TWM651821U - Plate cooling device and peeling platform with plate cooling device - Google Patents

Abstract

A plate cooling device is used to cool a carrier substrate of a wafer, and includes a cooling plate and a plurality of contact pads. The cooling plate has an upper surface; wherein a cooling placement area is provided on the upper surface for placing wafers. A plurality of contact pads are disposed on the upper surface. The contact pads protrude from the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier substrate.

Description

Plate cooling device and peeling platform with plate cooling device

The present invention relates to wafer thinning operations, in particular to a plate cooling device used to cool a carrier substrate during wafer peeling operations and a peeling platform having a plate cooling device.

The existing wafer manufacturing process is developing towards thinning. However, in the existing wafer thinning process, the gradually thinned wafer has insufficient stress intensity and is prone to breakage. Therefore, before the thinning operation, the wafer will be bonded to a carrier substrate to improve the mechanical strength, and then chemical mechanical polishing and other thinning operations will be performed on the wafer.

After the thinning operation, the wafer and the carrier substrate need to be heated to weaken the bonding strength, and then the carrier substrate is peeled off using a vacuum pickup device. The carrier substrate is then placed on a cooling platform for cooling and recycling.

However, after the vacuum pickup device separates the carrier substrate from the wafer, the bonding surface of the carrier substrate faces the cooling platform. The joint surface of the carrier substrate has adhesive bonded to the wafer. When the carrier substrate is placed on the cooling platform, the joint surface contacts the cooling platform over a large area, so that the carrier substrate is bonded to the cooling platform by adhesive. When the carrier substrate is transferred to other equipment after the cooling operation is completed, the large area of adhesive will exert great adhesion to the carrier substrate. Therefore, during the process of picking up and transferring the carrier substrate, a pickup failure may easily occur, causing the process of picking up and transferring the carrier substrate to be interrupted. Errors must be eliminated manually. At the same time, if the vacuum is increased to take away the adsorption force of the equipment and forcefully peel the carrier substrate from the cooling platform, the carrier substrate may easily be warped, deformed or cracked. Therefore, it is necessary to improve the way the carrier substrate is placed on the cooling platform to avoid pickup failure during picking up and transferring the carrier substrate.

In view of the above technical problems, the present invention proposes a plate cooling device and a peeling platform with the plate cooling device, which can avoid errors when the plate cooling device picks up and transfers the carrier substrate.

The invention proposes a plate cooling device, which is used to cool a carrier substrate of a wafer, including a cooling plate and a plurality of contact pads. The cooling plate has an upper surface. A plurality of contact pads are disposed on the upper surface. The contact pads protrude from the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier substrate.

In at least one embodiment, a cooling placement area is provided on the upper surface, and the contact pads are located in the cooling placement area.

In at least one embodiment, a front edge of the upper surface is disposed in a notch.

In at least one embodiment, at least one groove is provided on the upper surface, and the groove extends from the notch to a rear edge of the upper surface, and the plate cooling device further includes at least one fixing pad, and at least one fixing pad is disposed in the groove; at least one The fixing pad is used for a fixing piece to pass through.

In at least one embodiment, the cooling plate further includes two concave portions located on two opposite sides of the upper surface, and the plate cooling device further includes a plurality of fixing pads disposed on the two concave portions; each fixing pad is used to provide a Fasteners pass through.

Based on the above-mentioned plate cooling device, the present invention also proposes a peeling platform for peeling a wafer from a carrier substrate, including a base, a carrying device, the aforementioned plate cooling device and a carrier substrate pickup device. Two moving guides are provided on opposite sides of the base. The carrying device is arranged on the base and is located between the two moving guides. The carrying device has a carrying platform, an adsorption element and a plurality of push rods. The carrying platform is used for placing the wafer and the carrier substrate thereon, and the wafer faces the carrying platform. A peeling processing part is provided on the top surface of the carrying platform for placing wafers and carrier substrates, and the carrier substrate is located outside. The adsorption element is arranged in the peeling processing part and is used to adsorb the wafer. A plurality of ejector pins can be lifted and lowered in the peeling processing part, and can be lowered to be completely embedded in the carrying platform, or raised to push away or receive the wafer. The plate cooling device is arranged on the base and is located between the two moving guides, wherein a cooling placement area is defined on the upper surface of the cooling plate. The carrier substrate pickup device includes a moving base and a pickup head; wherein, the moving base is movably combined with two moving guides; the pickup head is movably provided on the moving base and is used to adsorb to the wafer to remove the wafer from the wafer. The carrier substrate is peeled off, and the carrier substrate is moved to the cooling placement area of the plate cooling device.

In at least one embodiment, each moving guide member is provided with a guide groove, and the moving base includes two pillars and a bracket connecting the two pillars. The two pillars are inserted into each guide groove respectively so that the moving base can be movably combined with the moving base. guide member, and the pickup head is movably arranged on the bracket.

In at least one embodiment, the peeling platform further includes a first linear actuator and a second linear actuator; the first linear actuator is disposed on the base and connected to one of the two pillars for driving each of the two pillars along the According to the displacement of each guide groove, the pick-up head is connected to the bracket through a second linear actuator, which is used to drive the pick-up head forward toward the base or away from the base.

In at least one embodiment, the peeling processing portion is a shallow groove.

In at least one embodiment, a heater is embedded in the carrying platform to heat the wafer and the carrier substrate placed in the peeling processing part.

Through the plate cooling device and the peeling platform with the plate cooling device proposed by the present invention, the positive adhesive force generated by the adhesive on the bottom surface of the carrier substrate will not be too large, thus preventing the carrier substrate from being picked up during the subsequent transfer of the carrier substrate. Failure problems occur, reducing the error rate of stripping operations and effectively improving productivity.

1: Stripping the platform

3:wafer

4: Carrier substrate

4a:Viscose

100: Plate cooling device

110:Cooling plate

110a: Cooling placement area

111: Upper surface

1111: front

1112:Behind

1113:Side

113: missing slot

114:Trench

115: Side concave part

120:Contact pad

130: Fixed pad

140: Fixtures

210:Pedestal

220: Carrying device

222: Bearing platform

222a: Peeling processing department

223: Adsorption components

224:Pull

225:Heater

230: Carrier substrate pickup device

232:Mobile base

2321:Pillar

2322:Bracket

234: Pickup head

240:Mobile guide

242:Guide slot

250: First Linear Driver

260: Second linear driver

G: separation distance

Figure 1 is a perspective view of a peeling platform with a plate cooling device in an embodiment of the present invention.

Figure 2 is a perspective view of the plate cooling device in the embodiment of the present invention.

Figure 3 is a top view of the plate cooling device in the new embodiment of the present invention.

Figure 4 is a side view of the carrying device in the embodiment of the present invention.

Figure 5 is a perspective view of the carrying device in the embodiment of the present invention.

6 to 11 are perspective views of the peeling platform in embodiments of the present invention, used to reveal the peeling and cooling process of the carrier substrate.

Please refer to FIGS. 1 to 3 , which illustrate a plate cooling device 100 and a peeling platform 1 having the plate cooling device 100 according to an embodiment of the present invention.

As shown in FIG. 2 and FIG. 3 , the plate cooling device 100 includes a cooling plate 110 and a plurality of contact pads 120 . The cooling plate 110 has an upper surface 111 . A cooling placement area 110a is defined on the upper surface 111 . The cooling placement area 110 a is substantially circular, and its diameter is slightly larger than or equal to the diameter of the predetermined cooling carrier substrate 4 . Specifically, the cooling placement area 110a can be an area defined by a physical structure, such as a groove, or it can be a virtual area used to set the position of the pickup device/robot arm to pick up/place the carrier substrate 4, that is, the cooling placement area 110a. Area 110a is an area defined only in the control program code of the picking device/robot arm.

As shown in FIGS. 2 and 3 , the contact pad 120 is disposed on the upper surface 111 and is located in the cooling placement area 110 a. The contact pad 120 is a cooling placement area 110 a protruding from the upper surface 111 .

As shown in FIGS. 3 , 4 and 5 , the contact pad 120 allows the carrier substrate 4 to be cooled to be placed thereon, and through the support of the contact pad 120 , a distance G is maintained between the carrier substrate 4 and the upper surface 111 . That is, the carrier substrate 4 is only in contact with the contact pads 120 , and the total contact area between the carrier substrate 4 and the contact pads 120 is much smaller than the projected area of the carrier substrate 4 on the upper surface 111 .

As shown in FIG. 4 , the carrier substrate 4 is only in contact with the contact pads 120 , and there is only a small area of contact between the bottom surface of the carrier substrate 4 and the contact pads 120 . Therefore, the adhesive 4a on the bottom surface of the carrier substrate 4 can only act on a small area, greatly reducing the positive viscous force (the viscous force parallel to the normal direction of the upper surface 111).

The aforementioned adhesive force can still temporarily fix the carrier substrate 4 in the cooling placement area 110a, thereby preventing the carrier substrate 4 from sliding and displacing on the upper surface 111. A cooling device may be provided inside or outside the cooling plate 110 , such as a liquid cooling device that liquid-cools the cooling plate 110 , or an air-cooling device that provides cooling airflow to the upper surface 111 to cool the carrier substrate 4 .

As shown in FIG. 3 , specifically, the total area of the contact pads 120 is less than 3% of the area of the carrier substrate 4 , so that the positive adhesive force of the contact pads 120 on the carrier substrate 4 (parallel to the upper surface 111 normal direction) will not be too large to prevent the carrier substrate picking device 230 from being unable to pick up and move the cooled carrier substrate 4 from the contact pads 120 . The plurality of contact pads 120 can be arranged in a radial pattern from the center of the cooling placement area 110a to the outside, and evenly distributed in the cooling placement area 110a, so that the viscous force It acts evenly on the bottom surface of the carrier substrate 4 to form evenly distributed point bonding, replacing large-area bonding at one time.

As shown in FIGS. 2 and 3 , in a specific embodiment, a front edge 1111 of the upper surface 111 is provided in a notch 113 , and the upper surface 111 is provided with one or more grooves 114 . The grooves 114 are formed by the notch 113 Extending to a rear edge 1112 of the upper surface 111. In addition, the cooling plate 110 further includes two side recesses 115 located on two opposite sides 1113 of the upper surface 111 .

As shown in FIGS. 2 and 3 , the plate cooling device 100 further includes a plurality of fixing pads 130 , which are respectively disposed in the groove 114 and the side recess 115 . The fixing pad 130 is used for fixing members 140 (such as bolts) to pass through to fix the cooling plate 110 on the stripping platform 1 or other bases 210 .

As shown in FIG. 1 , the peeling platform 1 includes a base 210 , a carrying device 220 , the aforementioned plate cooling device 100 and a carrier substrate picking device 230 .

As shown in FIG. 1 , two moving guides 240 are provided on two opposite sides 1113 of the base 210 , and guide grooves 242 are provided on the moving guides 240 . The carrying device 220 is disposed on the base 210 and is located between the two moving guides 240 .

As shown in FIGS. 1 and 4 , the carrying device 220 has a carrying platform 222 , an adsorption element 223 and a plurality of push rods 224 . The carrying platform 222 is used for placing the wafer 3 to be stripped and its carrier substrate 4 thereon. A peeling processing part 222a is provided on the top surface of the carrying platform 222, and the peeling processing part 222a may be a shallow groove. When the wafer 3 and its carrier substrate 4 are placed in the peeling processing part 222a, the wafer 3 is placed toward the peeling processing part 222a, so that the carrier substrate 4 is located outside. A heater 225 such as an electric heating tube may be embedded in the carrying table 222 to heat the wafer 3 and the carrier substrate 4 placed in the peeling processing part 222a. The heater 225 is not excluded from being provided outside the carrying platform 222 and is used to directly heat the carrier substrate 4 .

As shown in FIG. 4 , the adsorption element 223 and the push pin 224 are provided in the peeling processing part 222a. The adsorption element 223 may be a vacuum adsorption hole connected to an air extraction device and an air guide channel connected to the vacuum adsorption hole, thereby generating negative pressure to adsorb the wafer 3 . The plurality of ejector pins 224 are elevatingly provided in the peeling processing part 222a, and can be lowered to be completely embedded in the carrying platform 222, or raised to push away or receive the wafer 3.

As shown in FIG. 1 , the plate cooling device 100 is disposed on the base 210 and is located between the two moving guides 240 and adjacent to the carrying device 220 .

As shown in FIG. 1 , the carrier substrate picking device 230 includes a moving base 232 and a picking head 234 . The mobile base 232 includes two pillars 2321 and a bracket 2322 connecting the two pillars 2321. The two pillars 2321 are respectively inserted into the two guide grooves 242 so that the movable base 232 is movably combined with the movable guide 240 so that the movable base 232 can move relative to the base 210 in a long axis direction. At the same time, the peeling platform 1 also includes a first linear actuator 250, which is disposed on the base 210 and connected to the moving base 232, especially to one of the two pillars 2321.

As shown in FIG. 1 , the pickup head 234 is movably disposed on the bracket 2322 of the moving base 232 and is connected to the bracket 2322 through a second linear actuator 260 . The pick-up head 234 is used to be adsorbed on the carrier substrate 4 , and the second linear driver 260 is used to drive the pick-up head 234 forward toward the base 210 (descending) or away from the base 210 (raising). At the same time, by driving the two pillars 2321 of the first linear actuator 250 to move along the guide groove 242, the pickup head 234 can be driven to move along the long axis direction.

Please refer to Figure 6, which shows the peeling process of the carrier substrate 4. The wafer 3 is first temporarily bonded (bonded) to the carrier substrate 4 . The carrier substrate 4 may be but is not limited to a glass substrate. The carrier substrate 4 is used to enhance the mechanical strength of the wafer 3 from the back side of the wafer 3 . The wafer 3 is then placed in the thinning equipment, and the surface of the wafer 3 is polished by chemical mechanical polishing or other methods to reduce the thickness of the wafer 3, and And the surface of the wafer 3 is planarized. The carrier substrate 4 enhances the mechanical strength and prevents the wafer 3 from warping during the thinning process.

As shown in FIGS. 6 and 7 , the plurality of ejector pins 224 of the carrying device 220 first rise and protrude from the peeling processing part 222 a, and the wafer 3 and its carrier substrate 4 to be peeled are carried out by a robot arm or other transportation equipment. Move and place it on the ejector pin 224, with the wafer 3 facing the peeling processing part 222a.

As shown in FIG. 8 , then, the ejector pin 224 is lowered and completely embedded in the carrying platform 222 , so that the carrier substrate 4 and the wafer 3 to be peeled are placed in the peeling processing part 222 a. The adsorption element 223 starts to provide negative pressure to attract/fix the wafer 3, and the heater 225 starts to heat the wafer 3 and the carrier substrate 4, so that the bonding (bonding) structure is weakened, such as the adhesive used for bonding. soften.

As shown in FIGS. 9 and 10 , the second linear driver 260 drives the pick-up head 234 downward to contact the carrier substrate 4 , and the pick-up head 234 uses vacuum to absorb the carrier substrate 4 . The second linear driver 260 drives the pickup head 234 to rise to peel off the carrier substrate 4 from the wafer 3 .

As shown in FIGS. 9 and 10 , the two driving pillars 2321 of the first linear actuator 250 are displaced along the guide groove 242 to move the pickup head 234 and the carrier substrate 4 to the plate cooling device 100 , and place the carrier substrate 4 Cool the placement area 110a. Through the small area contact of the contact pad 120, the adhesive fixing force generated by the adhesive 4a on the bottom surface of the carrier substrate 4 can temporarily fix the carrier substrate 4 in the cooling placement area 110a without horizontal movement.

As shown in FIG. 11 , at this time, through a cooling device disposed inside or outside the cooling plate 110 , such as a liquid cooling device that liquid-cools the cooling plate 110 , or an air-cooling device that provides cooling airflow to the upper surface 111 , to The carrier substrate 4 is cooled.

The cooled carrier substrate 4 can be picked up by other robot arms or picking devices and moved to the transfer plate. Similarly, the wafer 3 located in the peeling processing part 222a can be processed by other machinery. The arm and the picking device pick up and move them to its transfer plate. As mentioned above, the total area of the contact pads 120 is less than 3% of the area of the carrier substrate 4 . Through the small area contact of the contact pad 120, the positive adhesive force (parallel to the normal direction of the upper surface 111) generated by the adhesive 4a on the bottom surface of the carrier substrate 4 will not be too large, and the pick-up head 234 can easily pick up the carrier substrate 4 Picked up without causing pickup failure or damage to the carrier substrate 4 . The adhesion between the carrier substrate 4 and the contact pad 120 can still provide sufficient adhesive force in the shear direction to prevent the carrier substrate 4 from horizontal displacement on the cooling plate 110 .

Through the plate cooling device 100 and the peeling platform 1 provided with the plate cooling device 100 proposed by the present invention, the positive adhesive force generated by the adhesive 4a on the bottom surface of the carrier substrate 4 will not be too large, thus avoiding the subsequent transfer process of the carrier substrate 4 The problem of failure to pick up the carrier substrate 4 occurs, thereby reducing the error rate of the peeling operation and effectively improving the productivity.

100: Plate cooling device

110:Cooling plate

110a: Cooling placement area

1111: front

1112:Behind

1113:Side

113: missing slot

120:Contact pad

130: Fixed pad

140: Fixtures

Claims (10)

A plate cooling device for cooling a carrier substrate, including: a cooling plate having an upper surface; and a plurality of contact pads disposed on the upper surface; wherein the contact pads protrude from the upper surface, and the The total area of the contact pads is less than 3% of the area of the carrier substrate. The plate cooling device of claim 1, wherein a cooling placement area is provided on the upper surface, and the contact pads are located in the cooling placement area. The plate cooling device according to claim 1, wherein a front edge of the upper surface is disposed in a notch. The plate cooling device of claim 3, wherein the upper surface is provided with at least one groove extending from the notch to a rear side of the upper surface, and the plate cooling device further includes at least one fixed Pad, the at least one fixing pad is arranged in the groove; the at least one fixing pad is used for a fixing piece to pass through. The plate cooling device of claim 1, wherein the cooling plate further includes two side recesses located on two opposite sides of the upper surface, and the plate cooling device further includes a plurality of fixing pads disposed on the two opposite sides. Side recesses; each fixing pad is used for a fixing piece to pass through. A peeling platform used to peel a wafer from a carrier substrate, including: a base with two moving guides provided on its opposite sides; a carrying device provided on the base and located on the Between two moving guides; the carrying device has: A carrying platform for placing the wafer and the carrier substrate on it; a peeling processing portion is provided on the top surface of the carrying platform for placing the wafer and the carrier substrate, and the carrier substrate Located on the outside; an adsorption element is provided in the peeling processing part to absorb the wafer; and a plurality of ejector pins can be lifted and lowered in the peeling processing part, and can be lowered to be completely embedded in the carrying platform, or It is to rise to push away or accept the wafer; the plate cooling device as described in claim 1 is provided on the base and is located between the two moving guides, wherein the upper part of the cooling plate A cooling placement area is defined on the surface; and a carrier substrate pickup device includes a moving base and a pickup head; wherein the moving base is movably combined with the two moving guides; the pickup head is movably disposed on the The moving base is used for adsorbing on the carrier substrate, peeling off the carrier substrate from the wafer, and moving the carrier substrate to the cooling placement area of the plate cooling device. The peeling platform according to claim 6, wherein each movable guide member is provided with a guide groove, and the movable base includes two pillars and a bracket connecting the two pillars, and the two pillars are inserted into each of the guide grooves respectively. The moving base is movably coupled to the moving guide, and the pickup head is movably disposed on the bracket. The peeling platform as claimed in claim 7, further comprising a first linear actuator and a second linear actuator; the first linear actuator is disposed on the base and connected to one of the two pillars for driving Each of the two pillars displaces along each guide groove; the pickup head is connected to the bracket through the second linear driver for driving the pickup head toward the base or away from the base. The peeling platform according to claim 6, wherein the peeling processing part is a shallow groove. The peeling platform according to claim 6, wherein a heater is embedded in the carrying platform to heat the wafer and the carrier substrate placed in the peeling processing part.

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