CN115440615A - Substrate separating device - Google Patents
Substrate separating device Download PDFInfo
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- CN115440615A CN115440615A CN202110615231.3A CN202110615231A CN115440615A CN 115440615 A CN115440615 A CN 115440615A CN 202110615231 A CN202110615231 A CN 202110615231A CN 115440615 A CN115440615 A CN 115440615A
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- substrate
- adsorption
- adsorption component
- lifting mechanism
- elastic abutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate separation device, which comprises a base and an adsorption moving module. The adsorption moving module comprises an adsorption component, a lifting mechanism, a body and a plurality of elastic supporting pieces. The adsorption component adsorbs a second substrate, the lifting mechanism is connected with the adsorption component and drives the adsorption component and the adsorbed second substrate to lift relative to the base, the body is connected with the base and the lifting mechanism and drives the adsorption component and the adsorbed second substrate to displace relative to the base, and the elastic abutting part is connected with the lifting mechanism.
Description
Technical Field
The invention relates to a substrate separation device, which utilizes an adsorption moving module to separate a second substrate bonded with a first substrate from the first substrate, and the adsorption moving module moves the second substrate separated from the first substrate to a placing area for placing.
Background
Integrated circuit technology has advanced to a mature stage, and electronic products are now being developed towards the trend of being light, thin, high-performance, high-reliability and intelligent. The performance of the chip in the electronic product is greatly affected, wherein the thickness of the chip is particularly relevant to the performance of the electronic product. For example, thinner chips may improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce the volume and weight of the package.
In a semiconductor process, a substrate thinning process, a via etching process, a backside metallization process, etc. are usually performed on the backside (lower surface) of a chip. However, when the thickness of the wafer (first substrate) is too thin (for example, less than or equal to 150 μm), the wafer may be cracked or bent during the thinning process. Generally, before thinning the substrate, the first substrate and the second substrate (e.g., sapphire substrate) are bonded, and after the thinning process is completed, the first substrate and the second substrate are separated by debonding.
In the debonding process, the second substrate is usually separated from the wafer (the first substrate) by sucking the second substrate with a vacuum suction module. However, when the vacuum suction module is to unload or release the second substrate, the vacuum state is not completely released, and the second substrate may jump, so that the second substrate cannot be stably and accurately placed on the placing table, and the second substrate may be damaged to contaminate the debonding table.
Disclosure of Invention
In order to solve the problems of the prior art, the present invention provides a substrate separation apparatus, which mainly includes a plurality of elastic supporting members disposed on an adsorption moving module, so that when the adsorption moving module unloads or releases a second substrate onto a placing stage, the elastic supporting members continuously support the second substrate, so as to separate the second substrate from an adsorption component, and simultaneously maintain the second substrate stably supported on the placing stage.
An objective of the present invention is to provide a substrate separation apparatus, which includes a base and an adsorption moving module, wherein the adsorption moving module is connected to the base and mainly includes an adsorption assembly, a lifting mechanism and a plurality of elastic supporting members. The lifting mechanism is connected with the adsorption component and drives the adsorption component and the second substrate adsorbed by the adsorption component to lift relative to the base, the elastic abutting piece is connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting piece to enable the second substrate to be in a compression state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting piece can be released from the compression state to extend and continuously abut against the second substrate, so that the second substrate is separated from the adsorption component, and meanwhile, the second substrate is maintained to stably abut against the placing table of the base.
An objective of the present invention is to provide a substrate separating apparatus, which includes a base and an adsorption moving module, wherein the base includes a separating area and a placing area, and the placing area includes a placing table. The adsorption moving module is connected with the base and comprises an adsorption component, a lifting mechanism, a body and a plurality of elastic abutting pieces. The lifting mechanism is connected with the adsorption component and drives the adsorption component and the second substrate adsorbed by the adsorption component to lift relative to the base, the body is connected with the base and the lifting mechanism and drives the adsorption component and the second substrate adsorbed by the adsorption component to displace between the separation area and the placement area, and the elastic abutting piece is connected with the lifting mechanism. When the adsorption component adsorbs the second substrate positioned in the separation area, the second substrate can compress the elastic abutting piece to enable the elastic abutting piece to be in a compression state. And then, the adsorption moving module moves to the upper part of the placing area, the lifting mechanism drives the adsorption component and the adsorbed second substrate to descend until the second substrate contacts with the placing table, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, the elastic abutting piece is released from a compressed state and continuously abuts against the second substrate, so that the second substrate is separated from the adsorption component, and meanwhile, the second substrate is maintained to stably abut against the placing table.
In order to achieve the above object, the present invention provides a substrate separation apparatus, comprising a base and an adsorption moving module, wherein the base comprises a separation area and a placing area, the separation area is provided with: a bearing unit suitable for bearing a carrier plate, a heating unit used for heating a first base plate and a second base plate which are bonded, and a vacuum unit used for adsorbing the first base plate, wherein the placing area is provided with a placing table, and the adsorption moving module comprises: an adsorption component for adsorbing the second substrate; the lifting mechanism is connected with the adsorption assembly and drives the adsorption assembly and the second substrate adsorbed by the adsorption assembly to lift relative to the base; the body is connected with the base and the lifting mechanism and drives the adsorption component and the second substrate adsorbed by the adsorption component to move between the separation area and the placing area; and the elastic abutting pieces are connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting pieces to enable the elastic abutting pieces to be in a compressed state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting pieces can be released from the compressed state to extend, so that the second substrate is separated from the adsorption component.
The substrate separating device comprises an elastic part, a lifting mechanism and a contact part, wherein the elastic part comprises an elastic part connected with the lifting mechanism and the contact part connected with the elastic part and used for contacting with the second substrate.
The substrate separation device is characterized in that the elastic part comprises a spring.
In the substrate separating apparatus, the adsorption moving module further includes a connecting member connected to the body. The lifting mechanism is connected with the adsorption component through the connecting piece and drives the connecting piece, the adsorption component and the adsorbed second substrate to lift relative to the body and the base. The elastic propping piece is connected with the lifting mechanism through the connecting piece. According to some embodiments of the present invention, the lifting mechanism includes a hydraulic assembly or a motor, which is connected to the connecting member and drives the connecting member, the suction assembly and the second substrate sucked by the suction assembly to lift and lower relative to the body and the base.
In the substrate separation device, the plurality of elastic supporting pieces are arranged around the adsorption component.
The substrate separation device is provided with at least two, at least three or at least four elastic abutting pieces which are arranged around the adsorption component. Preferably, when the elastic abutting element is released from the compressed state and extends, the moment generated by the force applied to the second substrate is offset, so that the second substrate can be stably abutted on the placing table when leaving the adsorption assembly. For example, two elastic abutting pieces are arranged on two sides of the adsorption component in a surrounding mode, and three or more elastic abutting pieces are arranged around the adsorption component at equal intervals.
The substrate separation device is characterized in that the adsorption moving module is arranged above the separation area, the lifting mechanism drives the adsorption component and the elastic abutting part to descend, the elastic abutting part abuts against the second substrate, the lifting mechanism drives the adsorption component to continue descending, the elastic abutting part is compressed from a relaxation state until the adsorption component contacts with the second substrate, and the adsorption component adsorbs the second substrate, or the adsorption moving module is arranged above the placement area, the lifting mechanism drives the adsorption component and the adsorbed second substrate to descend until the second substrate contacts with the placement platform, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, the elastic abutting part releases from the compression state to continuously abut against the second substrate, and the second substrate is separated from the adsorption component. In the substrate separation device, the elastic abutting part can protrude out of the adsorption component in a relaxed state.
The base plate separating device comprises a track, and the adsorption moving module is connected with the base plate through the track and moves relative to the base plate along the track.
The substrate separating device comprises a bearing unit and a plurality of lifting rods, wherein the lifting rods are used for bearing the carrier plate and the bonded first substrate and second substrate placed on the carrier plate and driving the bearing carrier plate, the first substrate and the second substrate to approach the bearing table so as to place the carrier plate, the first substrate and the second substrate on the bearing table.
In the substrate separating device, the carrier has a plurality of through holes, and the vacuum unit adsorbs the first substrate through the plurality of through holes of the carrier.
The substrate separation device is characterized in that the adsorption unit of the adsorption moving module is adsorbed and positioned on the second substrate of the separation area, and the body drives the adsorption component and the adsorbed second substrate to slide relative to the first substrate, so that the second substrate is separated from the first substrate.
Drawings
Fig. 1 is a perspective view illustrating an embodiment of the present invention.
Fig. 2 is a schematic perspective view of an embodiment of the present invention.
Fig. 3 is a schematic perspective view of an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of an embodiment of the invention.
Description of reference numerals: 11-a base; 111-track; 13, a separation area; 131-a carrying unit; 1311-lifting rod; 1313-a carrier table; 15-a placement area; 151-placing table; 17-an adsorption movement module; 171-a body; 172-orbit; 173-a lifting mechanism; 174-a connector; 175-an adsorption component; 177-an elastic abutting piece; 1771-elastic part; 1773-a contact portion; c-a carrier plate; w-a first substrate; s-a second substrate.
Detailed Description
Please refer to fig. 1 and 2, which illustrate an embodiment of the present invention. As shown, the substrate separating apparatus includes a base 11 and an adsorption moving module 17. The base 11 includes a separating area 13, a placing area 15 and a rail 111.
The separation region 13 is provided with a carrying unit 131 adapted to carry a carrier C, a heating unit (not shown) for heating a bonded first substrate W and a bonded second substrate S, and a vacuum unit (not shown) for adsorbing the first substrate W. The supporting unit 131 includes a plurality of lift rods 1311 and a supporting platform 1313. The placing area 15 is provided with a placing table 151.
In the embodiment, the carrier C is a SiC carrier, the first substrate W is a wafer, and the second substrate S is a sapphire substrate, but the invention is not limited thereto.
The adsorption moving module 17 includes an adsorption element 175, a lifting mechanism 173, a body 171 and a plurality of elastic supporting members 177.
The chucking device 175 includes, but is not limited to, a vacuum chucking device (e.g., a vacuum chuck) for chucking the second substrate S.
The lifting mechanism 173 is connected to the adsorption assembly 175 and drives the adsorption assembly 175 and the second substrate S adsorbed by the adsorption assembly to lift relative to the susceptor 11. Referring to fig. 3, fig. 4 and fig. 5, in the present embodiment, the adsorption moving module 17 further includes a connecting member 174 connected to the main body 171 through a rail 172, the lifting mechanism 173 is connected to the adsorption assembly 175 through the connecting member 174, and the elastic abutting member 177 is connected to the lifting mechanism 173 through the connecting member 174. For example, the lifting mechanism 173 includes a hydraulic assembly, a motor, a cylinder or a screw, and drives the connecting member 174, the adsorbing assembly 175 and the adsorbed second substrate S to lift relative to the main body 171 and the susceptor 11.
The body 171 is connected to the lifting mechanism 173 and is connected to the base 11 through the rail 111, so that the adsorption moving module 17 can move along the rail 111 relative to the base 11, wherein the body 171 drives the adsorption element 175 and the second substrate S adsorbed by the adsorption element to move along the rail 111 between the separation area 13 and the placement area 15.
Referring to fig. 4 and fig. 5, the elastic member 177 includes an elastic portion 1771 and a contact portion 1773. The elastic portion 1771 is connected to the lifting mechanism 173 through the connecting member 174. The contact portion 1773 is connected to the elastic portion 1771 and contacts the second substrate S. Generally, the resilient portion 1771 includes a telescopic rod and a spring, the spring is sleeved on the telescopic rod; the contact portion 1773 is made of a material suitable for contacting the second substrate S, such as a plastic.
When the adsorption element 175 adsorbs the second substrate S, the second substrate S compresses the elastic abutting element 177 to be in a compressed state, and when the adsorption element 175 releases the suction force to the second substrate S, the elastic abutting element 177 is released from the compressed state to extend, so that the second substrate S is separated from the adsorption element 175. Referring again to fig. 5, resilient biasing element 177, in its relaxed state, protrudes beyond absorbing element 175. As shown, the elastic support member 177 has a height h1 in the relaxed state, and the absorption element 175 has a height h2, wherein h1 is greater than h2.
To debond the bonded first and second substrates W and S using the substrate separation apparatus, as shown in fig. 1, the carrier C is first placed on the plurality of lift pins 1311 of the carrying unit 131 (at this time, the lift pins 1311 are in a raised state), and then the bonded first and second substrates W and S are placed on the carrier C with the first substrate W facing downward and contacting the carrier C. The lifting rods 1311 descend to drive the carrier C, the first substrate W and the second substrate S to approach the carrier 1313, so as to place the carrier C, the first substrate W and the second substrate S on the carrier 1313. Next, a heating unit (not shown) heats the first substrate W and the second substrate S to soften the adhesive bonding the two substrates.
The adsorption moving module 17 moves to the upper side of the separation region 13 along the rail 111, the lifting mechanism 173 drives the adsorption element 175 and the elastic abutting element 177 to descend, the elastic abutting element 177 abuts against the second substrate S, the lifting mechanism 173 drives the adsorption element 175 to descend continuously, the elastic abutting element 177 is compressed from a loose state until the adsorption element 175 contacts the second substrate S, and at this time, the adsorption element 175 adsorbs the second substrate S. Meanwhile, the vacuum unit (not shown) also sucks the first substrate W. In the present embodiment, the carrier C has a plurality of through holes (not shown), and the vacuum unit sucks the first substrate W through the plurality of through holes of the carrier C.
Then, the body 171 drives the adsorption assembly 175 and the second substrate S adsorbed by the adsorption assembly to slide relative to the first substrate W, so that the second substrate S is separated from the first substrate W. Referring to fig. 3, 4 and 5, the adsorption moving module 17 moves to the upper portion of the placing region 15 along the rail 111, the lifting mechanism 173 drives the adsorption element 175 and the second substrate S adsorbed by the adsorption element to descend until the second substrate S contacts the placing stage 151 (as shown in fig. 4), the adsorption element 175 releases the suction force on the second substrate S and is driven by the lifting mechanism 173 to ascend, the elastic abutting element 177 releases from the compressed state and continuously abuts against the second substrate S, so that the second substrate S leaves the adsorption element 175, and the second substrate S is maintained to stably abut against the placing stage 151 (as shown in fig. 5).
Finally, the plurality of lift pins 1311 of the carrier unit 131 are lifted again (at this time, the suction force of the vacuum unit is released), the carrier C and the first substrate W retained thereon are driven to be away from the carrier 1313, and the carrier C and the first substrate W are moved to the cleaning machine by the wafer robot for cleaning, and the debonding process is completed after the cleaning.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, which is intended to include all equivalent variations and modifications in shape, structure, characteristics and spirit of the invention.
Claims (10)
1. A substrate separation apparatus, comprising:
a base, comprising:
a separation area, which is provided with a bearing unit and is suitable for bearing a carrier plate; a heating unit for heating a first substrate and a second substrate, wherein the first substrate and the second substrate are bonded to each other; and a vacuum unit for adsorbing the first substrate; and
a placing area provided with a placing table; and
an adsorption movement module comprising:
an adsorption component for adsorbing the second substrate;
the lifting mechanism is connected with the adsorption assembly and drives the adsorption assembly and the second substrate adsorbed by the adsorption assembly to lift relative to the base;
the body is connected with the base and the lifting mechanism and drives the adsorption component and the second substrate adsorbed by the adsorption component to displace between the separation area and the placing area; and
and the elastic abutting pieces are connected with the lifting mechanism, when the adsorption component adsorbs the second substrate, the second substrate can compress the elastic abutting pieces to enable the elastic abutting pieces to be in a compressed state, and when the adsorption component releases the suction force on the second substrate, the elastic abutting pieces can be released from the compressed state to extend, so that the second substrate is separated from the adsorption component.
2. The apparatus of claim 1, wherein the resilient urging member comprises:
an elastic part connected with the lifting mechanism; and
a contact part connected to the elastic part for contacting the second substrate.
3. The apparatus of claim 2, wherein the resilient portion comprises a spring.
4. The apparatus of claim 1, wherein the plurality of resilient members are disposed around the suction assembly.
5. The substrate separation apparatus according to claim 1, wherein:
the adsorption moving module is arranged above the separation area, the lifting mechanism drives the adsorption component and the elastic abutting part to descend, the elastic abutting part can abut against the second substrate, the lifting mechanism drives the adsorption component to continue descending, the elastic abutting part is compressed from a loose state until the adsorption component contacts the second substrate, and the adsorption component adsorbs the second substrate; or
The adsorption moving module is arranged above the placing area, the lifting mechanism drives the adsorption component and the second substrate adsorbed by the adsorption component to descend until the second substrate contacts the placing table, the adsorption component releases the suction force on the second substrate and is driven by the lifting mechanism to ascend, and the elastic abutting piece is released from the compression state and continuously abuts against the second substrate to enable the second substrate to leave the adsorption component.
6. The apparatus of claim 5, wherein the resilient urging member protrudes from the suction member in the relaxed state.
7. The apparatus of claim 1, wherein the susceptor comprises a rail, and the chucking motion module is coupled to the susceptor through the rail and is movable relative to the susceptor along the rail.
8. The apparatus of claim 1, wherein the supporting unit comprises a plurality of lifting rods and a supporting platform, the lifting rods are used to support the supporting plate and the first and second substrates thereon and drive the supporting plate, the first and second substrates to approach the supporting platform, so as to place the supporting plate, the first and second substrates on the supporting platform.
9. The apparatus of claim 1, wherein the carrier has a plurality of through holes, and the vacuum unit sucks the first substrate through the plurality of through holes of the carrier.
10. The apparatus of claim 1, wherein the adsorption unit of the adsorption moving module adsorbs the second substrate located in the separation region, and the body drives the adsorption assembly and the adsorbed second substrate to slide relative to the first substrate, so that the second substrate is separated from the first substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110615231.3A CN115440615A (en) | 2021-06-02 | 2021-06-02 | Substrate separating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110615231.3A CN115440615A (en) | 2021-06-02 | 2021-06-02 | Substrate separating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115440615A true CN115440615A (en) | 2022-12-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110615231.3A Pending CN115440615A (en) | 2021-06-02 | 2021-06-02 | Substrate separating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115440615A (en) |
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2021
- 2021-06-02 CN CN202110615231.3A patent/CN115440615A/en active Pending
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