cavity Z Entire component Table 2: Explanation of the symbols in the figures Examples Example 1 A heat sink as shown in Figure 2 is designed for a processor whose maximum operating temperature is 75°C. A phase change material having a TP~ of between 60°C and 65°C is selected in the cavities in the heat sink.
Sodium hydroxide monohydrate having a TP~ of 64°C was used here.
Example 2 A heat sink as shown in Figure 3 is designed for a processor having a maximum operating temperature of 75°C. The cavities of the heat sink contain trichloroethylene as heat transfer fluid. The PCM used is an encapsulated paraffin. Nonacosane, which has a TPC of 63°C, is used.
2001 100B262.doc 11/20 CA 02349870 2001-06-06 However, solid-solid PCMs are also suitable as phase change material here. Didoceylammonium nitrate is suitable for this processor as it has a TP~ of 66°C.
Claims (14)
1. Device for cooling heat-generating electrical and electronic compo-nents having a non-uniform output profile, essentially consisting of a heat-conducting unit (1) and a heat-absorbing unit which contains a phase change material (PCM) (4).
2. Device according to Claim 1, characterised in that the PCM is arranged in such a way that the heat flow from the electronic component to the heat-conducting unit (1) is not interrupted and a significant heat flow to the PCM only occurs if the temperature of the heat-conducting unit (1) exceeds the phase change temperature T PC of the PCM.
3. Device according to at least one of the preceding claims, characterised in that the PCM-containing unit (4) consists of one or more cavities into which the PCM has been introduced, where the cavities (6) are formed by the heat-absorbing unit (4).
4. Device according to at least one of the preceding claims, characterised in that the PCM-containing unit (4) additionally contains a liquid/gaseous heat transfer medium (5).
5. Device according to Claim 4, characterised in that the liquid/gaseous heat transfer medium (5) is selected from the group consisting of the halogenated hydrocarbons.
6. Device according to one of Claims 1 to 5, characterised in that a solid-solid PCM is employed.
7. Device according to one of the preceding claims, characterised in that the PCM is encapsulated.
8. Device according to one of Claims 1 to 7, characterised in that the heat-conducting unit (1) has surface area-increasing structures.
9. Device according to Claim 8, characterised in that the heat-conducting unit (1) has cooling fins.
10. Component (Z), essentially consisting of a cooling device according to Claims 1 to 9 and a heat-generating electronic component (2), where the two structural units (1), (4) and component (2) are arranged in such a way in relation to one another that the heat flow between the heat-generating electronic component (2) and the heat-conducting unit (1) takes place in direct contact.
11. Component (Z) according to Claim 10, characterised in that the electronic component (2) is a computer CPU or memory chip.
12. Computer containing a component according to Claim 10 or 11.
13. Use of a device according to Claims 1 to 9 or a component according to Claim 10 or 11 in computers and electronic data processing systems.
14. Use of a device according to Claims 1 to 9 or a component according to Claim 10 or 11 in power switches and power circuits for mobile communications, transmission circuits for mobile telephones and fixed transmitters, control circuits for electromechanical actuators in industrial electronics and in motor vehicles, high-frequency circuits for satellite communications and radar applications, single-board computers, and for actuators and control units for domestic appliances and industrial electronics.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10027803.5 | 2000-06-08 | ||
| DE10027803 | 2000-06-08 | ||
| DE10114998.0 | 2001-03-26 | ||
| DE10114998A DE10114998A1 (en) | 2000-06-08 | 2001-03-26 | Use of PCM in coolers for electronic batteries |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2349870A1 true CA2349870A1 (en) | 2001-12-08 |
Family
ID=26005968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002349870A Abandoned CA2349870A1 (en) | 2000-06-08 | 2001-06-06 | Use of pcms in heat sinks for electronic components |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20020033247A1 (en) |
| EP (1) | EP1162659A3 (en) |
| JP (1) | JP2002057262A (en) |
| CN (1) | CN1329361A (en) |
| CA (1) | CA2349870A1 (en) |
| TW (1) | TW533455B (en) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10157671A1 (en) * | 2001-11-24 | 2003-06-05 | Merck Patent Gmbh | Optimized use of PCM in cooling devices |
| DE10250249A1 (en) * | 2002-10-28 | 2004-05-13 | Sgl Carbon Ag | Mixtures for heat storage |
| DE10250604A1 (en) * | 2002-10-30 | 2004-05-19 | Tyco Electronics Amp Gmbh | Integrated circuit system with latent heat storage module |
| US6889755B2 (en) * | 2003-02-18 | 2005-05-10 | Thermal Corp. | Heat pipe having a wick structure containing phase change materials |
| KR20040087725A (en) * | 2003-04-07 | 2004-10-15 | 유수남 | freezer Device |
| US7246940B2 (en) * | 2003-06-24 | 2007-07-24 | Halliburton Energy Services, Inc. | Method and apparatus for managing the temperature of thermal components |
| US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
| TW200532422A (en) * | 2004-03-16 | 2005-10-01 | Ind Tech Res Inst | Thermal module with heat reservoir and method of applying the same on electronic products |
| EP1598406B1 (en) * | 2004-05-18 | 2013-08-07 | SGL Carbon SE | Latent heat storage material |
| DE102004031889B4 (en) * | 2004-06-30 | 2012-07-12 | Infineon Technologies Ag | Semiconductor component with a housing and a semi-embedded in a plastic housing material semiconductor chip and method for producing the same |
| US20060102353A1 (en) * | 2004-11-12 | 2006-05-18 | Halliburton Energy Services, Inc. | Thermal component temperature management system and method |
| US8024936B2 (en) * | 2004-11-16 | 2011-09-27 | Halliburton Energy Services, Inc. | Cooling apparatus, systems, and methods |
| US7699102B2 (en) * | 2004-12-03 | 2010-04-20 | Halliburton Energy Services, Inc. | Rechargeable energy storage device in a downhole operation |
| WO2006060708A1 (en) * | 2004-12-03 | 2006-06-08 | Halliburton Energy Services, Inc. | Switchable power allocation in a downhole operation |
| AU2005316870A1 (en) | 2004-12-03 | 2006-06-22 | Halliburton Energy Services, Inc. | Heating and cooling electrical components in a downhole operation |
| US8109324B2 (en) * | 2005-04-14 | 2012-02-07 | Illinois Institute Of Technology | Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling |
| US7923112B2 (en) * | 2005-05-12 | 2011-04-12 | Sgl Carbon Se | Latent heat storage material and process for manufacture of the latent heat storage material |
| US8070885B2 (en) * | 2005-05-19 | 2011-12-06 | Shell Oil Company | Quenching fluid |
| TW200706100A (en) * | 2005-07-29 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Heat sink |
| WO2007030568A2 (en) * | 2005-09-08 | 2007-03-15 | Therapy Innovations Llc | Superficial heat modality for therapeutic use |
| CN100464411C (en) * | 2005-10-20 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Encapsulation method and structure of light emitting diode |
| FR2893766A1 (en) * | 2005-11-23 | 2007-05-25 | Pascal Henri Pierre Fayet | Photovoltaic generator for use on e.g. ground, has radiative cooling panel, cases, radiator having convection cooling fins, and latent heat composite thermal capacitor, where panel, faces of cases and radiator permit to evacuate heat |
| US20070171615A1 (en) * | 2006-01-24 | 2007-07-26 | Wan-Lin Xia | Heat dissipation device |
| US8171984B2 (en) * | 2006-02-01 | 2012-05-08 | Sgl Carbon Ag | Latent heat storage devices |
| US8580171B2 (en) * | 2006-03-24 | 2013-11-12 | Sgl Carbon Ag | Process for manufacture of a latent heat storage device |
| US7491577B2 (en) * | 2007-01-08 | 2009-02-17 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for providing thermal management on high-power integrated circuit devices |
| WO2008095931A2 (en) * | 2007-02-08 | 2008-08-14 | Basf Se | Aminoplastic-based, liquid-impregnated foamed plastic part and uses thereof |
| US20090109623A1 (en) * | 2007-10-31 | 2009-04-30 | Forcecon Technology Co., Ltd. | Heat-radiating module with composite phase-change heat-radiating efficiency |
| US9102857B2 (en) * | 2008-03-02 | 2015-08-11 | Lumenetix, Inc. | Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled |
| US7810965B2 (en) | 2008-03-02 | 2010-10-12 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
| DE102008040281A1 (en) * | 2008-07-09 | 2010-01-14 | Robert Bosch Gmbh | Device and method for cooling components |
| US8631855B2 (en) * | 2008-08-15 | 2014-01-21 | Lighting Science Group Corporation | System for dissipating heat energy |
| US7969075B2 (en) * | 2009-02-10 | 2011-06-28 | Lumenetix, Inc. | Thermal storage system using encapsulated phase change materials in LED lamps |
| US9019704B2 (en) | 2009-08-27 | 2015-04-28 | Hewlett-Packard Development Company, L.P. | Heat storage by phase-change material |
| US20120250333A1 (en) * | 2009-10-26 | 2012-10-04 | Wen-Chiang Chou | Insulating and Dissipating Heat Structure of an Electronic Part |
| US8123389B2 (en) | 2010-02-12 | 2012-02-28 | Lumenetix, Inc. | LED lamp assembly with thermal management system |
| KR101044351B1 (en) * | 2010-05-26 | 2011-06-29 | 김선기 | Heat cooler |
| CN101865864B (en) * | 2010-06-08 | 2012-07-04 | 华东理工大学 | System for testing phase transformation cooling effect of electronic components |
| US20120206880A1 (en) * | 2011-02-14 | 2012-08-16 | Hamilton Sundstrand Corporation | Thermal spreader with phase change thermal capacitor for electrical cooling |
| KR101270578B1 (en) | 2011-05-13 | 2013-06-03 | 전자부품연구원 | LED Lighting Apparatus And Cooling Apparatus Thereof |
| US20140090808A1 (en) * | 2011-05-17 | 2014-04-03 | Sharp Kabushiki Kaisha | Heat-transfer device |
| US8741169B2 (en) * | 2011-09-26 | 2014-06-03 | Basf Se | Heat storage composition comprising sodium sulfate decahydrate and superabsorbent |
| US20130105106A1 (en) * | 2011-10-31 | 2013-05-02 | Dharendra Yogi Goswami | Systems And Methods For Thermal Energy Storage |
| TW201320877A (en) * | 2011-11-04 | 2013-05-16 | Most Energy Corp | Heat management device and electronic apparatus |
| EP2784808B8 (en) * | 2011-11-21 | 2016-08-24 | Panasonic Intellectual Property Management Co., Ltd. | Electrical component resin, semiconductor device, and substrate |
| JP2013157573A (en) * | 2012-01-31 | 2013-08-15 | Toshiba Corp | Thermal storage cooler |
| WO2013130424A1 (en) * | 2012-02-27 | 2013-09-06 | Double Cool Ltd. | Thermoelectric air conditioner |
| US8937384B2 (en) | 2012-04-25 | 2015-01-20 | Qualcomm Incorporated | Thermal management of integrated circuits using phase change material and heat spreaders |
| US8929074B2 (en) * | 2012-07-30 | 2015-01-06 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronic device assemblies and vehicles employing dual phase change materials |
| CN102833990A (en) * | 2012-09-24 | 2012-12-19 | 山东大学 | Heat dissipation device and heat dissipation method for temperature control through thermo-chemical method |
| DE102012021155B4 (en) * | 2012-10-29 | 2014-09-25 | Airbus Defence and Space GmbH | Elektroantriebsbaueinheit |
| US9036352B2 (en) * | 2012-11-30 | 2015-05-19 | Ge Aviation Systems, Llc | Phase change heat sink for transient thermal management |
| CN103256841B (en) * | 2013-04-25 | 2016-05-11 | 上海卫星工程研究所 | A kind of energy storage heat abstractor |
| WO2014189525A1 (en) * | 2013-05-24 | 2014-11-27 | International Engine Intellectual Property Company, Llc | Electric-electronic actuator |
| RU2592883C2 (en) | 2013-08-30 | 2016-07-27 | Общество С Ограниченной Ответственностью "Яндекс" | Cooling system, method of operating such system and backup cooling device |
| FR3011067B1 (en) * | 2013-09-23 | 2016-06-24 | Commissariat Energie Atomique | APPARATUS COMPRISING A FUNCTIONAL COMPONENT LIKELY TO BE OVERHEAD WHEN OPERATING AND A COMPONENT COOLING SYSTEM |
| DE102013225077A1 (en) * | 2013-12-06 | 2015-06-11 | Continental Automotive Gmbh | Heat pipe with displacement bodies |
| US11049794B2 (en) * | 2014-03-01 | 2021-06-29 | Advanced Micro Devices, Inc. | Circuit board with phase change material |
| US10151542B2 (en) * | 2014-04-03 | 2018-12-11 | Raytheon Company | Encapsulated phase change material heat sink and method |
| TWI542277B (en) * | 2014-09-30 | 2016-07-11 | 旭德科技股份有限公司 | Heat dissipation module |
| US10241422B2 (en) | 2015-03-24 | 2019-03-26 | Asml Netherlands B.V. | Lithography apparatus and a method of manufacturing a device |
| US9562604B2 (en) * | 2015-04-22 | 2017-02-07 | Ford Global Technologies, Llc | Axle heat absorber |
| FR3040777B1 (en) * | 2015-09-04 | 2019-04-19 | Thales | OPTICAL DETECTION ASSEMBLY HAVING AN IMPROVED THERMAL CONTROL OPTICAL DETECTOR, OBSERVATION INSTRUMENT AND SATELLITE COMPRISING SUCH AN OPTICAL DETECTION ASSEMBLY |
| US10269682B2 (en) * | 2015-10-09 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
| FR3042309B1 (en) * | 2015-10-09 | 2017-12-15 | Commissariat Energie Atomique | IMPROVED DBC STRUCTURE WITH SUPPORT INTEGRATING PHASE CHANGE MATERIAL |
| US10123456B2 (en) | 2015-10-28 | 2018-11-06 | Raytheon Company | Phase change material heat sink using additive manufacturing and method |
| KR101810167B1 (en) * | 2015-11-11 | 2017-12-19 | 전남대학교산학협력단 | A device for three dimensional heat absorption |
| US10674641B2 (en) * | 2016-04-04 | 2020-06-02 | Hamilton Sundstrand Corporation | Immersion cooling systems and methods |
| US10785839B2 (en) * | 2016-06-27 | 2020-09-22 | Kevin Joseph Hathaway | Thermal ballast |
| US9918407B2 (en) * | 2016-08-02 | 2018-03-13 | Qualcomm Incorporated | Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device |
| CN106940148B (en) * | 2016-11-26 | 2019-09-06 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | It is heat sink to become gradient fractal lattice sandwich reinforced transformation |
| DE102016123408A1 (en) * | 2016-12-05 | 2018-06-07 | Valeo Schalter Und Sensoren Gmbh | Head-up display with a heat buffer for a motor vehicle |
| ES2939610T3 (en) | 2016-12-29 | 2023-04-25 | Huawei Tech Co Ltd | Terminal apparatus comprising a heat dissipation device |
| US10415474B2 (en) * | 2017-01-31 | 2019-09-17 | General Electric Company | Method and system for phase change material component cooling |
| GB2578987B (en) | 2017-09-01 | 2023-02-08 | Rogers Corp | Fusible phase-change powders for thermal management, methods of manufacture thereof, and articles containing the powders |
| IL258555B (en) | 2018-03-29 | 2022-06-01 | Elta Systems Ltd | Heatsink for electrical circuitry |
| WO2020011398A1 (en) | 2018-07-11 | 2020-01-16 | Linde Aktiengesellschaft | Heat exchanger and method for producing a heat exchanger |
| WO2020011397A1 (en) | 2018-07-11 | 2020-01-16 | Linde Aktiengesellschaft | Tube sheet arrangement for a heat exchanger, heat exchanger, and method for producing a tube sheet arrangement |
| EP3821191A1 (en) | 2018-07-11 | 2021-05-19 | Linde GmbH | Temperature compensating element, pipe and method for producing a pipe |
| US10890387B2 (en) | 2018-10-25 | 2021-01-12 | United Arab Emirates University | Heat sinks with vibration enhanced heat transfer |
| US11435144B2 (en) * | 2019-08-05 | 2022-09-06 | Asia Vital Components (China) Co., Ltd. | Heat dissipation device |
| US20230100966A1 (en) * | 2019-12-03 | 2023-03-30 | Hewlett-Packard Development Company, L.P. | Processor cooling with phase change material filled shell |
| DE102020112968A1 (en) | 2020-05-13 | 2021-11-18 | Bayerische Motoren Werke Aktiengesellschaft | Electronic computing device for a motor vehicle and motor vehicle |
| WO2021240072A1 (en) | 2020-05-29 | 2021-12-02 | Aalto University Foundation Sr | Phase change polysaccharide-based bio-complexes with tunable thermophysical properties and preparation method thereof |
| DE102020130612A1 (en) * | 2020-11-19 | 2022-05-19 | Infineon Technologies Ag | Package with an electrically insulating carrier and at least one step on the encapsulant |
| CN112943702A (en) * | 2021-02-09 | 2021-06-11 | 鞍钢股份有限公司 | Phase change energy storage cooling device for preventing draught fan from overheating |
| US12082374B2 (en) * | 2021-10-08 | 2024-09-03 | Simmonds Precision Products, Inc. | Heatsinks comprising a phase change material |
| CN117042420B (en) * | 2023-10-09 | 2023-12-22 | 北京航空航天大学 | Electronic equipment heat dissipation system and method with sugar alcohol type PCM energy storage unit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2523688B2 (en) * | 1987-09-29 | 1996-08-14 | 株式会社東芝 | Semiconductor package |
| JPH05218250A (en) * | 1992-02-06 | 1993-08-27 | Mitsubishi Heavy Ind Ltd | Heat dissipating apparatus with variable heat transfer rate |
| US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| EP0732743A3 (en) * | 1995-03-17 | 1998-05-13 | Texas Instruments Incorporated | Heat sinks |
| US5770903A (en) * | 1995-06-20 | 1998-06-23 | Sundstrand Corporation | Reflux-cooled electro-mechanical device |
-
2001
- 2001-05-10 EP EP01111152A patent/EP1162659A3/en not_active Withdrawn
- 2001-06-04 TW TW090113501A patent/TW533455B/en not_active IP Right Cessation
- 2001-06-06 CA CA002349870A patent/CA2349870A1/en not_active Abandoned
- 2001-06-08 JP JP2001174400A patent/JP2002057262A/en active Pending
- 2001-06-08 CN CN01120853A patent/CN1329361A/en active Pending
- 2001-06-08 US US09/876,227 patent/US20020033247A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20020033247A1 (en) | 2002-03-21 |
| TW533455B (en) | 2003-05-21 |
| EP1162659A2 (en) | 2001-12-12 |
| EP1162659A3 (en) | 2005-02-16 |
| JP2002057262A (en) | 2002-02-22 |
| CN1329361A (en) | 2002-01-02 |
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