US20010016978A1 - Method of making an electronic device - Google Patents

Method of making an electronic device Download PDF

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Publication number
US20010016978A1
US20010016978A1 US09/134,041 US13404198A US2001016978A1 US 20010016978 A1 US20010016978 A1 US 20010016978A1 US 13404198 A US13404198 A US 13404198A US 2001016978 A1 US2001016978 A1 US 2001016978A1
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United States
Prior art keywords
terminals
electronic element
casing
electrodes
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/134,041
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English (en)
Inventor
Junichi Hamatani
Satoshi Tsuruhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to MURATA MANUFACTURING, CO., LTD. reassignment MURATA MANUFACTURING, CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAMATANI, JUNICHI, TSURUHARA, SATOSHI
Priority to US09/895,897 priority Critical patent/US6751862B2/en
Publication of US20010016978A1 publication Critical patent/US20010016978A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49217—Contact or terminal manufacturing by assembling plural parts by elastic joining

Definitions

  • This invention relates to a method of making an electronic device of the type having its electronic element contained inside a casing such that it makes electrical contacts through terminals having an elastic spring-like contact part.
  • this invention relates to a method of inserting such an electronic element and its terminals into a casing.
  • FIGS. 8A and 8B show an example of prior art thermistor element 1 characterized as having two main surfaces facing outward away from each other and electrodes 2 and 3 formed thereon.
  • Silver used to be the material for forming such electrodes but silver tends to cause the phenomenon of migration, especially when used under a dewing condition which is likely to cause migration and a short circuit, damaging the thermistor element 1 .
  • the first electrode 4 layer comprising a metallic material such as nickel that can provide an ohmic contact but is not likely to cause a migration
  • the second electrode layer 5 comprising silver. Since the first and second electrode layers 4 and 5 thus formed remain nearly at the same potential, even if the silver of the second electrode layer 5 is ionized, the electrostatic force on the ionized silver is extremely weak, not significantly contributing to the migration of the silver ions.
  • FIG. 9 shows a prior art thermistor device 6 obtained by putting a thermistor element 1 as shown in FIGS. 8A and 8B inside a casing 7 made, for example, of a resin, glass, ceramic or metal material. Since the thermistor element 1 is a heat-producing element and reaches a high temperature when in operation, it is commonly made and sold in the form of such a device 6 .
  • the device 6 also includes two terminals 8 and 9 made of stainless steel or a copper alloy, each having a contact part 10 contacting a corresponding one of the electrodes 2 and 3 of the thermistor element 1 and an extended part 11 extending from the corresponding contact part 10 .
  • the contact parts 10 are each formed so as to serve as a spring, adapted to elastically contact the electrodes 2 and 3 .
  • the casing 7 has throughholes 12 formed therethrough, and the thermistor element 1 and the contact parts 10 of the terminals 8 and 9 are contained inside the casing 7 such that the thermistor element 1 is sandwiched and supported between and by the contact parts 10 of the terminals 8 and 9 which pass through the throughholes 12 through the casing 7 , leaving the extended parts 11 extending outside.
  • the terminals 8 and 9 are first set at specified positions inside the casing 7 and the thermistor element 1 is then inserted between the contact parts 10 of the two terminals 8 and 9 .
  • the contact parts 10 are deformed against its elastic spring force such that the gap therebetween is increased and that they can admit the thermistor element 1 therebetween while they remain in contact with the thermistor element 1 .
  • the electrodes 2 and 3 are rubbed against the contact parts 10 as the thermistor element 1 is inserted into the casing 7 inside which the terminals 8 and 9 are already installed. This tends to scratch and damage the electrodes 2 and 3 , as shown schematically at 13 in FIG. 10.
  • One of the factors contributing to the scratches on the electrode surface is the shape of the contact parts 10 .
  • the width of the terminals 8 and 9 is reduced at their contact parts 10 as shown in FIG. 11 so as to reduce as much as possible the area through which the contact parts 10 contact the electrodes 2 and 3 .
  • These contact areas are much smaller than the surface area of the electrodes 2 and 3 and hence the pressure applied by the contact parts 10 on (or the force on a unit area of) the electrodes 2 and 3 is relatively large, or large enough to scratch the electrodes 2 and 3 .
  • Such scratches usually affect the quality and/or the function of the electronic element (such as the thermistor element 1 ).
  • the scratches 13 may extend beyond the second electrode layer 5 and may reach the exposed part of the first electrode layer 4 surrounding the second electrode layer 5 . This has the undesirable effect of effectively causing the second electrode layer 5 to come closer through the scratch 13 to the main surface of the thermistor element 1 . If the thermistor device 6 having such scratches 13 is used under a dewing condition, the silver of the second electrode layer 5 may begin to migrate around the scratch 13 .
  • Methods embodying this invention may be characterized broadly as comprising the steps of providing an electronic element such as a thermistor element with electrodes formed on its two mutually parallel outwardly facing main surfaces, at least two terminals and a casing as described above, and inserting the electronic element and the terminals into the casing either simultaneously or sequentially such that the electrodes are not rubbed by the contact part of either of the terminals.
  • an electronic element such as a thermistor element with electrodes formed on its two mutually parallel outwardly facing main surfaces, at least two terminals and a casing as described above
  • inserting the electronic element and the terminals into the casing either simultaneously or sequentially such that the electrodes are not rubbed by the contact part of either of the terminals.
  • There are many ways to prevent such rubbing of the electrodes by the contact parts of the terminals One of the ways is to insert the terminals first and then cover their contact parts with flexible planar guide plates such that the electrodes will glide over them as the electronic element is inserted.
  • Another method is to sandwich the electronic element between the terminals with the contact parts of the latter contacting the electrodes on the main surfaces of the former to thereby preliminarily form an assembly consisting of the electronic element and the contacting terminals and then to insert this assembly into the casing.
  • the casing may be made divisible into halves such that the pre-formed assembly is inserted into one of them and then the two halves are joined together.
  • the casing may be made divisible into a tubular main body with one open surface and a lid with throughholes for closing this open surface. The terminals are preliminarily passed through these throughholes and supported by the lid.
  • one or both of the terminals passing therethrough can be tilted such that they can be opened as the electronic element is inserted and then closed to form an assembly which is then inserted as a whole into the main body.
  • the electrodes on the electronic element may be of a layered structure with the inner layer made of a metal less likely to general migration than the metal material of the outer layer.
  • FIG. 1 is a sectional view of a thermistor device being produced by a method according to a first embodiment of this invention
  • FIG. 2 is a front view of a portion of FIG. 1 to show how a guide plate overlaps a corresponding one of the electrodes;
  • FIG. 3 is a sectional view of a thermistor device being produced by another method according to a second embodiment of the invention.
  • FIG. 4 is a sectional view of a thermistor device being produced by still another method according to a third embodiment of the invention.
  • FIGS. 5A and 5B are sectional views of a thermistor device at two different times while it is being produced by still another method according to a fourth embodiment of the invention.
  • FIG. 6 is a sectional view of a portion of a thermistor device being produced by still another method according to a fifth embodiment of the invention.
  • FIG. 7 is a sectional view of a thermistor device being produced by still another method according to a sixth embodiment of the invention.
  • FIG. 8A is a front view of a prior art thermistor element, and FIG. 8B is its side view;
  • FIG. 9 is a sectional view of a prior art thermistor device having the thermistor element of FIGS. 8A and 8B contained inside a casing;
  • FIG. 10 is a front view of the prior art thermistor element of FIGS. 8A and 8B with an electrode surface scratched as it was inserted into a casing;
  • FIG. 11 is a front view of one of the terminals shown in FIG. 9.
  • a thermistor device as an example of an electronic device
  • a thermistor element 1 as an example of an electronic element
  • two terminals 8 and 9 and a casing 7 are prepared.
  • the method of production includes the step of inserting the thermistor element 1 into the casing 7 and the step of inserting the terminals 8 and 9 into the casing 7 , but each of these steps can be carried out in different ways, as will be described below.
  • the terminals 8 and 9 are inserted into the casing 7 first and then the thermistor element 1 is inserted.
  • guide plates 14 are each placed between one of the electrodes 2 and 3 of the thermistor element 1 and corresponding one of the contact parts 10 of the terminals 8 and 9 .
  • the area of each guide plate 14 is greater than the area of each contact part 10 which contacts the electrode 2 or 3 , and, in particular, the width of the guide plate 14 is made greater than the width of the contact area of each contact part 10 through which it contacts the electrode 2 or 3 .
  • the material and the shape of the guide plates 14 are not intended to limit the scope of this invention. Any thin plate with a smooth surface can serve the purpose of this invention. Thin plates of stainless steel which can be easily bent in the direction of the thickness may be utilized advantageously.
  • the thermistor element 1 is inserted into the casing 7 as indicated by arrow 15 until the electrodes 2 and 3 reach the positions opposite to and facing the contact parts 10 of the terminals 8 and 9 . After the thermistor element 1 and the terminals 8 and 9 are properly positioned, the guide plates 14 are pulled out.
  • the guide plates 14 serve to prevent direct contacts between the contact parts 10 of the terminals 8 and 9 with the electrodes 2 and 3 while the thermistor element 1 is inserted into the casing 7 . Because the contact parts 10 of the terminals 8 and 9 are already positioned opposite to the second electrode layers 5 of the electrodes 2 and 3 when the guide plates 14 are pulled out, the thermistor device 6 can be assembled without causing any scratches as shown at 13 in FIG. 10.
  • the electrodes 2 and 3 are rubbed against the guide plates 14 when the electronic element 1 is inserted and when the guide plates 14 are pulled out, but since the area of the guide plates 14 is greater than the contact areas of the contact parts 10 with the electrodes 2 and 3 , as explained above, the pressure (force per unit area) applied on the contact surface between the electrodes 2 and 3 and the guide plates 14 is much smaller than that between the electrodes 2 and 3 and the contact parts 10 in the case of a prior art method. Thus, the guide plates 14 do not cause any scratches although they rub against the electrodes 2 and 3 .
  • the guide plates 14 also serve to allow the thermistor element 1 to be inserted smoothly, no large external force is applied to the peripheral parts of the thermistor element 1 . Thus, the possibility of developing cracks along the periphery of the thermistor element 1 can also be reduced.
  • Table 1 shows that no migration was observed on any of the comparison samples if the cycle number was 1 but that migration was observed on all of the comparison samples if the cycle number was 20 or over. By comparison, generation of migration was not observed on any of the test samples although the cycle number reached 1000. This indicates that the method of present invention as described above can prevent migrations very effectively.
  • FIG. 3 shows a thermistor device as shown at 6 in FIG. 9 in the course of being produced by another method according to a second embodiment of this invention.
  • the step of inserting the thermistor element 1 into the casing 7 and that of inserting the terminals 8 and 9 into the casing 7 are carried out at the same time. This is done by first contacting the contact parts 10 of the terminals 8 and 9 respectively against the electrodes 2 and 3 of the thermistor element 1 and then inserting the assembly of the thermistor element 1 and the terminals 8 and 9 together into the casing 7 as shown by the black arrow 17 while elastically deforming the contact parts 10 as shown by white arrows 16 so as to reduce the separation between the two terminals 8 and 9 .
  • the electrodes 2 and 3 are not rubbed against the contact parts 10 of the terminals 8 and 9 as the thermistor element 1 is inserted into the casing 7 because the thermistor element 1 and the terminals 8 and 9 are in a fixed positional relationship, and hence a thermistor device as shown in FIG. 9 can be assembled without causing any scratches as shown at 13 in FIG. 10. Moreover, since no external force is applied on the peripheral parts of the thermistor element 1 as the latter is being inserted into the casing 7 , no cracks are generated along the periphery of the thermistor element 1 .
  • FIG. 4 shows a thermistor device as shown at 6 in FIG. 9 in the course of being produced by still another method according to a third embodiment of this invention.
  • the casing 7 is divisible into a first half 7 a and a second half 7 b across a dividing plane parallel to the main surfaces of the thermistor element 1 which is inserted thereinto.
  • the two halves 7 a and 7 b of the casing 7 are respectively provided with a V-shaped protrusion 19 and a similarly V-shaped groove 18 which are mutually engageable such that the two halves 7 a and 7 b can be tightly joined together.
  • the terminal 9 When the thermistor element 1 and the two terminals 8 and 9 are inserted into the casing 7 thus divisible, one of the terminals (say, the terminal 8 ) and the thermistor element 1 are firstly inserted into either half of the casing 7 (say, the first half 7 a ) such that contact part 10 of the terminal 8 is already in contact with the electrode 2 of the thermistor element 1 , as shown in FIG. 4. Thereafter, the other terminal 9 is positioned such that its contact part 10 will contact the other electrode 3 of the thermistor element 1 and the second half 7 b is joined to the first half 7 a as shown by arrow 20 . In this method, the terminal 9 may preferably be supported preliminarily by the second half 7 b of the casing 7 .
  • FIGS. 5A and 5B show a thermistor device as shown at 6 in FIG. 9 at two points in time in the course of being produced by still another method according to a fourth embodiment of this invention.
  • the casing 7 is made divisible into a main part 7 c and a lid 7 d.
  • the main part 7 c is for surrounding and containing therein the thermistor element 1 and the two terminals 8 and 9 and has at least one open surface 21 .
  • the lid 7 d is for closing this open surface 21 of the main part 7 c and has throughholes 12 for admitting therethrough the extended parts 11 of the terminals 8 and 9 to thereby support the terminals 8 and 9 .
  • the thermistor element 1 and the two electrodes 8 and 9 are inserted into the casing 7 at the same time, as by the method according to the second embodiment of this invention.
  • the contact parts 10 of the terminals 8 and 9 are brought into contact with the electrodes 2 and 3 of the thermistor element 1 . This is done by increasing the gap between the contact parts 10 while the terminals 8 and 9 are supported by the lid 7 d and then positioning the thermistor element 1 between the two contact parts 10 , as shown in FIG. 5A. Thereafter, the elastic contact parts 10 are elastically deformed, as shown in FIG. 5B, as the gap between the contact parts 10 is narrowed such that the electrodes 2 and 3 come into contact with the contact parts 10 .
  • the throughholes 12 through the lid 7 d are preferably provided with a sufficient clearance such that the tilting angles of the terminals 8 and 9 supported by the lid 7 d can be varied as the gap between the contact parts 10 is changed gradually.
  • a clearance may be provided to only one of the throughholes 12 .
  • the extended parts 11 of the terminals 8 and 9 may be made flexible such that the gap between the two contact parts 10 can be increased by bending their flexible extended parts 11 .
  • the main part 7 c and the lid 7 d of the casing 7 are brought together, as indicated by arrow 22 in FIG. 5B, while the terminals 8 and 9 remain supported by the lid 7 d and the gap between the terminals 8 and 9 is made narrower by bending their contact parts 10 such that the thermistor 1 and the terminals 8 and 9 are inserted together inside the main part 7 c until and main part 7 c and the lid 7 d are engaged together.
  • the main part 7 c and the lid 7 d of the casing 7 are respectively provided with a V-shaped protrusion 24 and a similarly V-shaped groove 23 which are mutually engageable such that they can be tightly joined together.
  • the thermistor element 1 and the two terminals 8 and 9 are already in a fixed positional relationship when they are inserted into the main part 7 c of the casing 7 , and hence the contact parts 10 do not rub the electrodes 2 and 3 during the insertion process.
  • a thermistor device as shown at 6 in FIG. 9 can be assembled without producing any scratches as shown at 13 in FIG. 10 on the electrodes 2 and 3 . Since no external force is applied on the peripheral parts of the thermistor element 1 throughout the process, no cracks are generated along the periphery of the thermistor element 1 .
  • FIG. 6 shows a variation on the fourth embodiment (“the fifth embodiment”) of the invention described above with reference to FIGS. 5A and 5B characterized by an improved shape of the throughholes 12 through the lid 7 d of the casing 7 .
  • the throughholes 12 are formed so as to have not only an extra clearance but also sloped surfaces 25 and 26 such that the terminals 8 and 9 supported by the lid 7 d can be tilted by an even larger angle, as indicated by a broken line.
  • This means that the gap between the two contact parts 10 can be increased even more without causing any unreasonable deformation such that even a thicker thermistor element can be sandwiched therebetween without having its electrodes scratched by the contact parts 10 .
  • the ability to increase the gap between the contact parts 10 also means that the thermistor element 1 can be more easily positioned therebetween and hence that the overall efficiency of the production process is thereby improved.
  • the sloped surfaces 25 and 26 may be provided to only one of the throughholes 12 .
  • FIG. 7 shows another thermistor device in the course of being produced by still another method according to a sixth embodiment of this invention. This method is similar to the first embodiment described above with reference to FIG. 1, but the thermistor device to be produced is characterized as having a plurality of thermistor elements.
  • FIG. 7 shows a method of making a thermistor device with only two thermistor elements 1 a and 1 b and one extra terminal 28 with a planar contact part 27 supported by the casing 7 , in addition to the terminals 7 and 8 shown in FIG. 1.
  • the terminals 8 , 9 and 28 are inserted into the casing 7 first and then the thermistor elements 1 a and 1 b are inserted.
  • FIG. 7 shows a point in time where one of the thermistor elements 1 a has already been inserted and the other thermistor element 1 b is about to be inserted. Since the thermistor elements 1 a and 1 b are inserted in similar manners, only the insertion of the second thermistor element 1 b will be described next.
  • a guide plate 14 is disposed between the electrode 3 thereon and the contact part 10 of the terminal 9 which has already been inserted into the casing 7 .
  • the thermistor element 1 b is then inserted into the casing 7 , as shown by arrow 29 , until its electrodes 2 and 3 reach positions opposite respectively to the contact parts 27 and 10 of the terminals 28 and 9 . After the thermistor element 1 b and the terminals 28 and 9 are properly positioned, the guide plate 14 is pulled out.
  • the method according to the sixth embodiment of the invention also has the same effects as the method according to the first embodiment described above but is particularly of interest because the present invention is hereby shown to be equally applicable to the production of a device wherein only one of the two terminals sandwiching an electronic element has an elastically bendable contact part, the other terminal having a non-elastic contact part.
  • any of the methods according to the second through fifth embodiments of the invention can be applied to the production of an electronic device containing two or more electronic elements such as the subject matter of the sixth embodiment.
  • the invention is not limited to thermistor devices encapsulating PTC thermistor elements.
  • the encapsulated electronic element may be a negative temperature coefficient thermistor, or a heat-generating element of any other kind.
  • it can be any electronic element as long as it has electrodes formed on its main surfaces which are substantially parallel to each other and facing outward oppositely away from each other. Neither are the physical properties of the two electrode layers 4 and 5 intended to limit the scope of the invention.
  • the invention is equally applicable to the production of an electronic device with an electronic element having electrodes of a single-layer structure.
  • the present invention introduces a method of assembling an electronic device by inserting an electronic element and terminals into a casing without having the electrodes scratched by the elastic contact parts of the terminals.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
US09/134,041 1997-09-19 1998-08-14 Method of making an electronic device Abandoned US20010016978A1 (en)

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US09/895,897 US6751862B2 (en) 1997-09-19 2001-06-29 Method of making an electronic device

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JP25446397A JP3346239B2 (ja) 1997-09-19 1997-09-19 電子部品の製造方法
JP9-254463 1997-09-19

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JP (1) JP3346239B2 (ja)
KR (1) KR100327097B1 (ja)
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TW (1) TW371767B (ja)

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US20060052682A1 (en) * 2004-09-07 2006-03-09 Joseph Abner D Biological testing system
US20070123109A1 (en) * 2005-11-28 2007-05-31 Hon Hai Precision Ind. Co., Ltd. High speed, card edge connector
US20080126794A1 (en) * 2006-11-28 2008-05-29 Jianxin Wang Transparent proxy of encrypted sessions
US20080315983A1 (en) * 2005-07-11 2008-12-25 Byoung-Koo Oh Safety Device For Preventing Propagation in Fracture of Ceramic Element
WO2019214922A1 (de) * 2018-05-08 2019-11-14 Tdk Electronics Ag Sensorvorrichtung aufweisend einen sockel mit federkontakten
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CN1126119C (zh) 2003-10-29
US6751862B2 (en) 2004-06-22
KR19990029833A (ko) 1999-04-26
US20010054233A1 (en) 2001-12-27
CN1218265A (zh) 1999-06-02
TW371767B (en) 1999-10-11
KR100327097B1 (ko) 2002-04-17
JPH1190746A (ja) 1999-04-06
JP3346239B2 (ja) 2002-11-18

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