CN215266208U - Improved substrate separating device - Google Patents
Improved substrate separating device Download PDFInfo
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- CN215266208U CN215266208U CN202121223504.1U CN202121223504U CN215266208U CN 215266208 U CN215266208 U CN 215266208U CN 202121223504 U CN202121223504 U CN 202121223504U CN 215266208 U CN215266208 U CN 215266208U
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Abstract
The utility model provides an improved substrate separation device, which comprises a base and an adsorption moving module. The adsorption moving module comprises an adsorption component, a lifting mechanism, a body and a plurality of elastic abutting pieces. The adsorption component adsorbs a second substrate, the lifting mechanism is connected with the adsorption component and drives the adsorption component and the adsorbed second substrate to lift relative to the base, the body is connected with the base and the lifting mechanism and drives the adsorption component and the adsorbed second substrate to displace relative to the base, and the elastic abutting piece is connected with the lifting mechanism.
Description
Technical Field
The utility model relates to an improvement formula base plate separator, it utilizes an absorption removal module, will be with the second base plate of first base plate bonded from first base plate separation, should adsorb removal module again will remove to one from the second base plate of first base plate separation and place the district.
Background
Integrated circuit technology has advanced to a mature stage, and electronic products are now being developed towards the trend of being light, thin, high-performance, high-reliability and intelligent. The performance of chips in electronic products is significantly affected, wherein the thickness of the chip is particularly relevant to the performance of the electronic products. For example, thinner chips may improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce the volume and weight of the package.
In semiconductor manufacturing, substrate thinning, via etching, backside metallization, etc. are usually performed on the backside (lower surface) of a chip. However, when the thickness of the wafer (first substrate) is too thin (for example, less than or equal to 150 μm), the wafer may be cracked or bent during the thinning process. Generally, a first substrate and a second substrate (e.g., sapphire substrate) are bonded before substrate thinning, and are separated by debonding after the thinning process is completed.
In the debonding process, the second substrate is usually adsorbed by a vacuum suction module to separate the second substrate from the wafer (the first substrate). However, when the vacuum suction module is to detach or release the second substrate, the vacuum state is often not completely released, and the second substrate may jump, so that the second substrate cannot be stably and accurately placed on the placing table, and the second substrate may be damaged to contaminate the debonding and bonding machine.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems faced by the prior art, the present invention provides an improved substrate separation device, which mainly comprises a plurality of elastic supporting members disposed on an adsorption moving module, so that the adsorption moving module continuously supports the second substrate when detaching or releasing the second substrate to a placing table, and the second substrate is separated from the adsorption assembly, and the second substrate is stably supported on the placing table.
An object of the utility model is to provide an improvement formula base plate separator, including a base and an absorption removal module, wherein adsorb removal module connection base, and mainly include an absorption subassembly, an elevating system and a plurality of elasticity support. The lifting mechanism is connected with the adsorption component and drives the adsorption component and the second substrate adsorbed by the adsorption component to lift relative to the base, the elastic abutting piece is connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting piece to enable the second substrate to be in a compression state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting piece can be released from the compression state to extend and continuously abut against the second substrate, so that the second substrate is separated from the adsorption component, and meanwhile, the second substrate is maintained to stably abut against the placing table of the base.
An object of the utility model is to provide an improvement formula base plate separator, including a base and an absorption removal module, wherein the base includes a separation area and one places the district, places the district and includes one and places the platform. The adsorption moving module is connected with the base and comprises an adsorption component, a lifting mechanism, a body and a plurality of elastic abutting pieces. The lifting mechanism is connected with the adsorption component and drives the adsorption component and the second substrate adsorbed by the adsorption component to lift relative to the base, the body is connected with the base and the lifting mechanism and drives the adsorption component and the second substrate adsorbed by the adsorption component to displace between the separation area and the placement area, and the elastic abutting piece is connected with the lifting mechanism. When the adsorption component adsorbs the second substrate positioned in the separation area, the second substrate can compress the elastic abutting piece to enable the elastic abutting piece to be in a compression state. And then, the adsorption moving module moves to the upper part of the placing area, the lifting mechanism drives the adsorption component and the adsorbed second substrate to descend until the second substrate contacts with the placing table, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, the elastic abutting piece is released from a compressed state and continuously abuts against the second substrate, so that the second substrate is separated from the adsorption component, and meanwhile, the second substrate is maintained to stably abut against the placing table.
In order to achieve the above object, the present invention provides an improved substrate separation device, which comprises a base and an adsorption moving module, wherein the base comprises a separation area and a placement area, the separation area is provided with: a bearing unit suitable for bearing a support plate, and a heating unit for heating a bonded first substrate and a bonded second substrate, the placing area is provided with a placing table, the adsorption moving module comprises: an adsorption component for adsorbing the second substrate; the lifting mechanism is connected with the adsorption assembly and drives the adsorption assembly and the second substrate adsorbed by the adsorption assembly to lift relative to the base; the body is connected with the base and the lifting mechanism and drives the adsorption component and the second substrate adsorbed by the adsorption component to move between the separation area and the placing area; and the elastic abutting pieces are connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting pieces to enable the elastic abutting pieces to be in a compressed state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting pieces can be released from the compressed state to extend, so that the second substrate is separated from the adsorption component.
The improved substrate separating device comprises an elastic part, a lifting mechanism and a contact part, wherein the elastic part comprises an elastic part connected with the lifting mechanism and a contact part connected with the elastic part and used for contacting with the second substrate.
In the improved substrate separation device, the elastic part comprises a spring.
In the improved substrate separation device, the adsorption moving module further comprises a connecting piece connected with the body. The lifting mechanism is connected with the adsorption component through the connecting piece and drives the connecting piece, the adsorption component and the adsorbed second substrate to lift relative to the body and the base. The elastic propping piece is connected with the lifting mechanism through the connecting piece. According to some embodiments of the present invention, the lifting mechanism includes a hydraulic assembly or a motor, which is connected to the connecting member and drives the connecting member, the adsorption assembly and the second substrate to lift relative to the body and the base.
In the improved substrate separation device, a plurality of elastic abutting pieces are arranged around the adsorption component.
The improved substrate separation device is provided with at least two, at least three or at least four elastic abutting pieces which are arranged around the adsorption component. Preferably, when the elastic abutting element is released from the compressed state and extends, the moment generated by the force applied to the second substrate is offset, so that the second substrate can be stably abutted on the placing table when leaving the adsorption assembly. For example, two elastic abutting pieces are arranged on two sides of the adsorption component in a surrounding mode, and three or more elastic abutting pieces are arranged around the adsorption component at equal intervals.
The improved substrate separation device is characterized in that the adsorption moving module is arranged above the separation area, the lifting mechanism drives the adsorption component and the elastic abutting piece to descend, the elastic abutting piece can abut against the second substrate, the lifting mechanism drives the adsorption component to continue descending, the elastic abutting piece is compressed from a relaxation state until the adsorption component contacts with the second substrate, and the adsorption component adsorbs the second substrate, or the adsorption moving module is arranged above the placement area, the lifting mechanism drives the adsorption component and the adsorbed second substrate to descend until the second substrate contacts with the placement platform, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, the elastic abutting piece releases from the compression state to continuously abut against the second substrate, and the second substrate is separated from the adsorption component. In the improved substrate separation device, the elastic abutting piece protrudes out of the adsorption component in a relaxed state.
The improved substrate separation device comprises a base, wherein the base comprises a track, and the adsorption moving module is connected with the base through the track and moves relative to the base along the track.
The improved substrate separation device comprises a bearing unit, a plurality of lifting rods and a bearing platform, wherein the lifting rods are used for bearing the bearing plate and the bonded first substrate and the bonded second substrate which are arranged on the bearing plate, and driving the bearing plate, the first substrate and the second substrate to approach the bearing platform so as to place the bearing plate, the first substrate and the second substrate on the bearing platform.
In the improved substrate separation device, the carrier has a plurality of through holes.
The improved substrate separation device is characterized in that the adsorption unit of the adsorption moving module is adsorbed and positioned on the second substrate of the separation area, and the body drives the adsorption component and the adsorbed second substrate to slide relative to the first substrate, so that the second substrate is separated from the first substrate.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention.
Fig. 2 is a schematic perspective view of an embodiment of the present invention.
Fig. 3 is a schematic perspective view of an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of an embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of an embodiment of the present invention.
Description of reference numerals: 11-a base; 111-track; 13, a separation area; 131-a carrying unit; 1311-lifting rod; 1313-a carrier table; 15-a placement area; 151-placing table; 17-an adsorption movement module; 171-a body; 172-orbit; 173-a lifting mechanism; 174-a connector; 175-an adsorption component; 177-an elastic abutting piece; 1771-elastic part; 1773-a contact portion; c-a carrier plate; w-a first substrate; s-a second substrate.
Detailed Description
Please refer to fig. 1 and 2, which are schematic diagrams illustrating an embodiment of the present invention. As shown in the figure, the improved substrate separation apparatus includes a base 11 and an adsorption moving module 17. The base 11 includes a separating area 13, a placing area 15 and a rail 111.
The separation region 13 is provided with a carrying unit 131 adapted to carry a carrier C, a heating unit (not shown) for heating a bonded first substrate W and a bonded second substrate S, and a vacuum unit (not shown) for adsorbing the first substrate W. The supporting unit 131 includes a plurality of lift rods 1311 and a supporting platform 1313. The placing area 15 is provided with a placing table 151.
In this embodiment, the carrier C is a SiC carrier, the first substrate W is a wafer, and the second substrate S is a sapphire substrate, but the invention is not limited thereto.
The adsorption moving module 17 includes an adsorption element 175, a lifting mechanism 173, a body 171 and a plurality of elastic supporting members 177.
The chucking assembly 175 includes, but is not limited to, a vacuum chucking assembly (e.g., a vacuum chuck) for chucking the second substrate S.
The lifting mechanism 173 is connected to the adsorption assembly 175 and drives the adsorption assembly 175 and the second substrate S adsorbed by the adsorption assembly to lift relative to the susceptor 11. Referring to fig. 3, fig. 4 and fig. 5, in the present embodiment, the adsorption moving module 17 further includes a connecting member 174 connected to the main body 171 through a rail 172, the lifting mechanism 173 is connected to the adsorption assembly 175 through the connecting member 174, and the elastic abutting member 177 is connected to the lifting mechanism 173 through the connecting member 174. For example, the lifting mechanism 173 includes a hydraulic assembly, a motor, a cylinder or a screw, and drives the connecting member 174, the adsorbing assembly 175 and the adsorbed second substrate S to lift relative to the main body 171 and the susceptor 11.
The body 171 is connected to the lifting mechanism 173 and is connected to the base 11 through the rail 111, so that the adsorption moving module 17 can move along the rail 111 relative to the base 11, wherein the body 171 drives the adsorption element 175 and the second substrate S adsorbed by the adsorption element to move along the rail 111 between the separation area 13 and the placing area 15.
Referring to fig. 4 and 5, the elastic abutting element 177 includes an elastic portion 1771 and a contact portion 1773. The elastic portion 1771 is connected to the lifting mechanism 173 through the connecting member 174. The contact portion 1773 is connected to the elastic portion 1771 and is used to contact with the second substrate S. Generally, the elastic portion 1771 includes a telescopic rod and a spring, the spring is sleeved on the telescopic rod; the contact portion 1773 is made of a material suitable for contacting the second substrate S, such as a plastic.
When the adsorption element 175 adsorbs the second substrate S, the second substrate S compresses the elastic abutting element 177 to be in a compressed state, and when the adsorption element 175 releases the suction force to the second substrate S, the elastic abutting element 177 is released from the compressed state to extend, so that the second substrate S is separated from the adsorption element 175. Referring again to fig. 5, resilient biasing element 177, in its relaxed state, protrudes beyond absorbing element 175. As shown, the elastic support 177 has a height h1 in the relaxed state, and the absorption element 175 has a height h2, wherein h1 is greater than h 2.
When the modified substrate separation apparatus is used to debond the bonded first substrate W and the bonded second substrate S, as shown in fig. 1, the carrier C is first placed on the plurality of lifting rods 1311 of the carrying unit 131 (at this time, the lifting rods 1311 are in a lifted state), and then the bonded first substrate W and the bonded second substrate S are placed on the carrier C with the first substrate W facing downward and contacting with the carrier C. The lift pins 1311 are lowered to drive the carrier C, the first substrate W and the second substrate S to approach the carrier 1313, so as to place the carrier C, the first substrate W and the second substrate S on the carrier 1313. Next, a heating unit (not shown) heats the first substrate W and the second substrate S to soften the adhesive bonding the two substrates.
The adsorption moving module 17 moves to the upper side of the separation region 13 along the rail 111, the lifting mechanism 173 drives the adsorption component 175 and the elastic abutting component 177 to descend, the elastic abutting component 177 abuts against the second substrate S, the lifting mechanism 173 drives the adsorption component 175 to descend continuously, the elastic abutting component 177 is compressed from a relaxed state until the adsorption component 175 contacts the second substrate S, and at this time, the adsorption component 175 adsorbs the second substrate S. Meanwhile, the vacuum unit (not shown) also sucks the first substrate W. In the present embodiment, the carrier C has a plurality of through holes (not shown), and the vacuum unit sucks the first substrate W through the plurality of through holes of the carrier C.
Then, the body 171 drives the adsorption assembly 175 and the second substrate S adsorbed by the adsorption assembly to slide relative to the first substrate W, so that the second substrate S is separated from the first substrate W. Referring to fig. 3, 4 and 5, the adsorption moving module 17 moves to the upper portion of the placing region 15 along the rail 111, the lifting mechanism 173 drives the adsorption element 175 and the second substrate S adsorbed by the adsorption element to descend until the second substrate S contacts the placing stage 151 (as shown in fig. 4), the adsorption element 175 releases the suction force on the second substrate S and is driven by the lifting mechanism 173 to ascend, the elastic abutting element 177 releases from the compressed state and continuously abuts against the second substrate S, so that the second substrate S leaves the adsorption element 175, and the second substrate S is maintained to stably abut against the placing stage 151 (as shown in fig. 5).
Finally, the plurality of lift pins 1311 of the carrier unit 131 are lifted again (at this time, the suction force of the vacuum unit is released), the carrier C and the first substrate W retained thereon are driven to be away from the carrier 1313, and the carrier C and the first substrate W are moved to the cleaning machine by the wafer robot for cleaning, and the debonding process is completed after the cleaning.
The foregoing is merely a preferred embodiment of the invention, and is not intended to limit the scope of the invention, which is defined by the appended claims, in which all equivalent changes and modifications in the shapes, constructions, features, and spirit of the invention are intended to be included.
Claims (10)
1. An improved substrate separation apparatus, comprising:
a base, comprising:
a separation area, which is provided with a bearing unit and is suitable for bearing a carrier plate; and a heating unit for heating a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded to each other; and
a placing area provided with a placing table; and
an adsorption movement module comprising:
an adsorption component for adsorbing the second substrate;
the lifting mechanism is connected with the adsorption assembly and drives the adsorption assembly and the second substrate adsorbed by the adsorption assembly to lift relative to the base;
a body connected with the base and the lifting mechanism and driving the adsorption component and the second substrate adsorbed by the adsorption component to move between the separation area and the placing area; and
and the elastic abutting pieces are connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting pieces to enable the elastic abutting pieces to be in a compressed state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting pieces can be released from the compressed state to extend, so that the second substrate is separated from the adsorption component.
2. An improved apparatus for separating substrates as claimed in claim 1, wherein the resilient biasing member comprises:
an elastic part connected with the lifting mechanism; and
a contact part connected with the elastic part and used for contacting with the second substrate.
3. An improved substrate separation apparatus as recited in claim 2, wherein the resilient portion comprises a spring.
4. An improved apparatus as claimed in claim 1, wherein the plurality of resilient members are disposed around the suction assembly.
5. The improved substrate separation apparatus of claim 1, wherein:
the adsorption moving module is arranged above the separation area, the lifting mechanism drives the adsorption component and the elastic abutting piece to descend, the elastic abutting piece can abut against the second substrate, the lifting mechanism drives the adsorption component to continue descending, the elastic abutting piece is compressed from a loose state until the adsorption component contacts the second substrate, and the adsorption component adsorbs the second substrate; or
The adsorption moving module is arranged above the placing area, the lifting mechanism drives the adsorption component and the second substrate adsorbed by the adsorption component to descend until the second substrate contacts the placing table, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, and the elastic abutting piece is released from the compression state and continuously abuts against the second substrate to enable the second substrate to leave the adsorption component.
6. An improved apparatus as claimed in claim 5, wherein the resilient urging member protrudes from the suction member in the relaxed state.
7. The apparatus of claim 1, wherein the susceptor comprises a rail, and the suction moving module is coupled to the susceptor via the rail and is movable along the rail relative to the susceptor.
8. The improved apparatus of claim 1, wherein the supporting unit comprises a plurality of lifting rods and a supporting platform, the lifting rods are used to support the supporting plate and the first and second substrates thereon and drive the supporting plate, the first and second substrates to approach the supporting platform, so as to place the supporting plate, the first and second substrates on the supporting platform.
9. The apparatus of claim 1, wherein the carrier has a plurality of through holes.
10. The improved apparatus of claim 1, wherein the adsorption unit of the adsorption moving module adsorbs the second substrate located in the separation region, and the body drives the adsorption element and the adsorbed second substrate to slide relative to the first substrate, so that the second substrate is separated from the first substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223504.1U CN215266208U (en) | 2021-06-02 | 2021-06-02 | Improved substrate separating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223504.1U CN215266208U (en) | 2021-06-02 | 2021-06-02 | Improved substrate separating device |
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| Publication Number | Publication Date |
|---|---|
| CN215266208U true CN215266208U (en) | 2021-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121223504.1U Active CN215266208U (en) | 2021-06-02 | 2021-06-02 | Improved substrate separating device |
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| CN (1) | CN215266208U (en) |
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2021
- 2021-06-02 CN CN202121223504.1U patent/CN215266208U/en active Active
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