CN214068698U - Substrate separator - Google Patents

Abstract

The utility model discloses a base plate separating centrifuge, including alternating temperature platform, movable tool and buffering platform, wherein the gluey phenomenon of melting between the steerable combination base plate of alternating temperature platform (or base plate) and the support plate to and the buffering platform has the incomplete glue of jet-propelled subassembly in order to cool off the support plate bottom surface, in order to prevent that the support plate from adhering to the buffering platform.

Description

Substrate separator

Technical Field

The utility model relates to a base plate separating centrifuge especially indicates that a jet-propelled subassembly that sees through the cushion table makes its cooling to the incomplete glue jet-propelled of support plate bottom to prevent that the support plate from adhering to a base plate separating centrifuge of cushion table.

Background

The development of integrated circuit technology is mature, and at present, electronic products are developed towards the trend of being light, thin, short, high-performance, high-reliability and intelligent. The chip (substrate) in an electronic product has a significant impact on the performance of the electronic product, wherein the performance is related to the thickness of the chip. For example, a thinner chip can improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce the volume and weight of the package.

In semiconductor manufacturing, a substrate thinning process, a via etching process and a backside metallization process are usually performed on the backside (i.e., the lower surface) of a chip. However, when the thickness of the substrate of the wafer of the chips is too thin (for example, less than or equal to 150 μm), the substrate thinning process may cause wafer breakage or bending deformation of the wafer, thereby making the chips unusable and reducing the chip yield. Generally, a bonding process is performed to bond the wafer and the carrier (e.g., sapphire glass) before the substrate thinning process is performed, and a de-bonding process is performed to separate the wafer and the carrier after the substrate thinning process is performed.

During the debonding process, the temperature is usually raised to melt the adhesive between the wafer and the carrier, so as to separate the wafer from the carrier. After the wafer and the carrier are separated, the adhesive residue with high temperature adhesion is often left on the bottom of the carrier, which causes the problem that the carrier is easy to adhere to the debonding machine, and increases the cost for cleaning.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to overcome the defects of the prior art, the embodiment of the utility model provides a substrate separator, which comprises a temperature changing table, a buffer table and a movable jig, wherein the buffer table is provided with an air injection assembly. When the substrate is separated (the combined substrate or the substrate is separated from the carrier plate above the combined substrate), the temperature changing table can control the glue melting phenomenon between the combined substrate or the substrate and the carrier plate by raising and lowering the temperature. When the combined substrate or the glue between the substrate and the carrier is melted and the movable fixture moves the carrier above the buffer table, the air injection assembly can inject air to the residual glue on the bottom surface of the carrier to cool the residual glue so as to prevent the carrier from adhering to the substrate separator when placed on the buffer table.

The embodiment of the utility model provides a pair of base plate separating centrifuge is applicable to preventing adhering of support plate. The substrate separator comprises a temperature changing table, a buffer table and a movable jig, wherein the buffer table is provided with an air injection assembly. When the combined substrate or the substrate contacts the temperature changing table, the temperature changing table changes the temperature to control the glue melting phenomenon between the combined substrate or the substrate and the carrier plate, wherein the carrier plate is positioned above the combined substrate or the substrate. The movable jig is used for separating the carrier plate from the combined substrate or the substrate and moving the carrier plate to the upper part of the buffer table. The air injection assembly injects air to cool the residual glue on the bottom surface of the carrier plate so as to prevent the carrier plate from being adhered to the buffer table.

Optionally, the temperature varying stage further includes a bearing member connected to the temperature varying stage for bearing the combined substrate or the substrate to control the combined substrate or the substrate to contact or not contact the temperature varying stage.

Optionally, the bearing member is a plurality of lifting pins (liftpins).

Optionally, the lifting lift pins vertically displace to drive the combined substrate or the substrate to lift, so that the combined substrate or the substrate contacts or does not contact the temperature changing table.

Optionally, the gas ejected from the gas ejection assembly is nitrogen or Clean Dry Air (CDA) to cool the residual glue on the bottom surface of the carrier plate.

Optionally, the movable fixture is a sliding lid plate (sliding lid plate).

Optionally, the sliding cover plate adsorbs the carrier by vacuum adsorption to separate the carrier from the assembled substrate or the base plate and move the carrier above the buffer stage.

Optionally, after the temperature-changing table controls the combined substrate or the glue melting phenomenon between the substrate and the carrier plate, the movable jig drives the carrier plate to separate the carrier plate from the combined substrate or the substrate, and moves the carrier plate above the buffer table.

Optionally, the temperature changing table is further provided with a temperature control module, connected to the temperature changing table, for controlling the temperature of the temperature changing table.

Optionally, the temperature changing table is further provided with a vacuum module connected to the temperature changing table for fixing the combined substrate or the substrate to the temperature changing table.

In short, the substrate separator according to the present invention can provide gas to cool the residual glue at the bottom of the separated carrier after the carrier is separated from the combined substrate or the substrate, so that the carrier can be prevented from adhering to the substrate separator, thereby providing advantages in various markets (e.g., semiconductor manufacturing) where substrate separation is required.

Drawings

Fig. 1 is a schematic view of a substrate separator according to an embodiment of the present invention.

Fig. 2 is a schematic flow chart illustrating steps of a substrate separator and a method using the same according to the present invention.

Description of reference numerals: 1-substrate separator; 101-a temperature changing table; 1011-a carrier member; 102-a buffer station; 1021-a gas injection assembly; c0-composite substrate; c1-carrier plate; c2-carrier plate; g-gas; r-cull; s-a movable jig; S101-S103; w-substrate.

Detailed Description

In order to fully understand the objects, features and functions of the present invention, the following detailed description of the present invention will be given with reference to the accompanying drawings.

The utility model provides a substrate separator can provide gas to the support plate bottom when carrying out the separation between support plate and the combination base plate (or the base plate) and cool off the cull, can not adhere to the cushion table when making the support plate place in the cushion table of substrate separator.

Referring to fig. 1 and 2, fig. 1 is a schematic diagram of a substrate separator according to the present invention, and fig. 1 is a schematic flow chart of steps of the substrate separator and a method using the same according to the present invention. As shown in fig. 1, the substrate separating machine 1 includes a temperature varying stage 101, a buffer stage 102 and a movable fixture S, wherein the temperature varying stage 101 has a carrying member 1011, and the buffer stage 102 has an air injection assembly 1021, wherein the air injection assembly 1021 is connected to the buffer stage 102.

The bearing member 1011 is connected to the temperature varying stage 101 and is used for bearing the combined substrate C0 (or only a single substrate can be borne), so as to control the combined substrate C0 (or a single substrate) to contact or not contact the temperature varying stage 101. The combined substrate C0 may be a combination of a substrate W and a carrier C2, wherein the substrate W is higher than the carrier C2.

In one embodiment, the carrying member 1011 is a plurality of lift pins. The lift pins can move vertically (up or down) to drive the combined substrate C0 to lift up or down, so as to control the carrier C1 and the combined substrate C0 (including the substrate W and another carrier C2) to lift up or down, so as to control the combined substrate C0 to contact or not contact the temperature-changing table 101, wherein the carrier C1 is located above the combined substrate C0 (or a single substrate). Note that the present invention is not limited by the type of the bearing component or the number of the lift pins, and the combined substrate C0 may be a single substrate.

After the combined substrate C0 (or a single substrate) contacts the temperature changing stage 101, the temperature changing stage 101 changes temperature (e.g., raises temperature) to control the glue melting phenomenon between the combined substrate C0 (or a single substrate) and the carrier C1. Specifically, the temperature changing table 101 is further provided with a temperature control module, and the temperature control module is connected to the temperature changing table 101 to control the temperature of the temperature changing table 101. For example, after the combined substrate C0 (or a single substrate) contacts the temperature varying stage 101, the temperature controlling module controls the temperature varying stage 101 to increase the temperature, so as to increase the temperature of the combined substrate C0 (or a single substrate) and the carrier C1 connected to each other, so as to melt the colloid between the combined substrate C0 (or a single substrate) and the carrier C1.

Then, the movable fixture S is used to absorb or clamp the carrier C1 to separate (i.e., debond) the carrier C1 from the combined substrate C0 (or a single substrate). Then, the movable fixture S moves the separated carrier C1 onto the buffer stage 102, and the buffer stage 102 has the air injection assembly 1021 and injects air to the bottom of the carrier C1 to cool the residual glue on the bottom surface of the carrier C1 and prevent the carrier C1 from adhering to the buffer stage 102, thereby preventing the carrier C1 from adhering to the buffer stage 102. The movable jig S may be a sliding lid (sliding lid) and has a vacuum pumping capability, that is, the sliding lid sucks the carrier C1 through a vacuum sucking method to separate the carrier C1 from the combined substrate C0 (or a single substrate) and move the carrier C1 above the buffer stage 102, but the present invention is not limited to the type of the movable jig S.

Next, please refer to fig. 2 to show the steps and methods of using the substrate separator. When a carrier C1 (e.g., but not limited to a sapphire substrate) and a substrate W (e.g., but not limited to a wafer) bonded to each other are to be separated and the substrate W is to be mounted on a carrier C2 (e.g., but not limited to sic), the method refers to step S101. First, the carrier C2 is placed on the carrier 1011 of the thermal swing table 101, such that the carrier 1011 supports and abuts against the carrier C2.

Next, referring to step S102, the movable fixture S can move the carrier C1 and the substrate W bonded to each other and place them above the carrier C2, so that the three are arranged as shown in the figure, i.e. the carrier C1 and the assembled substrate C0 are disposed, and at this time, the carrier 1011 displaces downward, so that the bottom surface of the assembled substrate C0 contacts the thermal platform 101. In the present embodiment, the movable fixture S controls the movement of the carrier C1 and the substrate W by vacuum adsorption, but the present invention is not limited thereto. The temperature changing stage is maintained at a low temperature (for example, but not limited to, 80 degrees celsius) until the alignment of the carrier C1, the substrate W and the carrier C2 is completed. After the carrier C1, the substrate W, and the carrier C2 are aligned, the temperature varying stage 101 sucks the bottom of the assembled substrate C0 (not shown) through the vacuum module connected to the temperature varying stage 101, so that the assembled substrate C0 is fixed to the temperature varying stage 101. In other embodiments, the combination substrate C0 is only a single substrate and the vacuum module secures the single substrate to the temperature change station 101.

Next, the temperature varying stage 101 raises the temperature (for example, but not limited to 150 ℃) through a temperature control module (not shown) to generate a glue melting phenomenon between the assembled substrate C0 and the carrier C1 thereabove, and a glue melting phenomenon between the substrate W and the carrier C2. After the two glues are melted, the substrate W can be fixed (bonded) to the carrier C2, and the carrier C1 can be separated (debonded) from the substrate W by the adsorption or clamping of the carrier C1 by the movable jig S and the adsorption and combination of the substrate C0 by the thermal swing table 101.

Subsequently, step S103 is performed. When the carrier C1 is separated from the substrate W, the vacuum module of the thermal swing stage 101 is continuously opened to suck and fix the assembled substrate C0 on the thermal swing stage 101, and then the movable jig S moves the carrier C1 above the buffer stage 102 (for example, but not limited to, by vacuum suction). At this time, since the bottom surface of the carrier C1 has high temperature residual glue R, the gas injection assembly 1021 of the buffer stage 102 supplies gas G to the residual glue R for cooling, so that the cooled residual glue R has no adhesiveness to prevent the carrier C1 from adhering to the buffer stage 102 when placed thereon. The gas spraying unit 1021 sprays gas such as but not limited to nitrogen or Clean Dry Air (CDA) to cool the residual glue R on the bottom surface of the carrier plate C1.

Finally, after the carrier C1 is placed on the buffer stage 102, the temperature of the temperature-changing stage is lowered to a low temperature (for example, but not limited to, 80 degrees celsius) and the vacuum-suction and fixing of the bottom surface of the assembled substrate C0 is stopped. Then, the lift pins lift the assembly substrate C0 upward so that the assembly substrate C0 can be removed and the carrier C1 not adhered to the buffer stage 102 can be removed to complete the substrate separation.

Incidentally, although the separation (debonding) between the combined substrate C0 and the carrier C1 is taken as an example in the present invention, in other embodiments, the combined substrate C0 may be replaced by a single substrate W, or the combined substrate C0 includes a combination of at least one substrate W and at least one carrier C2, which should not be taken as a limitation to the present invention. When the combined substrate C0 is a single substrate W, the carrier plate C1 to which the substrate W is bonded is directly placed on the carrier 101, and the carrier 101 is lowered to bring the substrate W into contact with the temperature changing table 101, and then heated to perform debonding. Then, the movable fixture S separates the carrier C1 from the substrate W and moves the carrier C1 to a position above the buffer stage 102, and the buffer stage 102 then blows air to the residual glue R on the bottom of the carrier C1 to prevent the carrier C1 placed on the buffer stage 102 through the movable fixture S from adhering to the buffer stage 102.

In summary, compared with the prior art, the technical effect of the substrate separator according to the embodiment of the present invention is described as follows.

In the prior art, during the debonding process, after the wafer is separated from the carrier, the adhesive residue is remained at the bottom of the carrier due to high temperature, which causes the problem that the carrier is easy to adhere to the debonding machine, resulting in the frequency of cleaning the machine and the cost increase. In contrast to the above-mentioned structure, the substrate separator can blow the bottom of the carrier with residual glue through the air-blowing assembly of the buffer table, so that the carrier can cool the residual glue before being placed on the buffer table to lose the adhesion of the residual glue, thereby preventing the substrate separator from being contaminated unexpectedly, and improving and lowering the cleaning frequency of the conventional machine.

Of course, the present invention can have other embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, and these corresponding changes and modifications should fall within the protection scope of the claims of the present invention.

Claims (10)

1. A substrate separator adapted to prevent adhesion of a carrier, the substrate separator comprising:

the temperature changing platform is used for changing the temperature to control the glue melting phenomenon between the combined substrate or the substrate and the carrier plate after the combined substrate or the substrate contacts the temperature changing platform, wherein the carrier plate is positioned above the combined substrate or the substrate;

the buffer table is provided with an air injection assembly, wherein after the carrier plate separates the combined substrate, the air injection assembly injects air to cool the residual glue on the bottom surface of the carrier plate so as to prevent the carrier plate from being adhered to the buffer table; and

and the movable jig is used for separating the carrier plate from the combined substrate or the substrate and moving the carrier plate to the position above the buffer table.

2. The substrate separator of claim 1, wherein the temperature change stage further comprises a bearing member coupled to the temperature change stage for bearing the composite substrate or substrate to control the composite substrate or substrate to contact or not contact the temperature change stage.

3. The substrate separator according to claim 2, wherein the carrying member is a plurality of lift pins.

4. The substrate separator of claim 3, wherein the lift pins are vertically displaced to move the assembled substrate or the substrate up and down, such that the assembled substrate or the substrate may or may not contact the temperature varying stage.

5. The substrate separator of claim 1, wherein the gas ejected from the gas ejection assembly is nitrogen gas or Clean Dry Air (CDA) to cool the residual glue on the bottom surface of the carrier.

6. The substrate separator according to claim 1, wherein the movable fixture is a sliding lid plate (sliding lid plate).

7. The substrate separator of claim 6, wherein the sliding cover absorbs the carrier by vacuum absorption to separate the carrier from the assembled substrate or substrate and move the carrier above the buffer stage.

8. The substrate separator according to claim 1, wherein after the temperature varying stage controls the assembled substrate or glue melting between the substrate and the carrier, the movable fixture drives the carrier to separate the carrier from the assembled substrate or substrate and move the carrier above the buffer stage.

9. The substrate separator of claim 1, wherein the temperature changing stage further comprises a temperature control module coupled to the temperature changing stage for controlling a temperature of the temperature changing stage.

10. The substrate separator of claim 1, wherein the temperature change stage is further provided with a vacuum module coupled to the temperature change stage for securing the composite substrate or substrates to the temperature change stage.

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