CN210694775U - Radiator based on phase-change material - Google Patents

Radiator based on phase-change material Download PDF

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CN210694775U
CN210694775U CN201922037992.6U CN201922037992U CN210694775U CN 210694775 U CN210694775 U CN 210694775U CN 201922037992 U CN201922037992 U CN 201922037992U CN 210694775 U CN210694775 U CN 210694775U
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heat
change material
phase
powder
phase change
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张立强
张秋兵
杨小玉
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Abstract

A phase change material based heat sink comprising: the heat dissipation structure comprises a heat dissipation main body, phase-change material powder and heat dissipation fins; the heat dissipation main part is provided with phase change material holding chamber, and phase change material powder sets up and phase change material holding intracavity, and the phase change material powder includes phase change powder and heat conduction powder, and the heat conduction powder is used for helping the heat conduction, and the phase change powder is used for absorbing the heat that the heat dissipation main part was conducted through changing the physical form. The heat dissipation fins are arranged on the outer side wall of the heat dissipation main body. The utility model has the advantages that: the application provides a pair of radiator based on phase change material, because the phase change material powder has the exothermic characteristics of approximate constant temperature energy storage, and combines the quick heat conduction's of heat dissipation main part and heat radiation fins characteristics, the radiator heat-sinking capability of this application is strong, heat radiation stability is good, can use on all kinds of electronic components, improves reliability, stability and the life of electronic components work.

Description

Radiator based on phase-change material
Technical Field
The utility model relates to a radiator field especially relates to a radiator based on phase change material.
Background
With the development of science and technology, electronic components such as CPUs (central processing units) are widely used, and the heat dissipation problem of the electronic components becomes a problem to be solved urgently in the industry.
The phase-change material can absorb the heat of the environment and emit the heat to the environment when needed in the process of phase change of the phase-change material, so that the aim of controlling the temperature of the surrounding environment is fulfilled. The phase change process of the substance is an isothermal or approximately isothermal process, and the process is accompanied with the absorption or release of energy, wherein the phase change heat storage is realized by utilizing a phase change material to absorb or release heat from the environment in the phase change process of the phase change material so as to achieve the purpose of energy storage or energy release.
The heat storage technology of the phase change material is applied to the radiator, so that the functions of quickly transferring and directionally storing the heat power consumption of the electronic components are realized, and the function of controlling the temperature of the electronic components is achieved.
SUMMERY OF THE UTILITY MODEL
Therefore, a heat sink based on a phase change material is required to be designed, which can dissipate heat stably and has high heat dissipation efficiency.
A phase change material based heat sink comprising: the heat dissipation structure comprises a heat dissipation main body, phase-change material powder and heat dissipation fins;
the heat dissipation body is provided with a phase-change material containing cavity, the phase-change material powder is arranged in the phase-change material containing cavity, the phase-change material powder comprises phase-change powder and heat conduction powder, the heat conduction powder is used for assisting in heat conduction, and the phase-change powder is used for absorbing heat conducted by the heat dissipation body through physical form conversion.
The heat dissipation fins are arranged on the outer side wall of the heat dissipation main body.
In one embodiment, the heat dissipation body is an aluminum alloy integrated structure.
In one embodiment, the phase-change powder includes: at least one of an alkane wax, a polyethylene wax, a polypropylene wax, or a paraffin wax.
In one embodiment, the heat conductivity coefficient of the phase change powder is 1-7W/m.k, or the phase change temperature of the phase change powder is 25-90 ℃.
In one embodiment, the heat conducting powder comprises one or more of aluminum oxide, boron nitride, silicon powder, aluminum nitride or magnesium oxide, and the heat conducting coefficient of the heat conducting powder is 1-200W/m.k.
In one embodiment, the number of the heat dissipation fins is multiple, and the multiple heat dissipation fins are arranged around the center line of the heat dissipation body.
In one embodiment, the edges of the heat dissipation fins are arranged in a wave shape.
In one embodiment, the number of the phase change material containing cavities is one or more, and the combined shape of the phase change material containing cavities is honeycomb-shaped.
In one embodiment, the phase change material powder body further comprises a heat conduction film, the heat conduction film is used for wrapping the phase change material powder body, and the heat conduction film is abutted to the inner side wall of the phase change material accommodating cavity.
In one embodiment, the heat conducting film is a graphite heat dissipating film.
The utility model has the advantages that: the application provides a pair of radiator based on phase change material, because the phase change material powder has the exothermic characteristics of approximate constant temperature energy storage, and combines the heat dissipation main part reaches the quick heat conduction's of heat radiation fins characteristics makes the radiator can give off electronic components's heat fast, can play the effect of regulation and control electronic components temperature, makes electronic components keep better working property, has improved electronic components's life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic cross-sectional view of a perspective of a phase-change material-based heat sink according to an embodiment of the present invention;
fig. 2 is a top view of a phase change material based heat sink according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation fin of a heat sink based on a phase-change material according to an embodiment of the present invention;
fig. 4 is a schematic view of another perspective cross-sectional structure of a phase-change material-based heat sink according to another embodiment of the present invention.
Reference numerals:
the phase-change material heat sink comprises a heat sink 10, a heat sink main body 100, phase-change material powder 200, heat dissipation fins 300 and a phase-change material accommodating cavity 101.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a phase-change material-based heat sink 10 includes a heat sink body 100, a phase-change material powder 200, and heat sink fins 300;
specifically, the radiator directly hits the contact through heat dissipation main part 100 and heat-generating body and carries out heat-conduction, heat dissipation main part 100 transmits heat partly for phase change material powder 200, phase change material powder 200 carries out the conversion of physical state through the absorbed heat, makes heat dissipation main part 100 is close to the one end of heat-generating body and is close to phase change material powder 200's one end forms great difference in temperature for heat conduction efficiency of heat dissipation main part 100, in addition, heat dissipation main part 100 transmits partly heat for heat radiation fins 300, heat radiation fins 300 is owing to have great heat radiating surface area, heat radiation fins 300 can play better radiating effect.
It should be noted that the heat dissipation main body 100 is provided with a phase change material accommodating cavity 101, the phase change material powder 200 is disposed in the phase change material accommodating cavity 101, the phase change material powder 200 includes phase change powder and heat conduction powder, the heat conduction powder is used for assisting heat conduction, and the phase change powder is used for absorbing heat conducted by the heat dissipation main body 100 by changing physical forms.
Specifically, the heat dissipation body wraps the phase-change material powder, and when the temperature of the heat dissipation body is higher than that of the phase-change material powder, the phase-change material powder absorbs heat to perform solid-liquid physical form conversion, and the phase-change material powder absorbs the heat to hide, so as to further assist the heat dissipation body in conducting heat.
It should be further noted that the heat dissipation fins are disposed on the outer side wall of the heat dissipation body. Specifically, one part of the heat dissipation fins is used for directly conducting the heat of the heat dissipation main body to the air for heat dissipation, and the other part of the heat dissipation fins is used for releasing the latent heat to the heat dissipation main body by the phase-change material powder when the temperature of the heat dissipation main body is lower than that of the phase-change material powder, then the heat dissipation main body transfers the heat to the heat dissipation fins, and the heat dissipation fins indirectly conduct the heat of the phase-change material powder to the air.
In one embodiment, the heat dissipating body is an aluminum alloy integrated structure.
Specifically, the integrated forming structure of the heat dissipation main body has better structural stability, and the aluminum alloy is used as the material body, so that on one hand, the production cost is lower, and on the other hand, the aluminum alloy has better heat conduction performance.
In one embodiment, the phase-change powder includes: at least one of an alkane wax, a polyethylene wax, a polypropylene wax, or a paraffin wax.
Further, by adding a curing agent and resin into the phase-change powder, the heat storage performance of the phase-change powder can be improved, and specifically, the resin, the curing agent and the phase-change powder are mixed and banburied, wherein the weight percentage of the resin is 10-30%, the weight percentage of the phase-change powder is 30-85%, and the weight percentage of the curing agent is 10-30%.
In one embodiment, the heat conductivity coefficient of the phase change powder is 1-7W/m.k, or the phase change temperature of the phase change powder is 25-90 ℃.
Specifically, the phase-change powder has the capacity of absorbing and discharging heat and storing heat, the phase-change temperature of the phase-change powder is 25-90 ℃, the phase-change temperature of the phase-change powder can meet the heat dissipation requirement of most heating components during working, and the phase-change powder absorbs or releases heat conducted by the heat dissipation main body through changing the physical form to assist the heat dissipation main body in dissipating heat.
In one embodiment, the heat conductive powder comprises one or more of alumina, boron nitride, silicon powder, aluminum nitride or magnesium oxide, and the heat conductivity coefficient of the heat conductive powder is 1-200W/m.k.
Specifically, the heat conducting powder has better heat conducting performance, on one hand, the heat on the inner wall of the heat conducting main body can be accelerated to be conducted, and on the other hand, the heat conducting powder and the phase-change material powder are uniformly mixed, so that the heat storage or heat release time of the phase-change material powder can be shortened.
In one embodiment, referring to fig. 2, the number of the heat dissipation fins 300 is one or more, and the heat dissipation fins 300 are disposed around the center line of the heat dissipation body 100.
Specifically, the heat dissipation fins may be made of aluminum alloy or copper, and in order to accelerate the heat dissipation performance of the heat dissipation fins, a heat dissipation adhesive may be coated on the surfaces of the heat dissipation fins. Certain intervals are arranged among the radiating fins, and the optimal interval is 2-5 mm, so that the surface area of the radiating main body is not wasted, the radiating fins can be ensured to be in contact with air at a lower temperature, and the radiating fins are ensured to have better radiating capacity.
It should be noted that the shape of the heat sink shown in fig. 2 is only one embodiment of the present invention, and the shape of the heat sink is not limited, and in practical applications, a plurality of modifications and improvements can be made without departing from the present invention, and these modifications and improvements all belong to the protection scope of the present invention.
In one embodiment, referring to fig. 3, the edges of the heat dissipation fins 300 are disposed in a wave shape.
Specifically, when the heat sink is applied to a high-power heat dissipation component, and a single heat sink may not meet the heat dissipation requirement, the heat dissipation requirement is met by adding a plurality of heat sinks, specifically, the heat dissipation fins of the plurality of heat sinks and the heat dissipation fins currently used are bonded in a staggered manner, and the heat of the currently used heat sink is conducted to the heat sink combined with the heat sink through the heat dissipation fins by combining the plurality of heat sinks and the currently used heat sink, so that the heat dissipation capability is further increased.
In one embodiment, referring to fig. 4, the phase change material accommodating chambers 101 are multiple in number, and the combination of the phase change material accommodating chambers 101 is honeycomb-shaped.
Specifically, in order to optimize the heat dissipation effect of the heat sink, the phase change material accommodating chambers of the heat dissipation body are arranged in a plurality of numbers, and in order to increase the heat conduction capability between the phase change material accommodating chambers, the phase change material accommodating chambers are combined into a honeycomb shape.
In an embodiment, the phase change material powder body further comprises a heat conduction film, the heat conduction film is used for wrapping the phase change material powder body, and the heat conduction film is abutted to the inner side wall of the phase change material accommodating cavity.
Specifically, in order to promote production the production efficiency of radiator, practice thrift the equipment time, use heat conduction membrane packing the phase change material powder becomes the strip, when production, only need fill in the strip phase change material powder is whole in the phase change material holding chamber, and need not to pour powdered phase change material powder into in the phase change material holding chamber. In addition, the phase-change material powder can have physical form transformation during energy storage and energy release, and the heat-conducting film can well wrap the phase-change material powder to prevent the phase-change material powder from leaking.
Further, the heat conducting film is a graphite heat dissipation film.
Specifically, the heat-conducting film using graphite as the base material has good chemical stability, plasticity and heat conductivity, can not chemically react with the phase-change material powder, can be easily molded into a desired shape when wrapping the phase-change powder, and can well transfer the heat of the heat-radiating main body to the phase-change material powder.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above embodiments are only intended to illustrate some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A phase change material based heat sink, comprising:
the heat dissipation structure comprises a heat dissipation main body, phase-change material powder and heat dissipation fins; the heat dissipation main body is provided with a phase change material accommodating cavity, the phase change material powder is arranged in the phase change material accommodating cavity and comprises phase change powder and heat conduction powder, the heat conduction powder is used for assisting in heat conduction, and the phase change powder is used for absorbing heat conducted by the heat dissipation main body through physical form conversion;
the heat dissipation fins are arranged on the outer side wall of the heat dissipation main body.
2. The phase change material based heat sink as claimed in claim 1, wherein the heat dissipating body is an aluminum alloy integral structure.
3. The heat sink based on the phase-change material as claimed in claim 1, wherein the phase-change powder comprises: at least one of an alkane wax, a polyethylene wax, a polypropylene wax, or a paraffin wax.
4. The heat sink based on the phase change material as claimed in claim 1, wherein the thermal conductivity of the phase change powder is 1-7W/m.k, or the phase change temperature of the phase change powder is 25-90 ℃.
5. The heat sink based on the phase change material as claimed in claim 1, wherein the heat conductive powder comprises one or more of alumina, boron nitride, silica powder, aluminum nitride or magnesium oxide, and the heat conductivity of the heat conductive powder is 1-200W/m.k.
6. The phase change material based heat sink as claimed in claim 1, wherein the number of the heat dissipating fins is plural, and the plural heat dissipating fins are arranged around a center line of the heat dissipating body.
7. The phase change material based heat sink as claimed in claim 1, wherein the edges of the heat dissipating fins are wavy.
8. The phase-change material based heat sink as claimed in claim 1, wherein the number of the phase-change material accommodating cavities is one or more, and the phase-change material accommodating cavities are combined to form a honeycomb shape.
9. The heat sink based on the phase-change material as claimed in claim 1, further comprising a heat conducting film, wherein the heat conducting film is used for wrapping the phase-change material powder, and the heat conducting film is abutted against the inner side wall of the phase-change material accommodating cavity.
10. The phase change material based heat spreader of claim 9, wherein the thermally conductive film is a graphite heat spreading film.
CN201922037992.6U 2019-11-22 2019-11-22 Radiator based on phase-change material Active CN210694775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922037992.6U CN210694775U (en) 2019-11-22 2019-11-22 Radiator based on phase-change material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922037992.6U CN210694775U (en) 2019-11-22 2019-11-22 Radiator based on phase-change material

Publications (1)

Publication Number Publication Date
CN210694775U true CN210694775U (en) 2020-06-05

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Country Status (1)

Country Link
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