CN220774296U - Plate cooling device and stripping platform with same - Google Patents

Abstract

The utility model relates to a plate cooling device, which is used for cooling a carrier substrate of a wafer and comprises a cooling plate and a plurality of contact pads. The cooling plate has an upper surface; wherein, the upper surface sets up the cooling and places the district, is used for placing the wafer. The plurality of contact pads are arranged on the upper surface. The plurality of contact pads protrude from the upper surface, and a total area of the plurality of contact pads is less than 3% of an area of the carrier substrate.

Description

Plate cooling device and stripping platform with same

Technical Field

The present utility model relates to wafer thinning work, and more particularly, to a plate cooling device for cooling a carrier substrate in wafer peeling work, and a peeling table having the plate cooling device.

Background

The existing wafer process is towards the trend of thinning, but in the existing wafer thinning process, the gradually thinned wafer has insufficient stress intensity and is easy to break. Therefore, before the thinning operation, the wafer is bonded to the carrier substrate, and after the mechanical strength is improved, the thinning operation such as chemical mechanical polishing is performed on the wafer.

After the thinning operation, the wafer and the carrier substrate are heated to weaken the bonding strength, the carrier substrate is peeled off by a vacuum pick-up device, and then the carrier substrate is placed on a cooling platform for cooling so as to be recycled.

However, after the vacuum pick-up device peels the carrier substrate off the wafer, the carrier substrate faces the cooling stage with its bonding surface. The bonding surface of the carrier substrate is provided with an adhesive bonded to the wafer. When the carrier substrate is placed on the cooling platform, the bonding surface is used for large-area contact with the cooling platform, so that the carrier substrate is adhered to the cooling platform by the adhesive. When the carrier substrate is transferred to other equipment after the cooling operation is completed, the large-area adhesive generates great adhesive force on the carrier substrate. Therefore, during the process of picking up and transferring the carrier substrate, a picking failure is liable to occur, resulting in interruption of the process of picking up and transferring the carrier substrate, and it is necessary to manually remove the error. Meanwhile, if the adsorption force of the vacuum pickup device is increased to strongly peel the carrier substrate from the cooling platform, warpage or breakage of the carrier substrate is liable to occur. Therefore, there is a need to improve the way the carrier substrate is placed on the cooling platform to avoid pick-up failure during pick-up and transfer of the carrier substrate.

Disclosure of Invention

In view of the above-mentioned problems, the present utility model provides a board cooling device and a stripping platform having the board cooling device, which can avoid errors occurring when picking up and transferring a carrier substrate by the board cooling device.

The utility model provides a plate cooling device, which is used for cooling a carrier substrate of a wafer and comprises a cooling plate and a plurality of contact pads. The cooling plate has an upper surface. The plurality of contact pads are arranged on the upper surface. The plurality of contact pads protrude from the upper surface, and a total area of the plurality of contact pads is less than 3% of an area of the carrier substrate.

Preferably, the upper surface is provided with a cooling placement area, and the plurality of contact pads are located in the cooling placement area.

Preferably, the front edge of the upper surface is disposed in the notch.

Preferably, the upper surface is provided with a groove, the groove extends from the notch to the rear side of the upper surface, and the plate cooling device further comprises a fixing pad which is arranged in the groove; the fixing pad is used for the mounting to pass through.

Preferably, the cooling plate further comprises two side concave parts positioned on two opposite sides of the upper surface, and the plate body cooling device further comprises a plurality of fixing pads arranged on the two side concave parts; each fixing pad is used for the passing of the fixing piece.

Based on the above-mentioned plate cooling device, the utility model also provides a stripping platform for stripping the wafer from the carrier substrate, which comprises a base, a bearing device, the above-mentioned plate cooling device and a carrier substrate pickup device. Two moving guide members are arranged on two opposite sides of the base. The bearing device is arranged on the base and is positioned between the two moving guide pieces. The bearing device is provided with a bearing table, an adsorption assembly and a plurality of ejector rods. The bearing table is used for placing the wafer and the carrier substrate thereon, and the wafer faces the bearing table. The top surface of the bearing table is provided with a stripping processing part for placing the wafer and the carrier substrate, and the carrier substrate is positioned on the outer side. The adsorption component is arranged at the stripping processing part and is used for adsorbing the wafer. The plurality of ejector rods are arranged on the stripping processing part in a lifting manner and can be lowered to be completely embedded in the bearing table, or lifted to push away or receive the wafer. The plate cooling device is arranged on the base and is positioned between the two moving guide pieces. The carrier substrate pickup device comprises a movable seat and a pickup head; wherein, the movable seat is movably combined with the two movable guide pieces; the pick-up head is movably arranged on the moving seat and is used for being adsorbed on the wafer so as to strip the carrier substrate from the wafer and move the carrier substrate to a cooling placement area of the plate cooling device.

Preferably, each moving guide is provided with a guide groove, and the moving seat comprises two support posts and a bracket connected with the two support posts, wherein the two support posts are respectively inserted into the guide grooves so that the moving seat is movably combined with the moving guide, and the pick-up head is movably arranged on the bracket.

Preferably, the peeling platform further comprises a first linear driver and a second linear driver; the first linear driver is arranged on the base and connected with one of the two support posts, and is used for driving the two support posts to move along the guide grooves; the pick-up head is connected to the bracket through a second linear driver and is used for driving the pick-up head to advance towards the base or away from the base.

Preferably, the peel-off processing portion is a shallow groove.

Preferably, a heater is embedded in the carrier substrate to heat the wafer placed on the lift-off processing section and the carrier substrate.

By the plate cooling device and the stripping platform with the plate cooling device, forward adhesive force generated by the adhesive on the bottom surface of the carrier substrate is not excessive, the problem of pickup failure of the carrier substrate in the subsequent carrier substrate transferring process is avoided, the error rate of stripping operation is reduced, and the yield is effectively improved.

Drawings

FIG. 1 is a perspective view of a stripping platform with a plate cooling device in an embodiment of the utility model.

Fig. 2 is a perspective view of a plate cooling device according to an embodiment of the present utility model.

Fig. 3 is a top view of a plate cooling device according to an embodiment of the present utility model.

Fig. 4 is a side view of a carrier in an embodiment of the utility model.

Fig. 5-11 are perspective views of a lift-off station for use in disclosing a carrier substrate lift-off and cooling process in accordance with an embodiment of the present utility model.

Reference numerals illustrate: 1-a stripping platform; 3-wafer; 4-a carrier substrate; 4 a-viscose; 100-a plate cooling device; 110-cooling plates; 110 a-cooling placement area; 111-upper surface; 1111—front; 1112-rear; 1113-sides; 113-groove lack; 114-a trench; 115-side recess; 120-contact pads; 130-a fixing pad; 140-fixing piece; 210-a base; 220-a carrier; 222-a bearing table; 222 a-a peeling process section; 223-an adsorption module; 224-ejector pin; 225-a heater; 230-carrier substrate pick-up device; 232-a mobile seat; 2321-struts; 2322-a scaffold; 234-pick-up heads; 240-moving guide 242-guide slot; 250-a first linear drive; 260-a second linear drive; g-separation distance.

Detailed Description

Referring to fig. 1 to 3, a plate cooling device 100 and a stripping platform 1 with the plate cooling device 100 according to an embodiment of the utility model are shown.

As shown in fig. 2 and 3, the plate cooling device 100 includes a cooling plate 110 and a plurality of contact pads 120. The cooling plate 110 has an upper surface 111. A cooling placement area 110a is defined on the upper surface 111. The cooling placement area 110a is substantially circular with a diameter slightly greater than or equal to the diameter of the predetermined cooling carrier substrate 4. Specifically, the cooling placement area 110a may be an area defined by a physical structure, such as a groove, or may be a virtual area for setting a position where the pick-up device/robot picks up/places the carrier substrate 4, that is, the cooling placement area 110a is an area defined only in the control program code of the pick-up device/robot.

As shown in fig. 2 and 3, the contact pad 120 is disposed on the upper surface 111 and in the cooling placement area 110a. The contact pad 120 is a cooling placement area 110a protruding from the upper surface 111.

As shown in fig. 3, 4 and 5, the contact pad 120 is provided on which the carrier substrate 4 to be cooled is placed, and a separation distance G is maintained between the carrier substrate 4 and the upper surface 111 by the support of the contact pad 120. I.e. the carrier substrate 4 is only in contact with the contact pads 120 and the total area of contact between the carrier substrate 4 and the contact pads 120 is much smaller than the area of projection of the carrier substrate 4 on the upper surface 111.

As shown in fig. 4, the carrier substrate 4 is in contact with only the contact pad 120, and only a small area of contact is made between the bottom surface of the carrier substrate 4 and the contact pad 120. Therefore, the adhesive 4a on the bottom surface of the carrier substrate 4 can only act on a small area, and the forward adhesive force (adhesive force in the normal direction parallel to the upper surface 111) is greatly reduced.

The adhesive force can temporarily fix the carrier substrate 4 in the cooling placement area 110a, so as to avoid the carrier substrate 4 from sliding and displacing on the upper surface 111. The cooling plate 110 may be internally or externally provided with a cooling device, such as a liquid cooling device that cools the cooling plate 110, or an air cooling device that provides a cooling air flow to the upper surface 111, to cool the carrier substrate 4.

As shown in fig. 3, in particular, the total area of the plurality of contact pads 120 is less than 3% of the area of the carrier substrate 4, so that the forward adhesive force (parallel to the normal direction of the upper surface 111) of the plurality of contact pads 120 to the carrier substrate 4 is not excessive, avoiding that the carrier substrate pickup device 230 cannot pick up and move the cooled carrier substrate 4 from the plurality of contact pads 120. The plurality of contact pads 120 may be disposed radially outward from the center of the cooling placement area 110a and uniformly distributed in the cooling placement area 110a, so that the adhesive force acts on the bottom surface of the carrier substrate 4 uniformly to form uniformly distributed point bonding instead of one-time large-area bonding.

As shown in fig. 2 and 3, in one embodiment, the front edge 1111 of the upper surface 111 is disposed on the notch 113, and the upper surface 111 is provided with one or more grooves 114, and the grooves 114 extend from the notch 113 to the rear edge 1112 of the upper surface 111. In addition, the cooling plate 110 includes two side recesses 115 on opposite sides 1113 of the upper surface 111.

As shown in fig. 2 and 3, the plate cooling device 100 further includes a plurality of fixing pads 130 disposed in the grooves 114 and the side recesses 115, respectively. The mounting pad 130 is used to pass fasteners 140 (e.g., bolts) therethrough to secure the cooling plate 110 to the stripper plate 1 or other base 210.

As shown in fig. 1, the stripping platform 1 includes a base 210, a carrying device 220, the foregoing plate cooling device 100, and a carrier substrate pickup device 230.

As shown in fig. 1, two moving guides 240 are disposed on opposite sides 1113 of the base 210, and guide grooves 242 are disposed on the moving guides 240. The carrying device 220 is disposed on the base 210 and located between the two moving guides 240.

As shown in fig. 1 and 4, the carrying device 220 has a carrying table 222, an adsorption assembly 223, and a plurality of ejector pins 224. The carrier 222 is used for placing the wafer 3 to be peeled and its carrier substrate 4 thereon. The top surface of the stage 222 is provided with a peeling portion 222a, and the peeling portion 222a may be a shallow groove. When the wafer 3 and the carrier substrate 4 are placed in the peeling portion 222a, the wafer 3 is placed toward the peeling portion 222a so that the carrier substrate 4 is positioned outside. A heater 225 such as an electrothermal tube may be embedded in the stage 222 to heat the wafer 3 and the carrier substrate 4 placed on the peeling section 222a. The heater 225 is not excluded from being disposed outside the carrier stage 222 for directly heating the carrier substrate 4.

As shown in fig. 4, the suction unit 223 and the ejector 224 are provided in the peeling section 222a. The adsorption assembly 223 may be a vacuum adsorption hole connected to an air suction device and an air guide channel connected to the vacuum adsorption hole, so as to generate negative pressure to adsorb the wafer 3. The plurality of lift pins 224 are provided in the lift-off processing portion 222a so as to be capable of being lowered to be fully embedded in the carrier 222, or raised to push away or receive the wafer 3.

As shown in fig. 1, the plate cooling device 100 is disposed on the base 210, and is located between the two moving guides 240 and adjacent to the carrying device 220.

As shown in fig. 1, the carrier substrate pickup device 230 includes a movable base 232 and a pickup head 234. The movable seat 232 includes two struts 2321 and a bracket 2322 connected to the two struts 2321. The two struts 2321 are respectively inserted into the two guide grooves 242 such that the movable base 232 is movably coupled to the movable guide 240, such that the movable base 232 can move relative to the base 210 in a long axis direction. Meanwhile, the stripping platform 1 further includes a first linear actuator 250 disposed on the base 210 and connected to the movable base 232, particularly to one of the two struts 2321.

As shown in fig. 1, the pickup 234 is movably disposed to the bracket 2322 of the moving mount 232, and is connected to the bracket 2322 by the second linear actuator 260. The pick-up head 234 is configured to be attracted to the carrier substrate 4, and the second linear actuator 260 is configured to drive the pick-up head 234 to advance (descend) toward the base 210 or to move (ascend) away from the base 210. Meanwhile, the pickup head 234 is driven to displace along the long axis direction by the displacement of the two struts 2321 along the guide grooves 242 by the driving of the first linear driver 250.

Referring to fig. 6, a process of peeling the carrier substrate 4 is shown. The wafer 3 is first temporarily attached (bonded) to the carrier substrate 4. The carrier substrate 4 may be, but is not limited to, a glass substrate, and the carrier substrate 4 is used to enhance the mechanical strength of the wafer 3 from the backside of the wafer 3. The wafer 3 is placed in a thinning apparatus, and the surface of the wafer 3 is polished by chemical mechanical polishing or the like to thin the thickness of the wafer 3 and planarize the surface of the wafer 3. The carrier substrate 4 enhances mechanical strength and prevents the wafer 3 from warping during thinning.

As shown in fig. 6 and 7, the plurality of lift pins 224 of the carrier 220 first rise and protrude from the peeling portion 222a, and the wafer 3 to be peeled and the carrier substrate 4 thereof are moved by a robot arm or other handling equipment, placed on the lift pins 224, and oriented to the peeling portion 222a with the wafer 3.

As shown in fig. 8, the lift pins 224 are then lowered to be completely buried in the carrier 222, so that the carrier substrate 4 and the wafer 3 to be peeled are placed in the peeling section 222a. The suction member 223 starts to supply negative pressure to attract/fix the wafer 3, and the heater 225 starts to heat the wafer 3 and the carrier substrate 4, so that the attaching (bonding) structure is weakened, for example, the adhesive for attaching is softened.

As shown in fig. 9 and 10, the second linear actuator 260 drives the pickup head 234 to descend to contact the carrier substrate 4, and the pickup head 234 vacuum-adsorbs the carrier substrate 4. The second linear actuator 260 drives the pickup head 234 to lift, and peels the carrier substrate 4 from the wafer 3.

As shown in fig. 9 and 10, the driving two struts 2321 of the first linear driver 250 are displaced along the guiding groove 242, so as to move the pick-up head 234 and the carrier substrate 4 to the board cooling apparatus 100, and place the carrier substrate 4 in the cooling placement area 110a. By the small area contact of the contact pad 120, the adhesive fixing force generated by the adhesive 4a on the bottom surface of the carrier substrate 4 can temporarily fix the carrier substrate 4 to the cooling-placing area 110a without horizontal movement.

At this time, as shown in fig. 11, the carrier substrate 4 is cooled by a cooling device provided inside or outside the cooling plate 110, for example, a liquid cooling device that cools the cooling plate 110 or an air cooling device that supplies a cooling air flow to the upper surface 111.

The cooled carrier substrate 4 may be picked up by another robot arm or a pickup device and moved onto a turntable. Similarly, the wafer 3 at the lift-off processing section 222a may be picked up by another robot arm or a pickup device and moved onto the turntable. As previously mentioned, the total area of the plurality of contact pads 120 is less than 3% of the area of the carrier substrate 4. By the small-area contact of the contact pads 120, the forward adhesive force (in the direction parallel to the normal line of the upper surface 111) generated by the adhesive 4a of the bottom surface of the carrier substrate 4 is not excessive, and the pick-up head 234 can easily pick up the carrier substrate 4 without causing a pick-up failure or causing breakage of the carrier substrate 4. The adhesion between the carrier substrate 4 and the contact pads 120 still provides sufficient shear-direction adhesive force to avoid horizontal displacement of the carrier substrate 4 on the cooling plate 110.

By the plate cooling device 100 and the stripping platform 1 with the plate cooling device 100, forward adhesive force generated by the adhesive 4a on the bottom surface of the carrier substrate 4 is not excessive, so that the problem of pickup failure of the carrier substrate 4 in the subsequent transfer process of the carrier substrate 4 is avoided, the error rate of stripping operation is reduced, and the yield is effectively improved.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the scope of the utility model, but rather to cover all modifications and variations in the shape, construction, characteristics and spirit of the utility model as defined in the claims.

Claims (9)

1. A board cooling device for cooling a carrier substrate, comprising:

a cooling plate having an upper surface; and

a plurality of contact pads arranged on the upper surface; wherein the plurality of contact pads protrude from the upper surface, and a total area of the plurality of contact pads is less than 3% of an area of the carrier substrate.

2. The plate cooling device of claim 1 wherein the upper surface is provided with a cooling placement area and the plurality of contact pads are located in the cooling placement area.

3. The plate cooling device according to claim 1, wherein the front edge of the upper surface is provided with a groove, the groove extends from the groove to the rear edge of the upper surface, and the plate cooling device further comprises a fixing pad, and the fixing pad is arranged in the groove; the fixing pad is used for allowing the fixing piece to pass through.

4. The plate body cooling device according to claim 1, wherein the cooling plate further comprises two side recesses located at opposite sides of the upper surface, and the plate body cooling device further comprises a plurality of fixing pads disposed at the two side recesses; each fixing pad is used for the passing of the fixing piece.

5. A lift-off station for stripping a wafer from a carrier substrate, comprising:

two moving guide pieces are arranged on two opposite sides of the base;

the bearing device is arranged on the base and is positioned between the two moving guide pieces; the carrying device has:

a carrier table for placing the wafer and the carrier substrate thereon; the top surface of the bearing table is provided with a stripping processing part used for placing the wafer and the carrier substrate, and the carrier substrate is positioned at the outer side;

the adsorption assembly is arranged at the stripping processing part and is used for adsorbing the wafer; and

a plurality of push rods are arranged on the stripping processing part in a lifting manner and can be lowered to be completely embedded in the bearing table, or can be lifted to push away or receive the wafer;

the plate cooling device of claim 1, disposed on the base and between the two moving guides; and

the carrier substrate pickup device comprises a movable seat and a pickup head; wherein the movable seat is movably combined with the two movable guide pieces; the upper surface is provided with a cooling placement area, the contact pads are positioned in the cooling placement area, the pick-up head is movably arranged on the moving seat and used for being adsorbed on the carrier substrate so as to peel the carrier substrate from the wafer and move the carrier substrate to the cooling placement area of the plate body cooling device.

6. The stripping platform of claim 5, wherein each of the moving guides is provided with a guide groove, and the moving base comprises two support posts and a bracket connecting the two support posts, wherein the two support posts are respectively inserted into each guide groove so that the moving base is movably combined with the moving guide, and the pick-up head is movably arranged on the bracket.

7. The peeling platform of claim 6, further comprising a first linear drive and a second linear drive; the first linear driver is arranged on the base and connected with one of the two support posts, and is used for driving each of the two support posts to displace along each guide groove; the pick-up head is connected to the bracket through the second linear driver and is used for driving the pick-up head to advance towards the base or away from the base.

8. The peeling platform of claim 5, wherein the peeling process is a shallow groove.

9. The lift-off station of claim 5, wherein a heater is embedded in the carrier substrate to heat the wafer and the carrier substrate placed in the lift-off processing section.