TWM618997U - Improved substrate separating device - Google Patents

Abstract

The present model provides an improved substrate separation device, which includes a base and an adsorption mobile module. The suction moving module includes a suction element, a lifting mechanism, a main body and a plurality of elastic abutments. The adsorption element adsorbs a second substrate, the lifting mechanism is connected to the adsorption element, and drives the adsorption element and its second substrate to be lifted relative to the base, and the main body is connected to the base and the lifting mechanism, and drives the adsorption element and the second substrate adsorbed by it With respect to the displacement of the base, the elastic abutment is connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate compresses the elastic abutment to make it in a compressed state, and when the adsorption element releases the suction force on the second substrate, The elastic abutment is released from the compressed state and stretched, so that the second substrate is separated from the adsorption element.

Description

Improved substrate separation device

The present invention relates to an improved substrate separation device, which uses an adsorption and movement module to separate a second substrate bonded to a first substrate from a first substrate, and the adsorption and movement module further separates the second substrate from the first substrate. The two substrates are moved to a placement area for placement.

Integrated circuit technology has developed to a mature stage. At present, electronic products are developing towards the trend of light and thin, high performance, high reliability and intelligence. The chip in the electronic product will have a significant impact on its performance, and the thickness of the chip is particularly related to the performance of the electronic product. For example, a thinner chip can improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce the size and weight of the package.

In the semiconductor manufacturing process, processes such as substrate thinning, through hole etching, and back metalization are usually performed on the back (lower surface) of the wafer. However, when the thickness of the wafer (first substrate) is too thin (for example, less than or equal to 150 microns), the wafer may be cracked or deformed during the thinning process. Generally speaking, before the substrate thinning, the first substrate and the second substrate (for example, the sapphire substrate) are bonded first, and after the thinning process is completed, the bonding is performed to separate the first substrate from the second substrate .

In the debonding process, the second substrate is usually adsorbed by a vacuum suction module to separate the second substrate from the wafer (first substrate). However, when the vacuum suction module wants to remove or release the second substrate, the vacuum state is often not completely released, and the second substrate may jump, and the second substrate cannot be placed on the placement table smoothly and accurately. The second substrate is damaged and the debonding machine is contaminated.

In order to solve the above-mentioned problems faced by the prior art, the present invention proposes an improved substrate separation device, which is mainly provided with a plurality of elastic abutments on the adsorption mobile module, so that when the adsorption mobile module removes or releases the second substrate to the placing table , The elastic abutting member continuously abuts against the second substrate to separate the second substrate from the adsorption element while maintaining the second substrate stably against the placement table.

An object of the present invention is to provide an improved substrate separation device, including a base and a suction mobile module, wherein the suction mobile module is connected to the base, and mainly includes a suction element, a lifting mechanism and a plurality of elastic Pieces. The lifting mechanism is connected to the adsorption element and drives the adsorption element and its second substrate to be lifted relative to the base. The elastic abutment is connected to the lifting mechanism. When the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutment to make it in position When the suction element releases the suction force on the second substrate, the elastic abutment will be released from the compressed state and stretched, and continue to abut against the second substrate, so that the second substrate is separated from the suction element, while maintaining the second substrate stable against Stick it on the placement table of the base.

An object of the present invention is to provide an improved substrate separation device, which includes a base and an adsorption mobile module, wherein the base includes a separation area and a placement area, and the placement area includes a placement table. The suction mobile module is connected to the base, and includes a suction element, a lifting mechanism, a main body and a plurality of elastic abutments. The lifting mechanism is connected to the adsorption element and drives the adsorption element and its second substrate to be lifted relative to the base. The body is connected to the base and the lifting mechanism, and drives the adsorption element and its adsorbed second substrate between the separation zone and the placement zone Displacement, the elastic abutment is connected to the lifting mechanism. Wherein, when the adsorption element adsorbs the second substrate located in the separation zone, the second substrate compresses the elastic abutment to make it in a compressed state. After that, the suction mobile module moves to the top of the placement area, and the lifting mechanism drives the suction component and the second substrate it sucked down until the second substrate touches the placement table. The suction component releases the suction force on the second substrate and is driven by the lifting mechanism. Ascends, the elastic abutment member is released from the compressed state and continuously abuts against the second substrate, so that the second substrate is separated from the adsorption element, while maintaining the second substrate stably against the placement table.

In order to achieve the above objective, the present invention proposes an improved substrate separation device, which includes a base and an adsorption mobile module. The base includes a separation zone and a placement zone. The separation zone is provided with: a carrying unit suitable for carrying A carrier board and a heating unit for heating a first substrate and a second substrate that have been bonded, a placing table is arranged in the placing area, and the adsorption mobile module includes: an adsorption element for adsorbing the second substrate; A lifting mechanism is connected to the adsorption element, and drives the adsorption element and its second substrate to be lifted relative to the base; a body is connected to the base and the lifting mechanism, and drives the adsorption element and the adsorbed second substrate in the separation zone and And a plurality of elastic abutments connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate will compress the elastic abutment to make it in a compressed state, and the adsorption element releases the second substrate When the suction force is applied, the elastic abutment will be released from the compressed state and stretched, so that the second substrate will be separated from the suction element.

In the improved substrate separation device, the elastic abutment includes an elastic part connected to the lifting mechanism, and a contact part connected to the elastic part for contacting with the second substrate.

In the improved substrate separation device, the elastic part includes a spring.

In the improved substrate separation device, the adsorption mobile module further includes a connecting member connected to the main body. The lifting mechanism connects the suction element through the connection piece, and drives the connection piece, the suction element and the sucked second substrate to move up and down relative to the main body and the base. The elastic abutting piece is connected to the lifting mechanism through the connecting piece. According to some embodiments of the present invention, the lifting mechanism includes a hydraulic component or a motor, which is connected to the connecting piece, and drives the connecting piece, the suction component and the sucked second substrate to move up and down relative to the main body and the base.

In the improved substrate separation device, a plurality of elastic abutments are arranged around the adsorption element.

The improved substrate separation device has at least two, at least three, or at least four elastic abutments, which are arranged around the adsorption element. Preferably, when the elastic abutment member is released from the compressed state to extend, the moment generated by the force applied to the second substrate cancels each other out, so that the second substrate can stably abut on the placement table when it leaves the adsorption element. For example, two elastic abutments are arranged on both sides of the suction element, and three or more elastic abutments are arranged around the suction element at equal intervals.

In the improved substrate separation device, the adsorption mobile module is above the separation zone, the lifting mechanism drives the adsorption element and the elastic abutment to descend, the elastic abutment abuts against the second substrate, and the lifting mechanism drives the adsorption to continue to descend. The elastic abutment is compressed from a relaxed state until the adsorption element contacts the second substrate, and the adsorption element adsorbs the second substrate, or the adsorption mobile module is above the placement area, and the lifting mechanism drives the adsorption element and the second substrate adsorbed by it. Lowering until the second substrate touches the placement table, the suction element releases the suction force of the second substrate and is driven by the lifting mechanism to rise, the elastic abutment member is released from the compressed state and continues to abut against the second substrate, so that the second substrate leaves the suction element . In the improved substrate separation device, the elastic abutment will protrude from the adsorption element in a relaxed state.

In the improved substrate separation device, the base includes a track, and the suction mobile module is connected to the base through the track, and is displaced relative to the base along the track.

In the improved substrate separation device, the bearing unit includes a plurality of lifting rods and a bearing platform. The carrier, the first substrate, and the second substrate are approached toward the carrier to place the carrier, the first substrate, and the second substrate on the carrier.

In the improved substrate separation device, the carrier has a plurality of perforations.

In the improved substrate separation device, the adsorption unit of the adsorption mobile module adsorbs the second substrate located in the separation zone, and the main body drives the adsorption element and the second substrate adsorbed by it to slide relative to the first substrate, so that the second substrate is moved from the first substrate. The substrate is separated.

Please refer to FIG. 1 and FIG. 2, which are drawn according to an embodiment of the present invention. As shown in the figure, the improved substrate separation device includes a base 11 and a suction moving module 17. The base 11 includes a separation area 13, a placement area 15 and a track 111.

The separation zone 13 is provided with a carrying unit 131, which is suitable for carrying a carrier C, a heating unit (not shown) for heating a first substrate W and a second substrate S that have been bonded, and a vacuum unit ( Not shown in the figure) to adsorb the first substrate W. The carrying unit 131 includes a plurality of lifting rods 1311 and a carrying platform 1313. The placing area 15 is provided with a placing table 151.

In this embodiment, the carrier C is a SiC carrier, the first substrate W is a wafer, and the second substrate S is a sapphire substrate, but the present invention is not limited to this.

The suction moving module 17 includes a suction element 175, a lifting mechanism 173, a main body 171 and a plurality of elastic abutments 177.

The adsorption element 175 includes but is not limited to a vacuum adsorption element (for example, a vacuum chuck), which is used to adsorb the second substrate S.

The lifting mechanism 173 is connected to the adsorption element 175 and drives the adsorption element 175 and the second substrate S adsorbed by it to rise and fall relative to the base 11. Please refer to FIG. 3, FIG. 4 and FIG. 5 together. In this embodiment, the suction moving module 17 further includes a connecting member 174, which is connected to the main body 171 through a rail 172, and the lifting mechanism 173 is connected to the suction element 175 through the connecting member 174. The elastic abutting member 177 is connected to the lifting mechanism 173 through the connecting member 174. For example, the lifting mechanism 173 includes a hydraulic component, a motor, an air cylinder, or a screw, etc., and drives the connecting member 174, the suction component 175, and the second substrate S absorbed by it to go up and down relative to the main body 171 and the base 11.

The main body 171 is connected to the lifting mechanism 173, and is connected to the base 11 through the rail 111, so that the suction mobile module 17 can move along the rail 111 relative to the base 11, wherein the main body 171 drives the suction element 175 and the second substrate S adsorbed by it. It moves along the track 111 between the separation area 13 and the placement area 15.

Please refer to FIG. 4 and FIG. 5 together. The elastic abutment 177 includes an elastic portion 1771 and a contact portion 1773. The elastic portion 1771 is connected to the lifting mechanism 173 through the connecting member 174. The contact portion 1773 is connected to the elastic portion 1771 and used to contact the second substrate S. Generally speaking, the elastic portion 1771 includes a telescopic rod body and a spring, and the spring is sleeved on the telescopic rod body; the contact portion 1773 is made of a material suitable for contact with the second substrate S, such as a plastic.

When the adsorption element 175 adsorbs the second substrate S, the second substrate S will compress the elastic abutment 177 to make it in a compressed state, and when the adsorption element 175 releases the suction force on the second substrate S, the elastic abutment 177 will be removed from the The compressed state is released and extended, so that the second substrate S is separated from the adsorption element 175. Please refer to FIG. 5 again, the elastic abutment 177 protrudes from the suction element 175 in its relaxed state. As shown in the figure, the elastic member 177 has a height h1 in the relaxed state, and the suction element 175 has a height h2, where h1 is greater than h2.

To use an improved substrate separation device to debond the bonded first substrate W and second substrate S, as shown in FIG. 1, first place the carrier C on the plurality of lifting rods 1311 of the carrier unit 131 (at this time The lifting rod 1311 is in a raised state), and then the bonded first substrate W and the second substrate S are placed on the carrier C, the first substrate W faces downwards and is in contact with the carrier C. The lifting rod 1311 descends, and drives the loaded carrier C, the first substrate W, and the second substrate S to approach the carrier 1313 to place the carrier C, the first substrate W, and the second substrate S on the carrier 1313. Next, the heating unit (not shown) heats the first substrate W and the second substrate S to soften the adhesive bonding the two.

The suction moving module 17 moves along the rail 111 to above the separation zone 13, the lifting mechanism 173 drives the suction element 175 and the elastic abutment 177 to descend, the elastic abutment 177 abuts against the second substrate S, and the lifting mechanism 173 drives the suction element 175 Continue to descend, the elastic abutment 177 is compressed from a relaxed state until the adsorption element 175 contacts the second substrate S, at this time, the adsorption element 175 adsorbs the second substrate S. At the same time, the vacuum unit (not shown) also sucks the first substrate W. In this embodiment, the carrier C has a plurality of perforations (not shown), and the vacuum unit sucks the first substrate W through the plurality of perforations of the carrier C.

Then, the main body 171 drives the adsorption element 175 and the second substrate S adsorbed by it to slide relative to the first substrate W, so that the second substrate S is separated from the first substrate W. Please refer to FIGS. 3, 4, and 5, the suction moving module 17 moves along the track 111 to the top of the placement area 15, and the lifting mechanism 173 drives the suction element 175 and the second substrate S adsorbed by it to descend until the second substrate S Contacting the placement table 151 (as shown in FIG. 4), the suction element 175 releases the suction force on the second substrate S and is driven by the lifting mechanism 173 to rise. The elastic abutment 177 is released from the compressed state and continuously abuts against the second substrate S , The second substrate S is moved away from the adsorption element 175, while maintaining the second substrate S stably against the placement table 151 (as shown in FIG. 5).

Finally, the plurality of lifting rods 1311 of the carrying unit 131 are raised again (at this time the suction of the vacuum unit has been released), driving the carrying carrier C and the first substrate W retained on it away from the carrying table 1313, and then the wafer robot The carrier C and the first substrate W are moved to a cleaning machine for cleaning, and the debonding process is completed after cleaning.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

11: Pedestal 111: Orbit 13: separation zone 131: Carrying unit 1311: Lifting rod 1313: bearing platform 15: Placement area 151: place table 17: Adsorption mobile module 171: Body 172: Orbit 173: Lifting mechanism 174: Connector 175: Adsorption component 177: Elastic component 1771: Elastic part 1773: Contact C: Carrier board W: first substrate S: second substrate

[Figure 1] is a three-dimensional schematic diagram of an embodiment of the present invention.

[Figure 2] is a three-dimensional schematic diagram of an embodiment of the present invention.

[Figure 3] is a three-dimensional schematic diagram of an embodiment of the present invention.

[Fig. 4] is a schematic cross-sectional view of an embodiment of the new type.

[Figure 5] is a schematic cross-sectional view of an embodiment of the new type.

151: place table

17: Adsorption mobile module

171: Body

173: Lifting mechanism

174: Connector

175: Adsorption component

177: Elastic component

1771: Elastic part

1773: Contact

S: second substrate

Claims (10)

An improved substrate separation device, including: A base, including: A separation zone, provided with a carrying unit suitable for carrying a carrier board; and a heating unit for heating a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded to each other; and A placement area with a placement platform; and A suction mobile module, including: An adsorption element for adsorbing the second substrate; A lifting mechanism connected to the adsorption element, and drives the adsorption element and the second substrate adsorbed by it to rise and fall relative to the base; A body that connects the base and the lifting mechanism, and drives the adsorption element and the second substrate adsorbed by it to move between the separation zone and the placement zone; and A plurality of elastic abutments are connected to the lifting mechanism, wherein when the adsorption element adsorbs the second substrate, the second substrate compresses the elastic abutment to make it in a compressed state, and the adsorption element releases the second substrate When the suction force is applied, the elastic abutment member will be released from the compressed state and stretched, so that the second substrate leaves the suction element. The improved substrate separation device according to claim 1, wherein the elastic resist includes: An elastic part connected to the lifting mechanism; and A contact part is connected to the elastic part for contact with the second substrate. The improved substrate separation device according to claim 2, wherein the elastic portion includes a spring. The improved substrate separation device according to claim 1, wherein the plurality of elastic abutments are arranged around the adsorption element. The improved substrate separation device according to claim 1, wherein: The suction moving module is above the separation zone, the lifting mechanism drives the suction element and the elastic abutment to descend, the elastic abutment abuts against the second substrate, the lifting mechanism drives the adsorption element to continue to descend, the The elastic abutment is compressed from a relaxed state until the adsorption element contacts the second substrate, and the adsorption element adsorbs the second substrate; or The suction moving module is above the placement area, and the lifting mechanism drives the suction element and the second substrate adsorbed by it to descend until the second substrate contacts the placement table, and the suction element releases the suction force of the second substrate Driven by the lifting mechanism to rise, the elastic abutment member is released from the compressed state and continuously abuts against the second substrate, so that the second substrate leaves the adsorption element. The improved substrate separation device according to claim 5, wherein the elastic abutment member protrudes from the adsorption element in the relaxed state. The improved substrate separation device according to claim 1, wherein the base includes a track, and the suction and movement module is connected to the base through the track, and is displaced relative to the base along the track. The improved substrate separation device according to claim 1, wherein the carrying unit includes a plurality of lifting rods and a carrying platform, and the lifting rods are used to carry the carrier board and the first substrate and the second substrate placed thereon , And drive the carried carrier board, the first substrate and the second substrate to approach the carrying platform, so as to place the carrier board, the first substrate and the second substrate on the carrying platform. The improved substrate separation device according to claim 1, wherein the carrier plate has a plurality of perforations. The improved substrate separation device according to claim 1, wherein the adsorption unit of the adsorption movement module adsorbs the second substrate located in the separation zone, and the body drives the adsorption element and the adsorbed second substrate relative to The first substrate slides to separate the second substrate from the first substrate.

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