JP7489929B2 - Chip peeling method, semiconductor device manufacturing method, and chip peeling device - Google Patents

Description

The present invention relates to a chip peeling method, a semiconductor device manufacturing method, and a chip peeling device.

In the manufacturing process of semiconductor devices, it is necessary to peel off the diced semiconductor chip (hereinafter simply referred to as the chip) from the adhesive sheet and pick it up. Among the chip peeling devices that peel off the chip, there are several needleless devices that do not use needles to peel off the chip.

For example, the chip peeling device 100 of Patent Document 1 includes a base stage 101 and a movable stage 102, as shown in FIG. 13. An adhesive sheet 104 to which a chip 103 is attached is disposed above the base stage 101 and the movable stage 102. A space 105 is formed between the adhesive sheet 104 and the base stage 101 on the outer periphery of the movable stage 102. The base stage 101 is provided with a suction hole (not shown) that communicates with the space 105. The chip 103 to be peeled protrudes to the outer periphery of the movable stage 102, and the outer periphery of the chip 103 is disposed above the space 105.

When peeling off the chip, the chip peeling device 100 performs a suction operation through the suction holes in the base stage 101 while the collet 106 is holding the chip 103 upward in the figure. This creates a negative pressure in the space 105, sucking the adhesive sheet 104 above the space 105, and the outer periphery of the chip 103 peels off from the adhesive sheet 104 (hereinafter, this peeling is referred to as initial peeling).

After the initial peeling, the movable stage 102 is moved to the left in the figure. This increases the area of the adhesive sheet 104 that is sucked through the suction holes, and finally the chip 103 can be peeled off from the adhesive sheet 104.

For example, the semiconductor manufacturing apparatus 130 of Patent Document 2, as shown in FIG. 14, comprises a first block 131, a second block 132, a third block 133, a fourth block 134, and a fifth block 135, and an adsorption portion 136 around them. Each of the blocks 131 to 135 can be moved individually in the vertical direction of the figure, and can push up the dicing tape 139 and chip 138 placed on the top. The first block 131 can also be moved in the horizontal direction of the figure. The dicing tape 139 and the chip 138 to be peeled off are placed on the top of the first block 131 to the fifth block 135.

When peeling off the chip, first, as shown in FIG. 14, each block 131 to 135 is positioned at the same height as the suction portion 136. In this state, the dicing tape 139 is sucked through the multiple suction holes provided in the suction portion 136 and the gaps between each block. Then, the chip 138 is sucked by a collet (not shown), and the first block 131 to the fifth block 135 are raised to a set height as shown in FIG. 15. This creates a step between the first block 131 to the fifth block 135 and the suction portion 136, and the dicing tape 139 is deformed. Then, when the dicing tape 139 has deformed a certain amount, an initial peel occurs in which the outer peripheral end side of the chip 138 peels off from the dicing tape 139.

Patent No. 5214739 JP 2019-47089 A

In the initial peeling method described in Patent Document 1, the adhesive sheet is sucked through suction holes, causing a deformation in the adhesive sheet that is sufficient to peel off the chip all at once. This deformation of the adhesive sheet therefore exerts a large pressure on the chip, which may cause cracks on the outer periphery of the chip during initial peeling. In particular, when the outer periphery of the chip has chipping or cracks that weaken its strength, the above-mentioned cracking problem is significant.

In addition, in the initial peeling in Patent Document 2, the amount of protrusion of the chip 138 from the first block 131 (the amount of protrusion in the left-right direction in FIG. 14) is constant, so if you try to mitigate the impact on the die during peeling, the only way is to slow down the rising speed of the first block 131 to the fifth block 135 during initial peeling. As mentioned above, if there is chipping or cracks on the outer edge of the chip, the initial peeling takes a long time.

In view of the above, the objective of the present invention is to prevent cracks from occurring on the outer edge of the chip during the initial peeling process in which the outer edge of the chip is peeled off from the adhesive sheet.

In order to solve the above problems, the present invention provides a chip peeling method for peeling a chip from an adhesive sheet having a chip attached to its upper surface, which is characterized in that the adhesive sheet having the chip attached thereto is positioned so that the outer peripheral end side of the chip to be peeled is positioned in a position corresponding to the space between the first stage and the second stage, and then, while creating a negative pressure in the space and sucking the adhesive sheet, at least one of the first stage and the second stage is moved in a direction narrowing the space, thereby peeling the outer peripheral end side of the chip from the adhesive sheet.

According to the chip peeling method of the present invention, by gradually narrowing the space while creating negative pressure in the space and sucking the adhesive sheet, the deformation angle of the adhesive sheet can be gradually increased at the position corresponding to the space. In other words, during the first suction, the adhesive sheet is deformed to an extent that the chip does not peel off, and then the deformation angle of the adhesive sheet is gradually increased, making it possible to peel off the outer edge side of the chip. Therefore, compared to the method of deforming the adhesive sheet all at once to an angle at which the chip peels off, as in Patent Document 1, the pressure applied to the chip during the peeling operation can be reduced. Therefore, cracking of the outer edge side of the chip during the peeling operation can be prevented.

The above chip peeling method can be a method in which the first stage is provided with a negative pressure passage at a position corresponding to the space for creating a negative pressure in the space, the second stage is slidable relative to the first stage in a direction to widen and narrow the space, and after peeling off the outer peripheral end side of the chip, the second stage is slid relative to the first stage in a direction to widen the space, thereby further peeling the chip from the adhesive sheet.

The chip peeling method can also be a method in which the chip to be peeled is placed at a position corresponding to the second stage and one or more contact/separation stages, the contact/separation stages are movable in a direction to contact or separate from the adhesive sheet, the second stage is placed between the contact/separation stage and the first stage, and is horizontally movable in a direction to narrow the space in a direction to approach the first stage and in a direction to widen the space in a direction to move away from the first stage, and after the outer peripheral end side of the chip is peeled off, the contact/separation stages placed outside the chip are sequentially moved in a direction to move away from the adhesive sheet, and the second stage is moved horizontally in a direction to widen the space, thereby further peeling the chip from the adhesive sheet.

In addition, the above chip peeling method can be used to manufacture semiconductor devices.

In order to solve the above problem, the present invention provides a chip peeling device that peels off a chip from an adhesive sheet having a chip attached to its upper surface, the device comprising: a first stage and a second stage on which the adhesive sheet is arranged so that the outer peripheral end side of the chip to be peeled off is positioned in the space between the stages; a negative pressure generating mechanism that generates negative pressure in the space to suck in the adhesive sheet; and a moving mechanism that, while negative pressure is generated in the space by the negative pressure generating mechanism, moves at least one of the first stage and the second stage in a direction that narrows the space, thereby peeling off the outer peripheral end side of the chip from the adhesive sheet.

The present invention can prevent cracks from occurring on the outer edge side of the tip.

FIG. 2 is a plan view showing a chip attached to an adhesive sheet. FIG. 2 is a plan view showing the chip peeling device of the present embodiment. 1 is a cross-sectional view showing a chip peeling device of the present embodiment. 10A to 10C are cross-sectional views showing a process of peeling off a chip by the chip peeling device, illustrating a state in which the outer peripheral end of the chip has been sucked. 10A to 10C are cross-sectional views showing a process of peeling off a chip by the chip peeling device, illustrating how the movable stage is moved to narrow the space. 1A to 1C are cross-sectional views showing a process of peeling off a chip by the chip peeling device, illustrating a state in which the chip has been initially peeled off. 10A to 10C are cross-sectional views showing the process of peeling off the chip by the chip peeling device, illustrating how the peeled range of the chip is expanded after the initial peeling. FIG. 11 is a cross-sectional view showing a chip peeling device according to a different embodiment from the above. 9 is a cross-sectional view showing a process of peeling off a chip by the chip peeling device of FIG. 8, showing how the first block is moved to narrow the space. FIG. 9A to 9C are cross-sectional views showing the process of peeling off a chip by the chip peeling device of FIG. 8, illustrating a state in which the chip has been initially peeled off. 9 is a cross-sectional view showing the process of peeling off the chip by the chip peeling device of FIG. 8, showing how the peeled range of the chip is expanded after the initial peeling. FIG. FIG. 9 is a plan view of the chip peeling device of FIG. 8 . FIG. 1 is a cross-sectional view showing a conventional chip peeling device. FIG. 14 is a cross-sectional view showing a conventional chip peeling device different from that shown in FIG. 13. FIG. 14 is a cross-sectional view showing a conventional chip peeling device different from that shown in FIG. 13.

The following describes an embodiment of the present invention with reference to the drawings. Note that in each drawing, the same or corresponding parts are given the same reference numerals, and duplicate descriptions will be appropriately simplified or omitted.

The chips of this embodiment are cut into rectangular shapes from the wafer material and can be removed as the final product by peeling them off from the adhesive sheet. As shown in FIG. 1, a circular wafer 10 is diced to divide the wafer 10 into individual chips 11. In this embodiment, the chips 11 are cut into squares. The underside of the chip 11 is attached to an adhesive sheet 12. In FIG. 1, a ring-shaped frame 13 is attached to the outer periphery of the adhesive sheet 12. In other words, the frame 13 and the adhesive sheet 12 are integrated.

Next, the chip peeling device 1 of this embodiment will be described with reference to Figures 2 and 3.

As shown in FIG. 3, the chip peeling device 1 includes a collet 15 as a holding mechanism, a base stage 16 as a first stage, a movable stage 17 as a second stage, a negative pressure generating mechanism 18, a moving mechanism 29, etc.

The collet 15 has a head 19 that adsorbs the chip 11. The head 19 has an adsorption hole on its lower end surface 19a. The head 19 is able to adsorb the chip 11 placed below through this adsorption hole and hold the chip 11. The head 19 can also release the chip 11 by releasing this adsorption action. The collet 15 is connected to, for example, a robot arm, and can move up and down and left and right in FIG. 3, as well as in a direction perpendicular to the paper surface.

The base stage 16 has a recess 16a. The movable stage 17 is placed in this recess 16a. The base stage 16 also has a negative pressure passage 16b in the recess 16a.

The movable stage 17 is a rectangular flat plate. However, the shape of the movable stage 17 is not limited to this, and for example, the surface on the adhesive sheet 12 side (the upper surface in FIG. 3) may have an uneven shape or a curved portion. The movable stage 17 is fitted into the recess 16a so that it can move back and forth (slide) horizontally (left and right in FIG. 3) within the recess 16a. The movable stage 17 moves horizontally by transmitting a driving force from the moving mechanism 29. As the moving mechanism 29, an appropriate mechanism such as a bolt and nut or cylinder mechanism can be used. The chip 11 to be peeled off from the adhesive sheet 12 is placed on the upper part of the movable stage 17.

A space A is formed above the recess 16a, surrounded by the base stage 16, the side of the movable stage 17 (the side including the short side 17c in FIG. 2), and the underside of the adhesive sheet 12. The negative pressure generating mechanism 18 generates negative pressure in the space A by sucking air from the space A through the negative pressure passage 16b. The outer peripheral end 23c of the chip 11 on the movable stage 17 is positioned above the space A (at a position corresponding to the space A).

As shown in FIG. 2, the width dimension W of the movable stage 17 is set smaller than the length W1 of one side of the chip 11. Therefore, mainly the outer peripheral ends 23a to 23c of the chip 11 protrude from the movable stage 17. One long side 17a of the movable stage 17 corresponds to the first outer peripheral end 23a of the chip 11 to be peeled off, and the other long side 17b corresponds to the second outer peripheral end 23b of the chip 11 (the first outer peripheral end 23a of the chip 11). In addition, the short side 17c on the tip side of the movable stage 17 corresponds to the third outer peripheral end 23c of the chip 11 (the side perpendicular to the first outer peripheral end 23a and the second outer peripheral end 23b).

The movable stage 17 has sides 17a to 17c arranged parallel to the first outer periphery 23a to third outer periphery 23c of the chip 11, respectively. The movable stage 17 moves horizontally in the left-right direction in FIG. 1. However, the chip peeling device 1 can also be attached to the wafer from a direction rotated 90 degrees from FIG. 2 (a direction rotated 90 degrees along the paper surface of FIG. 2). In this case, the horizontal movement direction of the movable stage 17 is the up-down direction in FIG. 1.

Negative pressure passages 16b1, 16b2, and 16b3 are provided in the recess 16a in correspondence with the first outer peripheral end 23a, the second outer peripheral end 23b, and the third outer peripheral end 23c (FIG. 2 shows an example in which each negative pressure passage is provided in correspondence with the middle of each outer peripheral end, but this is not limited thereto). When viewed from the direction shown in FIG. 2, each negative pressure passage 16b1 to 16b3 partially protrudes from the tip 11.

Next, a chip peeling method using the chip peeling device 1 of this embodiment will be described. In the following description, the chip 11 to be peeled off from the adhesive sheet 12 will be referred to as chip 11A, and the chip adjacent to chip 11A will be referred to as chip 11B.

First, as shown in FIG. 3, the movable stage 17 supports the chip 11A via the adhesive sheet 12. At this time, the first outer circumferential ends 23a to 23c of the chip 11A protrude from the movable stage 17 (see FIG. 2). In this state, as shown in FIG. 4, the negative pressure generating mechanism 18 generates negative pressure in the space A via the negative pressure passage 16b. As a result, the adhesive sheet 12 and the chip 11A at the top of the space A are sucked toward the space A. In this embodiment, the heights of the base stage 16 and the movable stage 17 are set to be approximately the same. Therefore, since there is no step in the adhesive sheet 12 on the base stage 16 side and the movable stage 17 side, the deformation of the adhesive sheet 12 due to the above suction is gentle, and the outer circumferential end 23c of the chip 11A has not peeled off from the adhesive sheet 12 at this point. In other words, the initial space A is set to have a wide width (width in the left-right direction in FIG. 4) so that the adhesive sheet 12 is deformed to a degree that does not cause peeling.

Then, as shown in FIG. 5, the movable stage 17 is moved (slid) horizontally relative to the base stage 16 in the direction of the arrow B1. This sliding gradually narrows the space A, and the adhesive sheet 12 on the space A is sandwiched between the movable stage 17 and the base stage 16 (more specifically, the high part 16c of the base stage 16), and the downward deformation angle gradually increases. Meanwhile, during this operation, the chip 11A on the adhesive sheet 12 is adsorbed upward in FIG. 5 by the head 19 (see FIG. 3). Therefore, when the deformation angle of the adhesive sheet 12 reaches a predetermined size, the outer peripheral end 23c of the chip 11A is peeled off from the adhesive sheet 12 as shown in FIG. 6 (hereinafter, this peeling is called initial peeling). The deformation angle of the adhesive sheet 12 is the angle of the part of the adhesive sheet 12 corresponding to the space A with respect to the other parts, and is the angle with respect to the horizontal line in the left-right direction in FIG. 6.

In this embodiment, the adhesive sheet 12 is first deformed by suction using the negative pressure generating mechanism 18 to an extent that the chip 11 does not peel off, and then the above-mentioned sliding can gradually increase the deformation angle of the adhesive sheet 12 to an angle at which the outer peripheral end of the chip 11 peels off. Therefore, compared to a configuration in which the adhesive sheet is deformed all at once by suctioning the space to an angle at which the chip peels off, as in FIG. 13 of Patent Document 1, the pressure applied to the outer peripheral end of the chip 11 can be reduced. Therefore, cracking of the chip 11 can be prevented. This peeling method of the present embodiment is particularly suitable for peeling off chips whose outer peripheral end has poor strength, such as chipping or microcracks on the outer peripheral end side.

In addition, the amount and speed of movement of the movable stage 17 can be changed as desired. In other words, the deformation angle and speed of the adhesive sheet 12 can be freely controlled. Therefore, the pressure applied to the chip 11 can be easily controlled.

In this embodiment, the height of the movable stage 17 and the high part 16c of the base stage 16 are set to be approximately the same. This suppresses the deformation of the adhesive sheet 12 during the initial suction operation of the adhesive sheet 12 (see FIG. 4), and reduces the pressure initially applied to the chip 11A. In addition, during a series of peeling operations of the chip 11A, pressure can be suppressed from being applied to the outer periphery of the adjacent chip 11B. In other words, in a configuration in which there is a step between the base stage and the movable stage as in FIG. 13 of Patent Document 1, the step may cause the adhesive sheet to deform more significantly, and the pressure of deformation may be applied to the adjacent chip. In contrast, in this embodiment, the deformation portion of the adhesive sheet 12 can be limited to a position corresponding to the space portion A, so that pressure can be suppressed from being applied to the outer periphery of the adjacent chip 11B. In particular, as in this embodiment, by not placing chip 11B at the top of space A, in other words by placing the outer peripheral edge of chip 11B on the space A side (left side in Figure 6, etc.) on the elevated portion 16c of base stage 16, pressure can be effectively prevented from being applied to chip 11B.

After the initial peeling, as shown in FIG. 7, the movable stage 17 is slid in the direction of arrow B2 (away from the chip 11A) relative to the base stage 16. This sliding causes the space A to expand to the left in FIG. 7, reducing the range of the chip 11A supporting the movable stage 17, and expanding the range of the adhesive sheet 12 sucked by the negative pressure generating mechanism 18 through the negative pressure passage 16b. As a result, the chip 11A is peeled off from the adhesive sheet 12 sequentially from the right side in FIG. 7. Then, when the movable stage 17 is completely removed from the chip 11A by the above horizontal movement, the chip 11A is completely peeled off from the adhesive sheet 12. This completes the peeling operation of the chip 11A from the adhesive sheet 12. The peeled chip 11A is carried to a predetermined location by the head 19 (see FIG. 3).

After the chip 11 is peeled off from the adhesive sheet 12 in this manner, the chip 11 is bonded to a predetermined position on a substrate (not shown) such as a lead frame to manufacture a semiconductor device. Here, the term "semiconductor device" refers to any device that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices. The semiconductor device may be in a wafer state on which a circuit is formed, an individual semiconductor chip cut from a wafer, a wafer divided into several pieces, a packaged wafer state, a packaged wafer state divided into several pieces, or a packaged wafer state cut into individual semiconductor elements.

Next, we will explain different embodiments of the peeling device.

As shown in FIG. 8, the chip peeling device 1 of this embodiment includes a base stage 30 as a first stage, a block section 40 consisting of a first block 31 (second stage 31), a second block 32, a third block 33, and a fourth block 34, a push-out block 39 as a moving mechanism, a holding mechanism 15, etc.

The base stage 30 has multiple suction holes on its upper surface. A space A is provided between the base stage 30 and the block portion 40. The chip peeling device 1 can suck the adhesive sheet 12 through the suction holes and space A of the base stage 30 by using a negative pressure generating mechanism.

The first block 31 has a tapered surface 31a on the side facing the second block 32. The tapered surface 31a is an inclined surface that slopes from top to bottom in a direction away from the second block 32 (towards the outer circumferential end of the chip 11A).

The push-out block 39 is driven by a lifting mechanism (not shown) and can move up and down in the figure. When the push-out block 39 moves upward in the figure, the first block 31 is pressed against the tapered surface 31a and pushed in a direction away from the second block 32 (see FIG. 10). At this time, the push-out block 39 comes into contact with the tapered surface 31a, and as the push-out block 39 moves upward, the first block 31 is gradually pushed outward.

The second block 32 and the third block 33, which serve as contact and separation stages, can be moved in the up and down directions in FIG. 8 (directions in which they contact and separate from the adhesive sheet 12 on the block portion 40) by a lifting mechanism (not shown).

The adhesive sheet 12 is placed on the base stage 30 and the block portion 40. The top surfaces of the base stage 30 and the block portion 40 are set at approximately the same height, allowing the adhesive sheet 12 to be received on a flat surface. The chip 11 to be peeled off from the adhesive sheet 12 is placed at a position corresponding to the block portion 40, with its outer peripheral end side extending outward beyond the first block 31 and placed above the space portion A (at a position corresponding to the space portion A).

Next, we will explain the chip peeling method using the chip peeling device 1 of this embodiment.

First, as shown in FIG. 9, with the adhesive sheet 12 placed on the base stage 30 and the block portion 40, the negative pressure generating mechanism generates negative pressure in the space A (see the arrow in the space A in FIG. 9). This causes the portion of the adhesive sheet 12 that corresponds to the space A to be sucked in, causing it to deform gently downward. In addition, the outer peripheral end side of the chip 11A deforms toward the adhesive sheet 12, following the adhesive sheet 12.

Then, the push-out block 39 rises and contacts the tapered surface 31a of the first block 31, pushing the first block 31 in the direction of the arrow D1. In other words, as the push-out block 39 moves upward, the first block 31 gradually moves in the direction of the arrow D1, narrowing the space A. As a result, the portion of the adhesive sheet 12 above the space A is sandwiched between the base stage 30 and the first block 31, and the deformation angle increases. Then, when the deformation angle of the adhesive sheet 12 reaches a predetermined value or greater, the outer peripheral edge of the chip 11 peels off from the adhesive sheet 12 as shown in FIG. 10 (hereinafter, this peeling is referred to as initial peeling).

As described above, in this embodiment, the deformation angle of the adhesive sheet 12 can be gradually increased as the first block 31 moves in the direction of the arrow D1, causing initial peeling. Therefore, the pressure applied to the outer peripheral edge of the chip 11 can be reduced, and cracking of the chip 11 can be prevented. Furthermore, by controlling the rising speed of the push-out block 39, the movement speed of the first block 31 in the direction of the arrow D1 can be changed as desired, and the deformation angle and deformation speed of the adhesive sheet 12 can be freely controlled. Therefore, the pressure applied to the chip 11 can be easily controlled.

After the initial peeling, the first block 31 is moved toward the inside of the chip 11 to expand the peeling range. Specifically, first, the push-out block 39 is retracted from the first block 31, and the first block 31 is returned to a position adjacent to the second block 32 (the position in FIG. 8). The first block 31 is biased toward the fourth block 34 by, for example, a spring mechanism (not shown), and automatically returns to its original position as the push-out block 39 descends.

Then, as shown in FIG. 11, the second block 32 is lowered, and the first block 31 moves further inward (in the direction of the arrow D2). This reduces the range of the chip 11 received by the block portion 40, and the range of the chip 11 placed on the space portion A is expanded, and the peeling range of the chip 11 is expanded. Then, the third block 33 is lowered in the same manner as the second block 32, and the first block is moved in the direction of the arrow D2 by that amount, and the peeling range of the chip 11 is expanded. As described above, the one or more contact/separation stages are sequentially separated from the adhesive sheet 12 starting from the contact/separation stage on the space portion A side (outside the chip 11 to be peeled) and the first block 31 is moved inward of the chip 11, whereby the chip 11 can be peeled off from the adhesive sheet 12.

The peeling device 1 of this embodiment has the advantage that the above-mentioned initial peeling operation can be performed on multiple sides (e.g., all four sides) on the outer periphery of the chip 11. For example, as shown in the cross-sectional view from above in FIG. 12, the first blocks 31 are placed at positions corresponding to the four corners of the chip 11, and each first block 31 is moved in the diagonal direction of the arrow D1 in FIG. 12, thereby narrowing the space A as described above and causing initial peeling of the chip 11. In addition, the first block 31 moves in the direction of the arrow D2 as each block described above descends, expanding the peeling range of the chip 11. However, a first block that moves in the vertical or horizontal direction in the figure may be provided between each first block 31.

The above describes an embodiment of the present invention, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

In the above explanation, we have shown a case where there is no step between the first stage and the second stage, but this is not necessarily limited to this, and there may be a step between the two.

REFERENCE SIGNS LIST 1 Chip peeling device 10 Wafer 11 Chip 12 Adhesive sheet 15 Collet (holding mechanism)
16 Base Stage (First Stage)
16a: recess; 16b: negative pressure passage; 17: movable stage (second stage);
18 negative pressure generating mechanism 29 moving mechanism 30 base stage (first stage)
31 1st Block (2nd Stage)
32 Second block (contact stage)
33 3rd block (contact stage)
39 Push-out block (moving mechanism)
40 Block section A Space section

Claims (5)

A chip peeling method for peeling a chip from an adhesive sheet having a chip attached to an upper surface thereof, comprising the steps of:
The adhesive sheet to which the chip is attached is arranged so that the outer peripheral end side of the chip to be peeled is located at a position corresponding to the space between the first stage and the second stage, and then
A chip peeling method characterized by creating negative pressure in the space and sucking the adhesive sheet, and moving at least one of the first stage and the second stage in a direction that narrows the space, thereby peeling the outer peripheral end side of the chip from the adhesive sheet. the first stage includes a negative pressure passage at a position corresponding to the space for creating a negative pressure in the space,
The second stage is slidable relative to the first stage in a direction to widen and a direction to narrow the space,
The chip to be peeled is placed at a position corresponding to the second stage;
The chip peeling method according to claim 1 , further comprising the steps of: peeling off the outer peripheral end side of the chip; sliding the second stage relative to the first stage in a direction that widens the space, thereby further peeling the chip from the adhesive sheet. The chip to be peeled is placed at a position corresponding to the second stage and one or more contact/separation stages;
the contact/separation stage is movable in a direction in which the contact/separation stage contacts or separates from the adhesive sheet,
the second stage is disposed between the approaching and separating stage and the first stage, and is horizontally movable in a direction approaching the first stage to narrow the space, and in a direction moving away from the first stage to widen the space;
2. The chip peeling method according to claim 1, further comprising the steps of: peeling off the outer peripheral end side of the chip; sequentially moving the contact/separation stage arranged outside the chip in a direction away from the adhesive sheet; and moving the second stage horizontally in a direction in which the space portion widens, thereby further peeling the chip from the adhesive sheet. A method for manufacturing a semiconductor device, comprising the steps of: manufacturing a semiconductor device using the chip peeling method according to any one of claims 1 to 3; A chip peeling device that peels off a chip from an adhesive sheet having a chip attached to an upper surface thereof, comprising:
a first stage and a second stage on which the adhesive sheet is arranged so that the outer peripheral end side of the chip to be peeled is located in a space between the stages;
a negative pressure generating mechanism that generates a negative pressure in the space to suck the adhesive sheet;
a moving mechanism that moves at least one of the first stage and the second stage in a direction narrowing the space while negative pressure is generated in the space by the negative pressure generating mechanism, thereby peeling off the outer peripheral end side of the chip from the adhesive sheet.

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