US10488534B2 - Portable radiation image capturing apparatus - Google Patents

Portable radiation image capturing apparatus Download PDF

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Publication number
US10488534B2
US10488534B2 US16/078,885 US201616078885A US10488534B2 US 10488534 B2 US10488534 B2 US 10488534B2 US 201616078885 A US201616078885 A US 201616078885A US 10488534 B2 US10488534 B2 US 10488534B2
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United States
Prior art keywords
back plate
image capturing
capturing apparatus
radiation image
heat
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US16/078,885
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US20190018151A1 (en
Inventor
Manabu Kawaguchi
Kohei Miyoshi
Makoto Sumi
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Konica Minolta Inc
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Konica Minolta Inc
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Assigned to Konica Minolta, Inc. reassignment Konica Minolta, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYOSHI, KOHEI, KAWAGUCHI, MANABU, SUMI, MAKOTO
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • G01T1/244—Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • A61B6/4283—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by a detector unit being housed in a cassette
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T7/00—Details of radiation-measuring instruments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B42/00—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means
    • G03B42/02—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means using X-rays
    • G03B42/04—Holders for X-ray films

Definitions

  • the present invention relates to a portable radiation image capturing apparatus.
  • a radiation image capturing apparatus flat panel detector, also called a semiconductor image sensor
  • a plurality of radiation detecting elements are arranged two-dimensionally (matrix shape), charge is generated in the plurality of radiation detecting elements according to the amount of radiation which passes to the subject and is irradiated on the element, and a readout IC reads the charge as a signal value.
  • a portable radiation image capturing apparatus also called a FPD cassette
  • a sensor panel in which a plurality of radiation detecting elements are arranged is stored in a case.
  • the radiation image capturing apparatus reads out the signal value each time capturing is performed, and the signal value can be stored in the memory of the apparatus or transferred outside. Therefore, by using the radiation image capturing apparatus, the radiation can be irradiated a plurality of times on the capturing site of the subject, and moving image capturing such as dynamic capturing can be performed.
  • T time phases
  • the readout process of the signal value is performed in the radiation image capturing apparatus
  • electronic component such as the above-described readout IC and the power source circuit may generate heat.
  • the readout IC when the readout IC generates heat, the signal value read out as described above with the readout IC may change due to the heat, and the radiation image may not be suitably captured.
  • the captured radiation image may be blurred due to the heat of the readout IC and the power supply circuit and this may worsen the quality of the image.
  • Patent Document 1 discloses a radiation image capturing apparatus in which one end of a heat releasing member formed from a metallic material with a high thermal conductivity such as aluminum and copper is connected to an electronic component in the radiation image capturing apparatus, and the other end of the heat releasing member is attached to the inner side of a case. The heat from the electronic component is released to the case through the heat releasing member. With this, the temperature of the electronic component rising can be prevented.
  • the heat releasing member connecting the electronic component with the case since the heat releasing member connecting the electronic component with the case is relatively long, the heat from the electronic component may be released to the inside of the case from the heat releasing member while transmitting through the heat releasing member before reaching the case. With this, the temperature of the space inside the case may rise, and the efficiency of releasing the heat of the electronic component to the outside of the case may not be high.
  • This problem may occur in simple capturing (that is, capturing in which radiation is irradiated to the radiation image capturing apparatus once, and one radiation image is obtained).
  • moving image capturing such as the above-described dynamic capturing
  • the readout process of the signal value is repeatedly performed. Therefore, compared to simple capturing, the electronic component such as the readout IC, etc. may generate more heat when the signal value is read out. Consequently, the problem becomes more noticeable.
  • a portable radiation image capturing apparatus which is able to perform moving image capturing that when the signal value is read out, the heat of the electronic components such as the readout IC and the power supply circuit is efficiently released to the outside of the case and the efficiency of releasing the heat of such electronic components to the outside of the case is enhanced.
  • the present invention is conceived in view of the above points, and the purpose of the present invention is to provide a portable radiation image capturing apparatus which is able to enhance the efficiency of releasing the heat of the electronic component to the outside of the case.
  • a portable radiation image capturing apparatus reflecting one aspect of the present invention is provided with a sensor panel in which a plurality of radiation detecting elements are arranged two-dimensionally and a case which is formed with a front plate on a side where radiation enters and a back plate on an opposite side, wherein the sensor panel is stored in the case, the portable radiation image capturing apparatus including: an electronic component which is provided on the back plate side of the sensor panel and which generates heat when charge generated in the radiation detecting element is read out as a signal value; and a heat conductive member which is provided between the electronic component and the back plate, wherein the heat conductive member is positioned pressed between the back plate and the electronic component in a state in which the heat conductive member is in close contact with the electronic component and the heat conductive member is in close contact with the back plate.
  • FIG. 1 is a block diagram showing an equivalent circuit of a portable radiation image capturing apparatus according to the present embodiment.
  • FIG. 2 is a cross-sectional diagram showing a configuration of the portable radiation image capturing apparatus according to the present embodiment.
  • FIG. 3 is an enlarged diagram showing a portion near an edge of a sensor panel of the radiation image capturing apparatus according to the present embodiment.
  • FIG. 4A is a diagram showing a projection of a back plate formed in a straight line shape.
  • FIG. 4B is a diagram showing a projection of a back plate formed in an annular shape.
  • FIG. 5 is an enlarged diagram showing a heat conduction member provided between a power supply circuit and a back plate.
  • FIG. 6 is an enlarged diagram showing a configuration example of a base of a sensor panel.
  • FIG. 7 is a diagram showing an example of frame images captured in dynamic capturing of a chest of a patient.
  • the portable radiation image capturing apparatus may simply be referred to as a radiation image capturing apparatus.
  • the example below describes an indirect type radiation image capturing apparatus which is provided with a scintillator and in which irradiated radiation is converted to electromagnetic waves with other wavelengths such as visible light to obtain an electric signal.
  • a direct type radiation image capturing apparatus in which radiation is directly detected with a radiation detecting element without the scintillator can be applied to the present invention.
  • FIG. 1 is a block diagram showing an equivalent circuit of the radiation image capturing apparatus according to the present embodiment.
  • the radiation image capturing apparatus 1 includes a plurality of radiation detecting elements 7 arranged two-dimensionally (matrix state) on a later-described sensor substrate 50 (see later-described FIG. 3 , etc.).
  • the radiation detecting elements 7 are connected to bias lines 9 and reverse bias voltage from the bias power supply 14 is provided on the radiation detecting element 7 through the bias lines 9 and the connecting lines 10 connecting the bias lines 9 .
  • the radiation detecting elements 7 are connected to a TFT 8 (Thin Film Transistor) as a switch element and the TFT 8 is connected to a signal line 6 .
  • TFT 8 Thin Film Transistor
  • a scanning driver 15 on voltage and off voltage supplied from a power supply circuit 15 a through a line 15 c are switched with a gate driver 15 b and applied to lines L 1 to Lx of the scanning line 5 .
  • the TFTs 8 are in an off state when off voltage is applied through the scanning line 5 , the conduction between the radiation detecting element 7 and the signal line 6 is cut, and the charge is accumulated in the radiation detecting element 7 .
  • the TFTs 8 are in an on state when the on voltage is applied through the scanning line 5 , and the charge accumulated in the radiation detecting element 7 is discharged to the signal line 6 .
  • Each of the signal line 6 is connected to each readout circuit 17 in the readout IC 16 .
  • the TFT 8 In a readout process of a signal line D, when on voltage is applied to one line L in the scanning line 5 from the gate driver 15 b , the TFT 8 is in an on state, the charge from the radiation detecting element 7 flows in the readout circuit 17 through the TFT 8 and the signal line 6 , and an amplifying circuit 18 outputs a voltage value according to the amount of charge that flowed in.
  • a correlated double sampling circuit (described as “CDS” in FIG. 1 ) 19 reads out and outputs the voltage value output from the amplifying circuit 18 as a signal value D in an analog value.
  • the readout circuits 17 of the readout IC 16 reads the charge generated in the radiation detecting element 7 according to the amount of irradiated radiation as the signal value D.
  • the signal values D output from the amplifying circuit 18 are sequentially transmitted to a A/D converter 20 through an analog multiplexer 21 .
  • the signal values D are sequentially converted by the A/D converter 20 to the signal values D in a digital value, and are sequentially stored in a storage 23 .
  • the readout process is performed while sequentially applying on voltage to the lines L 1 to Lx of the scanning line 5 from the gate driver 15 b of the scanning driver 15 . With this, signal values D can be read from all of the radiation detecting elements 7 .
  • a controller 22 includes a computer in which a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input/output interface, etc. are connected by a bus and a FPGA (Field Programmable Gate Array) (all not shown).
  • the controller 22 may include a dedicated control circuit.
  • a storage 23 including a SRAM (Static RAM), a SDRAM (Synchronous DRAM), and a NAND type flash memory, and an internal power supply 24 including a lithium ion capacitor, etc. are connected to the controller 22 .
  • a communicating unit 30 to perform communication wirelessly or wired with outside devices through the above-described antenna 29 or connector 27 is connected to the controller 22 .
  • the controller 22 controls the applying of the reverse bias voltage from the bias power supply 14 to the radiation detecting elements 7 .
  • the controller 22 controls the operation of units such as the scanning driver 15 and the readout circuit 17 to perform the above-described readout process of the signal value D from the radiation detecting element 7 , to store the read out signal value D in the storage 23 or to transfer the stored signal value D to an outside device through the communicating unit 30 .
  • FIG. 2 is a cross-sectional diagram showing a configuration of a portable radiation image capturing apparatus according to the present embodiment.
  • a sensor panel SP also called a TFT panel
  • FIG. 2 shows a state in which the radiation image capturing apparatus 1 is positioned so that a radiation entry surface 41 A on which radiation is irradiated is on a lower side of the figure.
  • the direction showing top and bottom of the radiation image capturing apparatus 1 is described based on positioning the radiation image capturing apparatus 1 in a state as shown in FIG. 2 .
  • the case 40 of the radiation image capturing apparatus 1 is formed with a front plate 41 including a radiation entry surface 41 a formed in a substantial rectangular plate shape and a side wall portion 41 B provided standing to surround the outer edges of the radiation entry surface 41 A and a back plate 42 formed in a substantial plate shape.
  • the front plate 41 is formed with a fiber reinforced plastic such as a carbon fiber reinforced plastic (CFRP) and a glass fiber reinforced plastic (GFRP).
  • CFRP carbon fiber reinforced plastic
  • GFRP glass fiber reinforced plastic
  • the back plate 42 is formed with a metal such as copper, magnesium, aluminum, iron, etc. The configuration of the back plate 42 is described in detail later.
  • the back plate 42 is attached to the front plate 41 with a screw 43 .
  • the supporting column 44 is provided standing toward the back plate 42 side from a later-described base 50 of the sensor panel SP, and the sensor panel SP is fixed to the back plate 42 by screwing the back plate 42 to the supporting column 44 with the screw 43 .
  • Packing 41 C is provided throughout the entire circumference of the side wall portion 41 B of the front plate 41 . As described above, when the back plate 42 is screwed to the front plate 41 with the screw 43 , the back plate 42 is pressed against the packing 41 C. With this, the sealability of internal space formed by the front plate 41 and the back plate 42 of the case 40 of the radiation image capturing apparatus 1 is maintained
  • the packing (not shown) is provided not only in the side wall portion 41 B of the front plate 41 but also between the screw 43 screwed to the supporting column 44 and the back plate 42 , and the sealability of the portion of the screw 43 screwed to the supporting column 44 is maintained
  • the case 40 of the radiation image capturing apparatus 1 does not have to be a configuration provided with a front plate 41 including a side wall portion 41 B and a back plate 42 in a substantial plate shape as described above.
  • both the front plate and the back plate may include a side wall portion.
  • the front plate When the back plate is attached to the front plate, the front plate may be attached covering the back plate or the back plate may be attached covering the front plate.
  • the configuration is not limited to a specific configuration.
  • FIG. 3 is an enlarged diagram of a portion near an edge of the sensor panel SP of the radiation image capturing apparatus 1 according to the present embodiment.
  • the relative size and thickness of the base 50 , readout IC 16 , sensor substrate 51 , the radiation detecting element 7 , scintillator substrate 54 , and scintillator 55 do not reflect the relative size and thickness in the actual radiation image capturing apparatus 1 .
  • the surface of the substrate on the side facing the radiation entry surface 41 A of the front plate 41 (that is, surface on bottom side of the figure) is to be the front surface
  • the surface on the side facing the back plate 42 is to be the back surface
  • the sensor panel SP includes a base 50 including a metallic layer (not shown) such as lead which shields radiation.
  • the sensor substrate 51 including a glass substrate is provided on the front surface side of the base 50 .
  • the above-described plurality of radiation detecting elements 7 are arranged two-dimensionally on the surface of the sensor substrate 51 , and a flattening layer 52 is formed with an acrylic resin to cover the radiation detecting elements 7 .
  • a plurality of input/output terminals 53 are formed in the surrounding of the surface of the sensor substrate 51 , and the above-described signal lines 6 (see FIG. 1 ) are pulled out to be connected to the input/output terminals 53 .
  • a scintillator 55 is formed on the surface of one side of the scintillator substrate 54 including a glass substrate.
  • a scintillator including phosphor columnar crystals in which phosphor in which light emitting center matter is activated is grown in a columnar shape in a mother material such as Cs1:T1 is employed as the scintillator 55 , but the scintillator 55 is not limited to the above.
  • phosphor in a paste form can be applied to the scintillator substrate 54 to form an applied type scintillator.
  • the sensor substrate 51 and the scintillator substrate 54 are positioned so that the tip of the scintillator 55 comes into contact with the flattening layer 52 covering the radiation detecting elements 7 .
  • the sensor substrate 51 and the scintillator substrate 54 are attached to each other with an adhesive (not shown) at a portion on the outer side of the flattening layer 52 and the scintillator 55 (portion describing the signal line 6 in FIG. 3 ).
  • a flexible circuit substrate 56 in which a chip such as the readout IC 16 , etc. is embedded on a film is connected to the input/output terminal 53 through an anisotropic conductive adhesive material 53 A such as an anisotropic conductive film or anisotropic conductive paste.
  • the flexible circuit substrate 56 is connected to the PCB substrate 57 pulled to the back surface side of the base 50 . Although illustration is omitted, the wiring of the flexible circuit substrate 56 and the wiring formed on the PCB substrate 57 are connected.
  • the readout IC 16 is provided on an inner surface side of a bent flexible circuit substrate 56 but the readout IC 16 can be provided on an outer surface side of the bent flexible circuit substrate 56 . However, in either case, the readout IC 16 is provided in a position near the PCB substrate 56 on the flexible circuit substrate 56 , and the readout IC 16 is positioned on the back surface side of the base 50 (that is, a state facing the back plate 42 ).
  • the circuits such as the above-described controller 22 or storage 23 (see FIG. 1 ) or electronic members, etc. (hereinafter collectively referred to as electronic device 58 ) are provided on the PCB substrate 57 .
  • the electronic device 58 includes a power supply circuit 59 (see later-described FIG. 5 ) which converts and adjusts voltage to be suitable for the functional units such as the readout IC 16 , etc. which are supplied with the power supplied from the internal power supply 24 (see FIG. 1 ).
  • FIG. 2 describes the electronic device 58 positioned in one surface side of the PCB substrate 57 (front surface in the present embodiment, but the electronic device 58 can be positioned on the back surface side of the PCB substrate 57 (or both the front surface side and the back surface side).
  • the charge generated in the radiation detecting elements 7 flows through the signal line 6 and the flexible circuit substrate 56 and is transmitted to the back surface side of the sensor panel SP, that is, the back plate 42 side.
  • the charge is read out as the signal value D in the readout IC 16 , and is stored in the storage 23 on the PCB substrate 57 .
  • the sensor panel SP is formed as described above.
  • the electronic components which generate heat when the signal value D is read out for example, the readout IC 16 and the power supply circuit 59 are provided on the back plate 42 side of the sensor panel SP.
  • a spacer 60 is provided between the scintillator substrate 54 and the front plate 41 .
  • the electronic components as the target of heat release are the electronic components which are used to read out the charge generated in the radiation detecting element 7 when capturing is performed as a signal value D and which generates heat when the signal value D is read out.
  • Such electronic components include, a readout IC 16 , and the electronic device 58 such as the power supply circuit 59 .
  • the description below describes an example in which the electronic component as the target of heat release is the readout IC 16 .
  • a heat conductive member 61 is provided between the readout IC 16 which is the electronic component as the target of heat release and the back plate 42 .
  • the heat conductive member 61 is provided between the surface of the readout IC 16 facing the back plate 42 and the back plate 42 .
  • the heat conductive member 61 is pressed by the back plate 42 and the readout IC 16 when the back plate 42 is attached to the front plate 41 . With this, the above are provided so that the heat conductive member 61 is in close contact with the readout IC 16 and the heat conductive member 61 is in close contact with the back plate 42 .
  • the heat conductive member 61 positioned between the readout IC 16 and the back plate 42 is pressed by the back plate 42 , and the heat conductive member 61 is in close contact with the readout IC 16 .
  • the heat conductive member 61 is also in close contact with the back plate 42 .
  • the heat conductive member 61 is pressed squeezed between the readout IC 16 and the back plate 42 , and the heat conductive member 61 is in close contact with the readout IC 16 . Further, the heat conductive member 61 is in close contact with the back plate 42 .
  • the readout IC 16 , the heat conductive member 61 , and the back plate 42 are in close contact with each other and the heat conductive path from the readout IC 16 to the back plate 42 is securely formed. Therefore, the heat generated in the readout IC 16 is securely conducted from the readout IC 16 to the back plate 42 .
  • the heat conductive path that is, thickness of the heat conductive member 61
  • the heat generated in the readout IC 16 can be released outside of the case 40 of the radiation image capturing apparatus 1 from the back plate 42 .
  • the heat generated in the readout IC 16 is not trapped in the case 40 of the radiation image capturing apparatus 1 , and can be accurately released outside the apparatus. Therefore, the release of the heat of the readout IC 16 to outside the case 40 can be efficiently performed.
  • heat conductive member 61 for example, ethylene propylene rubber (EPR, EPDM) such as cool provide (registered trademark) and heat conductive sheet, heat conductive double-sided adhesive tape, or heat conductive spacer including a silicon or acrylic heat conductive layer can be used.
  • EPR ethylene propylene rubber
  • EPDM heat conductive sheet
  • heat conductive double-sided adhesive tape heat conductive double-sided adhesive tape
  • heat conductive spacer including a silicon or acrylic heat conductive layer
  • the heat conductive member 61 can include shock absorption. Even when shock is provided to the case 40 of the radiation image capturing apparatus 1 , the heat conductive member 61 absorbs the shock. Therefore, the shock is not transmitted to the readout IC 16 or the electronic components such as the power supply circuit 59 (or the shock transmitted to the readout IC 16 is reduced).
  • a projection 42 A projecting to the heat conducive member 61 side is formed in the back plate 42 in a position on the inner surface side in contact with the heat conducting member 61 .
  • the force is transmitted more accurately to the heat conductive member 61 by pressing with the projection 42 A of the back plate 42 . Therefore, compared to being pressed by a flat back plate 42 , the heat conductive member 61 is pressed and squeezed more between the readout IC 16 and the back plate 42 when pressed with the projection 42 A of the back plate 42 . Therefore, the heat conductive member 61 is in closer contact with the readout IC 16 . Further, the heat conductive member 61 is in closer contact with the back plate 42 .
  • the heat conducting path (that is, the thickness of the heat conductive member 61 ) becomes even shorter, and the heat conductive member 61 , the readout IC 16 , and the back plate 42 come into contact even closer. With this, the heat release efficiency to release the heat generated in the readout IC 16 to outside the case 40 is enhanced
  • the projection 42 A to the inner surface side of the back plate 42 can be formed by denting the back plate 42 toward the inside as shown in FIG. 2 . According to the above configuration, the projection 42 A can be easily formed. Other than the above, for example, the projection 42 A can be formed by forming this position of the back plate 42 thickly.
  • a plurality of readout IC 16 may be arranged aligned on the left side of FIG. 2 in a direction orthogonal to the sheet.
  • the projection 42 A (a projection 42 A shaped like one ridge when viewing the back plate 42 from the inside) is formed denting to the inside in a straight line shape the position of the back plate 42 corresponding to the portion where the plurality of readout IC 16 (not shown in FIG. 4A and FIG. 4B ) are aligned.
  • all of the heat conductive members 61 (not shown in FIG. 4A and FIG. 4B ) attached to the readout IC 16 can be pressed by one projection 42 A.
  • the projection 42 A can be formed in annular (annular square) surrounding the entire edge of the back plate 42 (that is, a projection 42 A of the back plate 42 shaped in an annular ridge when viewing the back plate 42 from inside).
  • An annular projection 42 A is not limited to one, and a plurality of projections 42 A can be provided.
  • the thickness of the heat conductive member 61 can be reduced in the amount of the distance that the back plate 42 is projected toward the inner surface side.
  • the density of the heat conductive member 61 is about the same as light metal such as aluminum and magnesium. This influences the weight of the apparatus, and the entire apparatus can be made lighter by making the heat conductive member 61 thinner.
  • the heat conducive member 61 By making the heat conducive member 61 thinner, the heat resistance from the readout IC 16 as the heat generating source to the back plate 42 can be made small, and the heat release efficiency is enhanced.
  • the radiation technician can hook his finger to the projection 42 A which projects to the inside of the back plate 42 . With this, it becomes easy to transport the radiation image capturing apparatus 1 .
  • the thickness of the heat conductive member 61 is formed to be 0. 5 mm to 6 mm, it is possible to configure a radiation image capturing apparatus with a thickness suitable for the standards of cassette sizes such as JISZ4095 while maintaining heat releasing properties.
  • the thickness is thin, the external shock is easily transmitted to the readout IC 16 . This leads to the image being blurred or the IC breaking.
  • the thickness is 1 mm to 3 mm.
  • the back plate 42 when the back plate 42 is formed with a metal, typically, since metal has a higher heat conductivity than plastic, the heat from the readout IC 16 can be diffused and released immediately by the back plate 42 , and the efficiency to release the heat generated in the readout IC 16 to outside the case 40 can be enhanced.
  • the heat releasing efficiency of the heat generated by the read out IC 16 to the outside of the case 40 can be enhanced even more.
  • the emissivity can be enhanced by surface processes such as applying a resin film with an emissivity higher than metal to enhance the heat releasing efficiency.
  • the electronic components used to read out the charge generated in the radiation detecting element 7 as the signal value D and which generates heat when the signal value D is read out is not limited to the above-described readout IC 16 , and the power supply circuit 59 which supplies power to the functional units such as the readout IC 16 is also included.
  • the same configuration as the configuration to release heat of the readout IC 16 is used to release the heat generated in the power supply circuit 59 to outside the back plate 42 .
  • the heat conductive member 61 is provided in the back plate 42 of the base 50 of the sensor panel SP, between the power supply circuit 59 provided on the PCB substrate 57 of (or the face facing the back plate 42 of the power supply circuit 59 ) and the back plate 42 (or the projection 42 A of the back plate 42 ).
  • the heat conductive member 61 is pressed between the back plate 42 and the power supply circuit 59 when the back plate 42 is attached to the front plate 41 . With this, the heat conductive member 61 is in close contact with the power supply circuit 59 . Further, the heat conductive member 61 is in close contact with the back plate 42 (or projection 42 A, same applies hereinafter).
  • the heat conductive member 61 When the back plate 42 is attached to the front plate 41 , the heat conductive member 61 is pressed and squeezed between the power supply circuit 59 and the back plate 42 . With this, the heat conductive member 61 is securely in close contact with the power supply circuit 59 and the back plate 42 . Therefore, the heat is securely conducted from the power supply circuit 59 to the back plate 42 through the heat conductive member 61 . With this, since the heat conductive path (that is, the thickness of the heat conductive material 61 ) becomes short, the heat generated in the power supply circuit 59 can be released outside of the case 40 of the radiation image capturing apparatus 1 from the back plate 42 .
  • the heat generated by the electronic components such as the power supply circuit 59 is not trapped in the case 40 of the radiation image capturing apparatus 1 , and the heat can be accurately released outside of the apparatus. With this, the release of the heat of the readout IC 16 to outside the case 40 can be performed very efficiently.
  • the illustration of the front plate 41 is omitted in FIG. 5 .
  • a supporting member 62 can be provided between the readout IC 16 and the base 50 of the sensor panel SP so that the readout IC 16 is not pushed and moved toward the sensor panel SP side by the back plate 42 (or the projection 42 A, same applies below) which comes near the sensor panel SP side.
  • the supporting member 62 is not provided between the power supply circuit 59 and the PCB substrate 57 .
  • the supporting member 62 can be provided between the power supply circuit 59 and the PCB substrate 57 or the base 50 (or between the portion where the power supply circuit 59 is attached to the PCB substrate 57 and the base 50 ).
  • the supporting member 62 can be a heat insulating member including heat insulating properties.
  • the supporting member 62 is formed with the heat insulating member, it is possible to cut the conducting of heat between the electronic component such as the readout IC 16 and the sensor panel SP with the supporting member 62 . With this, it is possible to prevent transmitting of the heat generated by the electronic component such as the readout IC 16 to the base 50 of the sensor panel SP.
  • the heat conducted to the base can be diffused in the surface direction by including metal or fiber reinforced plastic such as carbon fiber reinforced plastic so that the heat conductivity of the base 50 in the surface direction becomes high.
  • the portion of the sensor panel SP near the readout IC 16 is heated, and it is possible to prevent the problems such as the image blurring occurring in the portion of the radiation image corresponding to this portion.
  • the supporting member 62 as the heat conductive member including heat conductivity. If the base 50 of the sensor panel SP as described above is formed so that the heat conductivity in the surface direction (left and right direction in FIG. 3 ) is high, the heat generated in the readout IC 16 and conducted to the base 50 of the sensor panel SP through the supporting member 62 is diffused in the surface direction of the base 50 of the sensor panel SP. Therefore, it is possible to accurately prevent the problem of image blur occurring in the radiation image due to only the portion of the base 50 near the readout IC 16 being locally heated.
  • the base 50 in order to further enhance the conductivity of heat of the base 50 in the sensor panel SP in the surface direction, for example, as shown in FIG. 6 , the base 50 can be formed so that the layer 50 B with low heat conductivity is placed between the layers 50 A, 50 C with high heat conductivity (that is, each layer layered).
  • the layers 50 A, 50 C of the base 50 can include fiber reinforced plastic such as carbon fiber reinforced plastic (CFRP).
  • CFRP carbon fiber reinforced plastic
  • the layer 50 B of the base 50 with low heat conductivity can include Rohacell (registered trademark: hard plastic closed cell foam including polymethacrylimides (PMI) as the base) which is a foam with high hardness.
  • PMI polymethacrylimides
  • the heat generated in the readout IC 16 and conducted to the base 50 of the sensor panel SP through the supporting member 62 including heat conductivity is not conducted in the direction from the base 50 toward the radiation detecting element 7 (up and down direction in FIG. 6 ) due to the layer 50 B with low heat conductivity in the base 50 of the of the sensor panel SP preventing the conducting.
  • the heat is diffused in the surface direction of the base 50 along the layer 50 A of the base 50 extending in the direction orthogonal to the above (left and right direction in FIG. 6 ).
  • the base 50 of the sensor panel SP is configured as shown in FIG. 6 , it is possible to accurately enhance the heat conductivity in the surface direction of the base 50 orthogonal to the direction from the base 50 to the radiation detecting element 7 than the direction from the base 50 to the radiation detecting element 7 . Therefore, the heat is diffused in the surface direction of the base 50 . With this, it is possible to accurately prevent the problem of the image blur occurring in the radiation image due to only the portion of the base 50 near the readout IC 16 being heated locally.
  • the illustration of the scintillator 55 and the case 40 is omitted.
  • the supporting member 62 can have shock absorption. According to the above configuration, even when shock is applied to the case 40 of the radiation image capturing apparatus 1 , the shock is absorbed by the heat conductive member 61 and the supporting member 62 . Therefore, the shock is not transmitted to the readout IC 16 and the electronic components such as the power supply circuit 59 (or the shock transmitted to the readout IC 16 is reduced).
  • the readout IC 16 and the electronic components such as the power supply circuit 59 , etc. which generate heat when the signal value D is read out from the radiation detecting element 7 are provided on the back plate 42 side of the case 40 of the sensor panel SP, and the heat conductive member 61 is provided between the electronic components 16 , 59 and back plate 42 .
  • the back plate 42 is attached to the front plate 41 , the back plate 42 and the electronic components 16 , 59 press the heat conductive member 61 .
  • the heat conductive member 61 is provided so that the heat conductive member 61 is in close contact with the electronic components 16 , 59 , and the heat conductive member 61 is in close contact with the back plate 42 .
  • the electronic components 16 , 59 , the heat conductive member 61 , and the back plate 42 are in close contact with each other and the heat conductive path from the electronic components 16 , 59 to the back plate 42 is securely formed.
  • the heat generated in the electronic components 16 , 59 is securely conducted from the electronic components 16 , 59 to the back plate 42 .
  • the heat conducive path that is, the thickness of the heat conductive member 61
  • the heat generated in the electronic components 16 , 59 can be released to the outside of the case 40 of the radiation image capturing apparatus 1 from the back plate 42 .
  • the heat generated in the electronic components 16 , 59 is not trapped in the case 40 of the radiation image capturing apparatus 1 , and can be accurately released to outside the apparatus. With this, the release of the heat of the electronic components 16 , 59 to outside the case 40 can be performed with high efficiency.
  • the portable radiation image capturing apparatus 1 of the present embodiment even when moving image capturing is performed, the heat generated in the readout IC 16 and the electronic components such as the power supply circuit 59 can be released efficiently to outside the case 40 of the radiation image capturing apparatus 1 . Therefore, it is possible to accurately prevent problems such as the temperature rising in the sensor panel SP and the case 40 of the radiation image capturing apparatus 1 and the signal value D becoming an abnormal value. With this, the frame images in the moving image capturing can be accurately captured.
  • the present invention can be used in the field of radiation image capturing (specifically, medical field).

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  • Molecular Biology (AREA)
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  • Medical Informatics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
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  • Biophysics (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
US16/078,885 2016-02-22 2016-10-27 Portable radiation image capturing apparatus Active US10488534B2 (en)

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JP2016031005 2016-02-22
JP2016-031005 2016-02-22
PCT/JP2016/081817 WO2017145443A1 (fr) 2016-02-22 2016-10-27 Dispositif de radiographie portable

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JP6932095B2 (ja) * 2018-03-06 2021-09-08 富士フイルム株式会社 放射線画像検出装置
JP2020049161A (ja) * 2018-09-28 2020-04-02 富士フイルム株式会社 放射線検出装置
JP7199944B2 (ja) * 2018-12-06 2023-01-06 キヤノン株式会社 放射線撮影装置
US20210048543A1 (en) * 2019-08-13 2021-02-18 Vieworks Co., Ltd. X-ray detector cover and x-ray detector having same
CN113053677B (zh) * 2019-12-26 2023-12-01 佳能株式会社 电源单元和包括电源单元的放射线摄像装置
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JP6791238B2 (ja) 2020-11-25

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