TWM613007U - Substrate debonder - Google Patents

Abstract

This case discloses a substrate separation device, which includes a base, a temperature changing table, a buffer table, a sliding device and a stopper. In the debonding process, the suction device of the sliding device can suck the upper surface of the first carrier to separate the first carrier from the combined substrate. Then, the sliding device drives the suction device and the first carrier to move above the buffer table, and The stopper contacts the upper surface of the first carrier board to prevent the first carrier board from being sucked by the sucking device when the sucking device moves upward, so that the first carrier board stays in the buffer table.

Description

Substrate separation device

The present invention relates to a substrate separation device, in particular to a substrate separation device that blocks a first carrier board from being absorbed by a suction device through a stopper, so that the first carrier board stays in a buffer table.

The development of integrated circuit technology has matured, and current electronic products are developing towards the trend of light, thin, short, high performance, high reliability and intelligence. The chip (substrate) in the electronic product has an important impact on the performance of the electronic product, and the aforementioned performance is partly related to the thickness of the chip. For example, a thinner chip can improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce the size and weight of the package.

In the semiconductor manufacturing process, a substrate thinning process, a via etching process, and a back metallization process are usually performed on the back side (ie, the lower surface) of the wafer. However, when the thickness of the substrate of the wafer of the wafer is too thin (for example, less than or equal to 150 microns), the wafer may be broken or deformed during the substrate thinning process, thereby causing the wafer Unable to use and reduce chip yield. Generally speaking, before the substrate thinning process, a bonding process is performed to bond the wafer to a carrier (for example, sapphire glass), and after the substrate thinning process, a debonding process is performed to bond the crystal The circle is separated from the carrier board.

In the debonding process, the carrier board is usually sucked by a vacuum suction device to separate the carrier board from the wafer. However, when the vacuum suction device wants to remove the carrier board, the vacuum state is often not completely released, causing the carrier board to stay in the vacuum suction device and may fall at a non-target position, resulting in damage to the debonding machine or dirty .

Therefore, in order to overcome the shortcomings of the conventional technology, an embodiment of the present invention provides a substrate separation device, which can assist the removal of the carrier board from the suction device.

Based on at least one of the foregoing objectives, the substrate separation device provided by the embodiment of the present invention includes a base, a temperature changing table, a buffer table, and a sliding device. The base includes a sliding track. The temperature-changing stage is located on the base and controls the melting of the adhesive between the top surface of the combined substrate and the bottom surface of the first carrier through temperature-changing. The buffer stage is located on the base and is used to carry the first carrier plate separated from the combined substrate. The sliding device is connected to the sliding track of the base and displaces between the temperature changing table and the buffer table, and the sliding device includes a body, a lifting device, a suction device and at least one stopper. The body is connected to the sliding track of the base. The lifting device is connected to the body. The suction device is connected to the lifting device, and the lifting device drives the suction device to rise and fall relative to the main body through the lifting device. The stopper is connected to the body. The sliding device is above the temperature-changing table, and the lifting device drives the suction device to move downwards, so that the suction device absorbs the upper surface of the first carrier board, wherein the body of the sliding device drives the suction device and the first carrier board to move above the buffer table , And the lifting device drives the suction device to move upward, and the stopper contacts the upper surface of the first carrier board to prevent the first carrier board from being sucked by the suction device, so that the first carrier board stays in the buffer table.

Optionally, when the sliding device slides above the buffer table, the vertical distance between the stopper and the buffer table is 1-10 mm.

Optionally, the stopper further includes a connecting portion and a contact portion, the contact portion of the stopper is connected to the body of the sliding device through the connecting portion, and the contact portion is used to contact the upper surface of the first carrier board, wherein the connecting portion is made of Metal, and the material of the contact part is plastic.

Optionally, the substrate separation device further includes a temperature control module, which is connected to the temperature change table to control the temperature of the temperature change table.

Optionally, the buffer table further includes at least one air jet located on the upper surface of the buffer table, wherein the first carrier plate is driven to the buffer table by the suction device, and the air jet provides gas to cool the adhesion of the bottom surface of the first carrier plate Agent to prevent the first carrier from sticking to the buffer table.

Based on at least one of the foregoing objectives, the substrate separation device provided by the embodiment of the present invention includes a base, a temperature changing stage, a buffer stage, at least one stopper, and a sliding device. The base includes a sliding track. The temperature-changing stage is located on the base, and the temperature is changed to control the melting of the adhesive between the top surface of the combined substrate and the bottom surface of the first carrier board. The buffer stage is located on the base and is used to carry the first carrier plate separated from the combined substrate. The stopper is adjacent to the buffer platform. The sliding device is connected to the sliding track of the base, and is displaced between the temperature changing table and the buffer table, and the sliding device includes a body, a lifting device and a suction device. The body is connected to the sliding track of the base. The lifting device is connected to the body. The suction device is connected to the lifting device, and the lifting device drives the suction device to lift relative to the body. The sliding device is above the temperature-changing table, and the lifting device drives the suction device to move downwards, so that the suction device absorbs the upper surface of the first carrier board, wherein the body of the sliding device drives the suction device and the first carrier board to move above the buffer table , The stopper moves above the first carrier board, and the lifting device drives the suction device to move upward, and the stopper contacts the upper surface of the first carrier board Surface to prevent the first carrier board from being adsorbed by the suction device, so that the first carrier board stays in the buffer table. Optionally, when the stopper is displaced above the first carrier board, the vertical distance between the stopper and the buffer table is 1-10 mm.

Optionally, the stopper further includes a connecting portion and a contact portion, the contact portion of the stopper is connected to the body of the sliding device through the connecting portion, and the contact portion is used to contact the upper surface of the first carrier board, wherein the connecting portion is made of Metal, and the material of the contact part is plastic.

Optionally, the substrate separation device further includes a temperature control module, which is connected to the temperature change table to control the temperature of the temperature change table.

Optionally, the buffer table further includes at least one air jet located on the upper surface of the buffer table, wherein the first carrier plate is driven to the buffer table by the suction device, and the air jet provides gas to cool the adhesion of the bottom surface of the first carrier plate Agent to prevent the first carrier from sticking to the buffer table.

In short, the substrate separation device provided by the embodiment of the present invention can assist the carrier plate to be removed from the suction device without staying in the suction device, so as to prevent the carrier plate from falling at a non-target position, thereby preventing damage or damage to the debonding machine. Dirt is generated, so the market that has a demand for the debonding process has an advantage.

In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, detailed descriptions are made as follows in conjunction with the accompanying drawings.

1, 2: Substrate separation device

11: Pedestal

111: Sliding track

13: Variable temperature platform

15: buffer table

151: Jet Port

17, 27: sliding device

171, 271: Ontology

173, 273: Lifting device

175, 275: suction device

177, 29: stop

177A, 29A: connecting part

177B, 29B: contact part

S0: Combination board

S1: The first carrier board

S2: Wafer

S3: second carrier board

Fig. 1 is a schematic diagram of a substrate separation device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a substrate separation device according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of a substrate separation device according to another embodiment of the present invention.

Fig. 4 is a schematic diagram of a substrate separation device according to another embodiment of the present invention.

In order to fully understand the purpose, features and effects of the present invention, a detailed description of the present invention is given with the following specific embodiments and accompanying drawings. The description is as follows.

Please refer to FIG. 1 and FIG. 2. FIG. 1 and FIG. 2 are schematic diagrams of a substrate separation device according to an embodiment of the present invention. As shown in the figure, the substrate separation device 1 includes a base 11, a temperature-changing table 13, a buffer table 15 and a sliding device 17, wherein the temperature-changing table 13 and the buffer table 15 are both located on the base 11. In an embodiment, the temperature-variable stage 13 and the buffer stage 15 are arranged adjacently, but the present invention is not limited to this.

The base 11 includes a sliding track 111, and the sliding device 17 is connected to the sliding track 111 of the base 11 so that the sliding device 17 can be horizontally displaced between the temperature changing table 13 and the buffer table 15. In one embodiment, the sliding rail 111 is two long rails, and they are located on the two outer sides of the temperature changing table 13 and the buffer table 15 adjacent to each other, but the present invention is not limited to this. The sliding rails 111 can also be two L-shaped rails or form other paths, and are located on the two outer sides of the temperature change table 13 and the buffer table 15 that are not adjacent to each other.

The sliding device 17 includes a body 171, a lifting device 173, a suction device 175 and at least one stopper 177. The suction device 175 is connected to the lifting device 173, the lifting device 173 and the stopper 177 are connected to the body 171, and the body 171 is connected to the sliding track 111 of the base 11 to drive the lifting device 173, the suction device 175 and the stopper 177 along the sliding track 111 displacement.

Specifically, the lifting device 173 is higher than the main body 171, and can drive the suction device 175 to lift (vertical displacement) relative to the main body 171. The stopper 177 is located below the main body 171, and can be adjacent to and higher than the temperature change table 13 or the buffer table 15 during the displacement of the sliding device 17 along the sliding rail 111, wherein the sliding device 173 slides to the buffer table 15 When it is up, the vertical distance between the stopper 177 and the buffer table 15 is 1-10 mm.

When the first carrier board S1 and the combined substrate S0 (including the wafer S2 and the second carrier board S3) that are bonded to each other are to be debonded, the first carrier board S1 and the combined substrate S0 arranged perpendicular to each other are placed on the temperature changing table 13 , Wherein the first carrier board S1 is located at the uppermost layer, the wafer S2 is located between the first carrier board S1 and the second carrier board S3, and the second carrier board S3 is located at the lowermost layer.

In one embodiment, the temperature change platform 13 further includes a plurality of lift pins (not shown), and the raised lift pins can be vertically downward after carrying the first carrier board S1 and the combined substrate S0 The displacement drives the lowering of the first carrier board S1 and the combined substrate S0 so that the bottom surface of the combined substrate S0 contacts the temperature change stage 13. Furthermore, the temperature change platform 13 may also include a vacuum module (not shown). When the bottom surface of the composite substrate S0 contacts the temperature change platform 13, the vacuum module uses a vacuum suction method to fix the composite substrate S0 on the temperature change platform 13.

Please refer to FIG. 1, when the first carrier board S1 and the combined substrate S0 are placed on the temperature-changing stage 13, the temperature-changing stage 13 can control the melting of the adhesive between the top surface of the combined substrate S0 and the bottom surface of the first carrier board S1 by changing the temperature . Specifically, the substrate separation device 1 further includes a temperature control module (not shown), and the temperature control module is connected to the temperature change stage 13, and is used to control the temperature of the temperature change stage 13, thereby controlling the top surface of the combined substrate S0 and the first The adhesive between the bottom surfaces of the carrier board S1 melts.

Then, the sliding device 17 is displaced above the temperature changing table 13 and drives the lifting device 173 and the suction device 175 to move to the top of the first carrier S1 and the combined substrate S0. Then, the lifting device 173 drives the suction device 175 to move downward, so that the suction device 175 absorbs the upper surface of the first carrier S1, wherein the suction device 175 is, for example, but not limited to, a vacuum suction device.

Next, referring to FIG. 2, the sliding device 17 drives the suction device 175 and the first carrier S1 to move above the buffer table 15, so that the buffer table 15 carries the first carrier S1 separated from the combined substrate S0, and the combined substrate S0 is Stay at the variable temperature station 13. Further, the lifting device 173 drives the suction device 175 upward The stopper 177 contacts the upper surface of the first carrier board S1 to prevent the first carrier board S1 from being sucked by the suction device 175 so that the first carrier board S1 stays in the buffer table 15. In this way, the first carrier S1 can be prevented from being attracted to the suction device 175. When the sliding device 17 is above the buffer table 15, the vertical distance between the stopper 177 and the buffer table 15 is, for example, but not limited to, 1-10 mm.

In an embodiment, the buffer table 15 further includes at least one air jet 151 located on the upper surface of the buffer table 15. When the first carrier board S1 is driven to the buffer table 15 by the suction device 175, the air jet 151 can provide gas to cool the adhesive on the bottom surface of the first carrier board S1, and prevent the first carrier board S1 from sticking to the buffer table 15. Furthermore, the buffer table 15 may also include a plurality of lifting jacks, which can be vertically displaced to drive the first carrier S1 to contact or not contact the buffer table 15.

In one embodiment, the stopper 177 is composed of a connecting portion 177A and a contact portion 177B, and the contact portion 177B of the stopper 177 is connected to the body 171 of the sliding device 17 through the connecting portion 177A, and the contact portion 177B is used to contact the first carrier. On the upper surface of the board S1, the material of the connecting portion 177A can be metal, and the material of the contact portion 177B can be plastic. In other embodiments, the stopper 177 may also be integrally formed and made of a material, such as plastic.

In other embodiments, the stopper 177 may not be located on the body 171. Please refer to Figure 3 and Figure 4. 3 and 4 are schematic diagrams of a substrate separation device according to another embodiment of the present invention. The components (base 11, temperature change stage 13, buffer stage 15) and functions of the substrate separation device 2 are substantially the same as those in the previous embodiment, so they will not be repeated. The only difference lies in the position of the stopper 29 and the structure of the sliding device 27. different.

As shown in FIG. 3 and FIG. 4, the stopper 29 is adjacent to the buffer platform 15. Specifically, the stopper 29 is located between the sliding rail 111 and the buffer table 15 and can be rotated and displaced, while the sliding device 27 of the substrate separation device 2 does not include the stopper 29. Specifically, the sliding device 27 includes a body 271, a lifting device 273, and a suction device. The device 275, the suction device 275 is connected to the lifting device 273, the lifting device 273 is connected to the main body 271, and the main body 271 is connected to the sliding rail 111 of the base 11. The lifting device 273 is higher than the main body 271 and can drive the suction device 275 to lift relative to the main body 271 (Vertical displacement).

Please refer to FIG. 3, when the first carrier S1 and the combined substrate S0 are placed on the temperature-changing table 13, the temperature-changing table 13 can control the melting of the adhesive between the top surface of the combined substrate S0 and the bottom surface of the first carrier S1 by changing the temperature .

Then, the sliding device 27 moves to the top of the temperature change table 13, and drives the lifting device 273 and the suction device 275 to move to the top of the first carrier S1 and the combined substrate S0, and the lifting device 273 drives the suction device 275 to move downward to make the suction device 275 adsorbs the upper surface of the first carrier S1, wherein the suction device 275 is, for example, but not limited to, a vacuum suction device.

4, the sliding device 27 drives the suction device 275 and the first carrier S1 to move above the buffer table 15, so that the buffer table 15 carries the first carrier S1 separated from the combined substrate S0, and the combined substrate S0 is Stay at the variable temperature station 13. Further, the stopper 29 is rotationally displaced above the first carrier board S1, the lifting device 273 drives the suction device 275 to move upward, and the stopper 29 contacts the upper surface of the first carrier board S1 to prevent the first carrier board S1 from being sucked The device 275 adsorbs and leaves the first carrier board S1 in the buffer table 15. In this way, the first carrier S1 can be prevented from being attracted to the suction device 275. When the stopper 29 is displaced above the first carrier board S1, the vertical distance between the stopper 29 and the buffer platform 15 is, for example, but not limited to, 1-10 mm.

In one embodiment, the stopper 29 is integrally formed and made of a material, such as plastic. In other embodiments, the stopper 29 may also be composed of a connecting portion 29A and a contact portion 29B, and the stopper 29 is connected to the sliding device 27 through the connecting portion 29A, and the contact portion 29B is used to contact the upper surface of the first carrier board S1. The material of the connecting portion 29A can be metal, and the material of the contact portion 29B can be plastic.

In summary, compared with the prior art, the technical effects of the substrate separation device according to the embodiment of the present invention are described as follows.

In the prior art, in the process of debonding, the vacuum state between the vacuum suction device and the carrier is often not completely released, causing the carrier to stay in the vacuum suction device, and may fall at a non-target position, resulting in the debonding machine Damaged or dirty. In contrast, the substrate separation device of the present invention can contact the upper surface of the carrier through the baffle, so that the carrier stays on the buffer table without being continuously sucked by the suction device, so as to prevent the carrier from falling at non-target positions and lower the machine. The probability of a damaged or dirty table.

The present invention has been disclosed in preferred embodiments above. However, those familiar with the art should understand that the above-mentioned embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the foregoing embodiments should be included in the scope of the present invention.

1: Substrate separation device

11: Pedestal

111: Sliding track

13: Variable temperature platform

15: buffer table

151: Jet Port

17: Sliding device

171: Body

173: Lifting device

175: Suction Device

177: Block

177A: Connecting part

177B: Contact

S0: Combination board

S1: The first carrier board

S2: Wafer

S3: second carrier board

Claims (10)

A substrate separation device includes: a base including a sliding track; a temperature-changing table located on the base, through which the temperature is changed to control an adhesion between a top surface of a combined substrate and a bottom surface of a first carrier board Agent melting; a buffer table located on the base for carrying the first carrier plate separated from the combined substrate; and a sliding device connected to the sliding track of the base, and between the temperature change table and the buffer table The sliding device includes: a body connected to the sliding track of the base; a lifting device connected to the body; a suction device connected to the lifting device, and the lifting device drives the suction device relative to the And at least one stopper connected to the body; wherein the sliding device is above the temperature changing table, and the lifting device drives the suction device to move downward so that the suction device absorbs an upper surface of the first carrier board, The body of the sliding device drives the suction device and the first carrier board to move above the buffer table, and the lifting device drives the suction device to move upward, and the stopper contacts the upper surface of the first carrier board , To prevent the first carrier board from being adsorbed by the suction device, so that the first carrier board stays in the buffer table. The substrate separation device according to claim 1, wherein when the sliding device slides above the buffer table, the vertical distance between the stopper and the buffer table is 1-10 mm. The substrate separation device according to claim 1, wherein the stopper further includes a connecting portion and a contact portion, the contact portion of the stopper is connected to the body of the sliding device through the connecting portion, and the contact portion is used for In contact with the upper surface of the first carrier board, the material of the connecting part is metal, and the material of the contact part is plastic. The substrate separation device according to claim 1, further comprising a temperature control module connected to the temperature variable table for controlling the temperature of the temperature variable table. The substrate separation device according to claim 1, wherein the buffer table further includes at least one air jet located on an upper surface of the buffer table, wherein the first carrier plate is driven to the buffer table by the suction device, The gas injection port provides a gas to cool the adhesive on the bottom surface of the first carrier board, and prevent the first carrier board from adhering to the buffer table. A substrate separation device includes: a base including a sliding track; a temperature-changing table located on the base, through which the temperature is changed to control an adhesion between a top surface of a combined substrate and a bottom surface of a first carrier board Agent melting; a buffer table located on the base for carrying the first carrier plate separated from the composite substrate; at least one stopper adjacent to the buffer table; and a sliding device connected to the sliding of the base Track and displace between the temperature-changing table and the buffer table, the sliding device includes: A body connected to the sliding track of the base; a lifting device connected to the body; and a suction device connected to the lifting device, and the suction device is driven to rise and fall relative to the body through the lifting device; wherein the sliding device is Above the temperature-changing table, the lifting device drives the suction device to move downward, so that the suction device absorbs an upper surface of the first carrier board, wherein the body of the sliding device drives the suction device and the first carrier board to move To the upper side of the buffer table, the stopper moves above the first carrier board, and the lifting device drives the suction device to move upward, and the stopper contacts the upper surface of the first carrier board to block the first carrier board. A carrier board is adsorbed by the suction device, so that the first carrier board stays in the buffer table. The substrate separation device according to claim 6, wherein when the stopper is displaced above the first carrier plate, the vertical distance between the stopper and the buffer table is 1-10 mm. The substrate separation device according to claim 6, wherein the stopper further includes a connecting portion and a contact portion, the contact portion of the stopper is connected to the body of the sliding device through the connecting portion, and the contact portion is used for In contact with the upper surface of the first carrier board, the material of the connecting part is metal, and the material of the contact part is plastic. The substrate separation device according to claim 6, further comprising a temperature control module connected to the temperature change stage for controlling the temperature of the temperature change stage. The substrate separation device according to claim 6, wherein the buffer table further includes at least one air jet located on an upper surface of the buffer table, wherein the first carrier plate is sucked The device is driven to the buffer table, and the air injection port provides a gas to cool the adhesive on the bottom surface of the first carrier plate to prevent the first carrier plate from adhering to the buffer table.

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