JP2022120398A - Chip peeling method, manufacturing method for semiconductor device, and chip peeling device - Google Patents

Abstract

To prevent cracking on an outer circumferential side of a chip in an initial peeling process where the outer circumferential side of the chip is to be peeled off from an adhesive sheet.SOLUTION: A chip peeling method is for peeling a chip 11 from an adhesive sheet 12 to which a chip 11 is attached on a top surface. After arranging the adhesive sheet 12 to which the chip 11 is attached so that an outer circumferential side of the chip 11 to be peeled is arranged in a location corresponding to a space portion A between a base stage 16 and a movable stage 17, by moving at least one of the base stage 16 and the movable stage 17 in a direction to narrow the space portion A in a state where the space portion A is set to a negative pressure so that the adhesive sheet 12 is suctioned, the outer circumferential side of the chip 11 is peeled off from the adhesive sheet 12.SELECTED DRAWING: Figure 6

Description

The present invention relates to a chip peeling method, a semiconductor device manufacturing method, and a chip peeling apparatus.

2. Description of the Related Art In a manufacturing process of a semiconductor device, it is necessary to separate diced semiconductor chips (hereinafter also simply referred to as chips) from an adhesive sheet and pick them up. Among the chip stripping devices for stripping chips, there are a plurality of needleless devices that do not use needles for chip stripping.

For example, the chip peeling device 100 of Patent Document 1 includes a base stage 101 and a movable stage 102 as shown in FIG. An adhesive sheet 104 to which a chip 103 is attached is arranged above the base stage 101 and the movable stage 102 . A space 105 is formed between the adhesive sheet 104 and the base stage 101 on the outer peripheral side of the movable stage 102 . The base stage 101 is provided with suction holes (not shown) communicating with the space 105 . The chip 103 to be peeled protrudes to the outer peripheral side of the movable stage 102 , and the outer peripheral end of the chip 103 is arranged above the space 105 .

When separating the chip, the chip separating apparatus 100 sucks the chip 103 from the suction hole of the base stage 101 with the collet 106 sucking the chip 103 upward in the figure. As a result, the pressure in the space 105 becomes negative, the adhesive sheet 104 on the space 105 is sucked, and the outer peripheral end side of the chip 103 is peeled off from the adhesive sheet 104 (this peeling is hereinafter referred to as initial peeling).

After the initial peeling, the movable stage 102 is moved leftward in the figure. As a result, the area of the adhesive sheet 104 sucked through the suction holes increases, and finally the chip 103 can be peeled off from the adhesive sheet 104 .

Further, for example, the semiconductor manufacturing apparatus 130 disclosed in Patent Document 2 includes a first block 131, a second block 132, a third block 133, a fourth block 134, a fifth block 135, and peripheral blocks as shown in FIG. and a suction unit 136 . Each of the blocks 131 to 135 is individually movable in the vertical direction of the figure, and can push up the dicing tape 139 and chip 138 placed thereon. The first block 131 is also movable in the horizontal direction of the figure. A dicing tape 139 and a chip 138 to be peeled off are arranged on the top of the first block 131 to the fifth block 135 .

When peeling off the chips, first, as shown in FIG. In this state, the dicing tape 139 is sucked through the plurality of suction holes provided in the suction section 136 and the gaps between the blocks. Then, the chip 138 is sucked by a collet (not shown), and the first to fifth blocks 131 to 135 are raised to the set height as shown in FIG. As a result, steps are generated between the first to fifth blocks 131 to 135 and the suction portion 136, and the dicing tape 139 is deformed. When the dicing tape 139 is deformed by a certain amount, initial peeling occurs in which the outer peripheral edge side of the chip 138 is peeled off from the dicing tape 139 .

Japanese Patent No. 5214739 JP 2019-47089 A

In the method of initial peeling in Patent Document 1, the pressure-sensitive adhesive sheet is sucked through the suction holes so that the pressure-sensitive adhesive sheet is deformed enough to peel off the chips at once. Therefore, due to the deformation of the pressure-sensitive adhesive sheet, a large pressure is applied to the chip, and there is a possibility that cracks may occur on the outer peripheral edge side of the chip at the time of initial peeling. In particular, when chipping or cracking occurs on the outer peripheral edge of the chip and the strength thereof is weak, the problem of cracking is conspicuous.

In addition, in the initial peeling in Patent Document 2, since the protrusion amount of the chip 138 with respect to the first block 131 (horizontal direction protrusion amount in FIG. 14) is constant, when trying to mitigate the impact applied to the die during peeling, the initial peeling There is no choice but to slow down the rising speed of the first block 131 to the fifth block 135 at the time, and if there is chipping or cracking on the outer edge side of the chip as described above, there is a problem that the initial peeling takes a long time. rice field.

In view of the above, an object of the present invention is to prevent cracks from occurring on the outer peripheral edge side of the chip during the initial peeling of the outer peripheral edge side of the chip from the adhesive sheet.

In order to solve the above problems, the present invention provides a chip peeling method for peeling the chip from an adhesive sheet having a chip attached to the upper surface, wherein the outer peripheral edge side of the chip to be peeled is divided into a first stage and a second stage. After arranging the adhesive sheet with the chip attached thereon so as to be arranged at a position corresponding to the space between the first At least one of the stage and the second stage is moved in a direction to narrow the space, thereby peeling off the outer peripheral end side of the chip from the adhesive sheet.

According to the chip peeling method of the present invention, the space is gradually narrowed while the adhesive sheet is sucked by applying a negative pressure to the space. You can make it bigger. That is, it is possible to deform the adhesive sheet to such an extent that the chip is not peeled off during the initial suction, and then gradually increase the deformation angle of the adhesive sheet to peel off the outer peripheral edge side of the chip. Therefore, compared to the method of PTL 1 in which the adhesive sheet is deformed at once to the angle at which the chip is peeled off, the pressure applied to the chip during the peeling operation can be reduced. Therefore, it is possible to prevent cracks on the outer peripheral edge side of the chip during the peeling operation.

In the above-described chip peeling method, the first stage includes a negative pressure passage for applying a negative pressure to the space at a position corresponding to the space, and the second stage includes a , the second stage is slidable in the direction of widening and narrowing the space, and after peeling off the outer peripheral end side of the chip, the second stage is slid in the direction of widening the space with respect to the first stage. Thus, the chip can be further peeled off from the adhesive sheet.

Further, in the chip peeling method, the chip to be peeled is arranged at a position corresponding to the second stage and one or more contact/separation stages, and the contact/separation stage is movable in a direction of contacting/separating from the adhesive sheet. The second stage is arranged between the contact/separation stage and the first stage, and has a direction in which the space is narrowed in a direction toward the first stage and a direction away from the first stage. can be horizontally moved in the direction of widening the space, and after peeling off the outer peripheral end side of the chip, the contact/separation stage arranged outside the chip is sequentially moved in the direction away from the adhesive sheet. In addition, by horizontally moving the second stage in a direction in which the space portion expands, the chip can be further peeled off from the adhesive sheet.

Moreover, a semiconductor device can be manufactured by the above chip peeling method.

In order to solve the above-mentioned problems, the present invention also provides a chip peeling device for peeling the chip from an adhesive sheet having a chip attached to the upper surface thereof, wherein the outer peripheral edge side of the chip to be peeled is in the space between the stages. a first stage and a second stage on which the adhesive sheet is arranged so as to be arranged; a negative pressure generating mechanism for generating a negative pressure in the space to attract the adhesive sheet; A moving mechanism for moving at least one of the first stage and the second stage in a direction to narrow the space in a state where a negative pressure is generated in the space, thereby peeling the outer peripheral end side of the chip from the adhesive sheet. and

According to the present invention, it is possible to prevent cracks from occurring on the outer peripheral end side of the chip.

FIG. 4 is a plan view showing a chip attached to an adhesive sheet; It is a top view which shows the chip|tip peeling apparatus of this embodiment. It is a cross-sectional view showing the chip peeling device of the present embodiment. FIG. 10 is a cross-sectional view showing the process of peeling the tip by the tip peeling device, showing a state in which the outer peripheral edge of the tip is sucked. It is sectional drawing which shows the process which peels a chip|tip by the said chip|tip peeling apparatus, and is a figure which shows a mode that a movable stage is moved and a space part is narrowed. FIG. 10 is a cross-sectional view showing the process of peeling the chip by the chip peeling device, and showing the state where the chip is initially peeled. FIG. 10 is a cross-sectional view showing the process of peeling the chip by the chip peeling apparatus, showing how the peeling range of the chip is expanded after the initial peeling. It is sectional drawing which shows the chip peeling apparatus of embodiment different from the above. FIG. 9 is a cross-sectional view showing the process of stripping chips by the chip stripping device of FIG. 8 , and showing how the first block is moved to narrow the space. FIG. 9 is a cross-sectional view showing the process of peeling the chip by the chip peeling apparatus of FIG. 8, and showing the state in which the chip is initially peeled; FIG. 9 is a cross-sectional view showing the process of peeling chips by the chip peeling apparatus of FIG. 8 , and showing how the chip peeling range is expanded after the initial peeling. FIG. 9 is a plan view of the chip peeling device of FIG. 8; It is a cross-sectional view showing a conventional chip peeling device. FIG. 14 is a sectional view showing a conventional chip peeling device different from that of FIG. 13; FIG. 14 is a sectional view showing a conventional chip peeling device different from that of FIG. 13;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and redundant description thereof will be appropriately simplified or omitted.

The chip of this embodiment can be taken out as a final product by cutting out a rectangular shape from a wafer as a raw material and peeling off from the adhesive sheet. As shown in FIG. 1, a circular wafer 10 is diced to divide the wafer 10 into individual chips 11 . In this embodiment, the chips 11 are cut into squares. Chip 11 is attached to adhesive sheet 12 on its lower surface side. In FIG. 1, a ring-shaped frame 13 is attached to the outer peripheral side of the adhesive sheet 12 . That is, the frame 13 and the adhesive sheet 12 are integrated.

Next, the chip peeling device 1 of this embodiment will be described with reference to FIGS. 2 and 3. FIG.

As shown in FIG. 3, the chip peeling apparatus 1 includes a collet 15 as a holding mechanism, a base stage 16 as a first stage, a movable stage 17 as a second stage, a negative pressure generating mechanism 18, and a moving mechanism. 29 and the like.

The collet 15 has a head 19 that sucks the chip 11 . The head 19 has suction holes on its lower end surface 19a. The head 19 can hold the chip 11 by sucking the chip 11 arranged below through the suction hole. Further, the head 19 can release the chip 11 by canceling this suction operation. The collet 15 is connected to, for example, an arm of a robot, and is movable in the vertical and horizontal directions in FIG. 3 and in the direction perpendicular to the paper surface.

The base stage 16 has a concave portion 16a. A movable stage 17 is arranged in this concave portion 16a. Further, the base stage 16 has a negative pressure passage 16b in the concave portion 16a.

The movable stage 17 is a rectangular flat plate. However, the shape of the movable stage 17 is not limited to this. For example, the surface on the adhesive sheet 12 side (upper surface in FIG. 3) may be provided with an uneven shape or a curved portion. The movable stage 17 is fitted in the recess 16a so as to be reciprocally movable (slidable) in the recess 16a in the horizontal direction (left-right direction in FIG. 3). The movable stage 17 is horizontally moved by a driving force transmitted by a moving mechanism 29 . As the moving mechanism 29, an appropriate mechanism such as a bolt/nut mechanism or a cylinder mechanism can be adopted. A chip 11 to be peeled off from the adhesive sheet 12 is placed on the movable stage 17 .

A space A surrounded by the base stage 16, the side surface of the movable stage 17 (the side surface including the short side 17c in FIG. 2), and the lower surface of the adhesive sheet 12 is formed above the concave portion 16a. The negative pressure generating mechanism 18 generates negative pressure in the space A by sucking the air in the space A through the negative pressure passage 16b. An outer peripheral end 23c of the chip 11 on the movable stage 17 is arranged on the space A (a position corresponding to the space A).

As shown in FIG. 2, the width dimension W of the movable stage 17 is set smaller than the length W1 of one side of the chip 11 . Therefore, the chip 11 mainly protrudes from the movable stage 17 at the outer peripheral ends 23a to 23c. One long side 17a of the movable stage 17 corresponds to the first outer peripheral edge 23a of the chip 11 to be peeled off, and the other long side 17b corresponds to the second outer peripheral edge 23b of the chip 11 (to the first outer peripheral edge 23a of the chip 11). handle. A short side 17c on the tip side of the movable stage 17 corresponds to the third outer peripheral edge 23c of the chip 11 (the side perpendicular to the first outer peripheral edge 23a and the second outer peripheral edge 23b).

The sides 17a to 17c of the movable stage 17 are arranged parallel to the first to third outer peripheral ends 23a to 23c of the chip 11, respectively. The movable stage 17 moves horizontally in the horizontal direction in FIG. However, the chip peeling device 1 can be attached to the wafer from a direction rotated by 90 degrees from FIG. 2 (a direction rotated by 90 degrees along the plane of FIG. 2). In this case, the direction of horizontal movement of the movable stage 17 is the vertical direction in FIG.

The concave portion 16a is provided with negative pressure passages 16b1, 16b2, and 16b3 corresponding to the first outer peripheral end 23a, the second outer peripheral end 23b, and the third outer peripheral end 23c (in FIG. Although each negative pressure passage is provided corresponding to the intermediate portion, it is not limited to this). A part of each of the negative pressure passages 16b1 to 16b3 protrudes from the chip 11 as viewed in the direction of FIG.

Next, a chip peeling method by the chip peeling apparatus 1 of this embodiment will be described. In the following description, the chip 11 peeled from the adhesive sheet 12 will be referred to as a chip 11A, and the chip adjacent to the chip 11A will be referred to as a chip 11B.

First, as shown in FIG. 3, the movable stage 17 supports the chip 11A with the adhesive sheet 12 interposed therebetween. At this time, the first outer peripheral ends 23a to 23c of the chip 11A protrude from the movable stage 17 (see FIG. 2). In this state, as shown in FIG. 4, the negative pressure generating mechanism 18 generates negative pressure in the space A through the negative pressure passage 16b. As a result, the adhesive sheet 12 and the chip 11A above the space portion A are sucked toward the space portion A side. In this embodiment, the heights of the base stage 16 and the movable stage 17 are set to be substantially the same. Therefore, since the adhesive sheet 12 does not have a level difference between the base stage 16 side and the movable stage 17 side, the adhesive sheet 12 is gently deformed by the suction, and the outer peripheral edge 23c of the chip 11A is at the adhesive sheet 12 at this time. not peeled off. In other words, the width of the initial space A (the width in the left-right direction in FIG. 4) is widened so that the pressure-sensitive adhesive sheet 12 is deformed to the extent that it does not peel off.

Then, as shown in FIG. 5, the movable stage 17 is horizontally moved (slid) with respect to the base stage 16 in the arrow B1 direction. This sliding gradually narrows the space A, and the adhesive sheet 12 in the space A is sandwiched between the movable stage 17 and the base stage 16 (more specifically, the high portion 16c of the base stage 16). It takes shape, and the downward deformation angle gradually increases. On the other hand, during this operation, the chip 11A on the adhesive sheet 12 is sucked upward in FIG. 5 by the head 19 (see FIG. 3). Therefore, when the deformation angle of the adhesive sheet 12 reaches a predetermined value, the outer peripheral edge 23c of the chip 11A is peeled off from the adhesive sheet 12 as shown in FIG. 6 (this peeling is hereinafter referred to as initial peeling). The deformation angle of the adhesive sheet 12 is the angle of the portion corresponding to the space A of the adhesive sheet 12 with respect to other portions, and is the angle with respect to the horizontal line in the left-right direction in FIG.

As described above, in this embodiment, first, the pressure-sensitive adhesive sheet 12 is deformed to such an extent that the chip 11 is not peeled off by the suction by the negative pressure generating mechanism 18, and then the outer peripheral edge of the chip 11 is peeled off by sliding. , the deformation angle of the adhesive sheet 12 can be gradually increased. Therefore, the pressure applied to the outer peripheral end of the chip 11 can be reduced compared to the configuration in which the pressure-sensitive adhesive sheet is suddenly deformed to the angle at which the chip is peeled off by suction in the space, as shown in FIG. 13 of Patent Document 1. Therefore, cracking of the tip 11 can be prevented. Such a peeling method according to the present embodiment is particularly suitable for peeling a chip whose outer peripheral end side is inferior in strength such as chipping or microcracks on the outer peripheral end side.

Further, the moving amount and moving speed of the movable stage 17 can be changed arbitrarily. That is, the deformation angle and the deformation speed of the adhesive sheet 12 can be freely controlled. Therefore, the pressure applied to the tip 11 can be easily controlled.

Further, in this embodiment, the heights of the movable stage 17 and the high portion 16c of the base stage 16 are set to be substantially the same. As a result, the deformation of the adhesive sheet 12 during the initial suction operation of the adhesive sheet 12 (see FIG. 4) can be suppressed, and the pressure initially applied to the chip 11A can be reduced. In addition, it is possible to prevent pressure from being applied to the outer peripheral end side of the adjacent chip 11B during a series of peeling operations of the chip 11A. In other words, in a configuration where there is a step between the base stage and the movable stage as shown in FIG. 13 of Patent Document 1, the step may cause the adhesive sheet to be deformed more greatly, and the adjacent chips may be subjected to deformation pressure. There is On the other hand, in this embodiment, since the deformed portion of the adhesive sheet 12 can be limited to the position corresponding to the space A, it is possible to suppress the pressure from being applied to the outer peripheral end side of the adjacent chip 11B. In particular, unlike the present embodiment, the chip 11B is not placed above the space A. In other words, the outer peripheral end of the chip 11B on the side of the space A (left side in FIG. By arranging the chip 11B upward, it is possible to effectively suppress the application of pressure to the chip 11B.

After the initial peeling, as shown in FIG. 7, the movable stage 17 is slid with respect to the base stage 16 in the arrow B2 direction (the direction away from the chip 11A). Due to this sliding, the space A expands leftward in FIG. 7, the range of the chip 11A supporting the movable stage 17 decreases, and the negative pressure generating mechanism 18 sucks through the negative pressure passage 16b. The range of the adhesive sheet 12 to be applied is expanded. As a result, the chips 11A are peeled off from the adhesive sheet 12 sequentially from the right side of FIG. When the movable stage 17 is completely removed from the chip 11A by the above horizontal movement, the chip 11A is completely separated from the adhesive sheet 12. FIG. Thus, the peeling operation of the chip 11A from the adhesive sheet 12 is completed. The peeled chip 11A is carried to a predetermined location by a head 19 (see FIG. 3).

After peeling the chip 11 from the adhesive sheet 12 in this way, the semiconductor device is manufactured by bonding the chip 11 to a predetermined position of a substrate (not shown) such as a lead frame. Here, the term "semiconductor device" refers to all devices that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices. Semiconductor devices are packaged in the form of wafers, whether they are in the form of wafers on which circuits are formed, individual semiconductor chips cut out from the wafers, or parts obtained by dividing the wafer into a plurality of parts. It does not matter whether it is a single semiconductor device, a semiconductor device that is packaged in a wafer state and divided into a plurality of devices, or a device that is packaged in a wafer state and cut into individual semiconductor devices.

Next, peeling devices according to different embodiments will be described.

As shown in FIG. 8, the chip peeling apparatus 1 of this embodiment includes a base stage 30 as a first stage, a first block 31 (second stage 31), a second block 32, a third block 33, and A block part 40 composed of the fourth block 34, a pushing block 39 as a moving mechanism, a holding mechanism 15, and the like are provided.

The base stage 30 has a plurality of suction holes on its upper surface. A space portion A is provided between the base stage 30 and the block portion 40 . The chip peeling device 1 can suck the adhesive sheet 12 through the suction holes and the space A of the base stage 30 by the negative pressure generating mechanism.

The first block 31 has a tapered surface 31a on the second block 32 side. The tapered surface 31a is an inclined surface that slopes downward in a direction away from the second block 32 (in the direction toward the outer peripheral edge of the chip 11A).

The push-out block 39 is driven by an elevation mechanism (not shown) to move vertically in the figure. As the pushing block 39 moves upward in the figure, the tapered surface 31a of the first block 31 is pressed and pushed away from the second block 32 (see FIG. 10). At this time, the push-out block 39 abuts against the tapered surface 31a, so that the first block 31 is gradually pushed out as the push-out block 39 moves upward.

The second block 32 and the third block 33 as contact/separation stages are movable in the vertical direction in FIG. 8 (the direction to contact/separate from the adhesive sheet 12 on the block section 40) by a lifting mechanism (not shown). .

An adhesive sheet 12 is arranged on the base stage 30 and the block portion 40 . The upper surfaces of the base stage 30 and the block part 40 are set to have substantially the same height, so that the adhesive sheet 12 can be received on a flat surface. Further, the chip 11 to be peeled off from the adhesive sheet 12 is arranged at a position corresponding to the block portion 40, and the outer peripheral end side of the chip 11 protrudes outside the first block 31 and is above the space portion A (corresponding to the space portion A). position).

Next, a chip peeling method by the chip peeling apparatus 1 of this embodiment will be described.

First, as shown in FIG. 9, with the adhesive sheet 12 placed on the base stage 30 and the block portion 40, the negative pressure generating mechanism generates negative pressure in the space A (see FIG. 9 for the space A). arrow). As a result, the portion of the adhesive sheet 12 corresponding to the space A is sucked and gently deformed downward. In addition, following the adhesive sheet 12, the outer peripheral end side of the chip 11A is deformed toward the adhesive sheet 12 side.

After that, the push-out block 39 rises and comes into contact with the tapered surface 31a of the first block 31, pushing out the first block 31 in the direction of the arrow D1. In other words, as the pushing block 39 moves upward, the first block 31 gradually moves in the direction of the arrow D1, narrowing the space A. As shown in FIG. As a result, the portion of the adhesive sheet 12 above the space A is sandwiched between the base stage 30 and the first block 31, and the deformation angle increases. Then, when the deformation angle of the adhesive sheet 12 reaches or exceeds a predetermined value, the outer peripheral edge of the chip 11 is peeled off from the adhesive sheet 12 as shown in FIG. 10 (this peeling is hereinafter referred to as initial peeling).

As described above, in the present embodiment as well, the deformation angle of the adhesive sheet 12 can be gradually increased as the first block 31 moves in the direction of the arrow D1, thereby causing the initial peeling. Therefore, the pressure applied to the outer peripheral edge of the tip 11 can be reduced, and cracking of the tip 11 can be prevented. Also, by controlling the rising speed of the pushing block 39, the moving speed of the first block 31 in the direction of the arrow D1 can be arbitrarily changed, and the deformation angle and the deformation speed of the adhesive sheet 12 can be freely controlled. Therefore, the pressure applied to the tip 11 can be easily controlled.

After the initial peeling, the first block 31 is moved inside the chip 11 to expand the peeling range. Specifically, first, the push-out block 39 is retracted from the first block 31, and the first block 31 is returned to a position adjacent to the second block 32 (position shown in FIG. 8). The first block 31 is biased toward the fourth block 34 by, for example, a spring mechanism (not shown), and automatically returns to its original position as the pushing block 39 descends.

After that, as shown in FIG. 11, by lowering the second block 32, the first block 31 moves further inward (arrow D2 direction). As a result, the range of the chip 11 received by the block portion 40 is reduced, the range of the chip 11 arranged on the space portion A is expanded, and the peeling range of the chip 11 is expanded. After that, the third block 33 is further lowered in the same manner as the second block 32, and the first block is moved in the direction of the arrow D2 by that amount to expand the chip 11 peeling range. As described above, the first block 31 is separated from the adhesive sheet 12 sequentially from the contact/separation stage on the side of the space A (outside of the chip 11 to be peeled) among the one or a plurality of contact/separation stages, and the first block 31 is moved from the chip 11 . By moving inward, the chip 11 can be peeled off from the adhesive sheet 12 .

The peeling apparatus 1 of the present embodiment has the advantage that the above initial peeling operation can be performed on a plurality of sides (for example, all four sides) of the chip 11 on the outer peripheral side. For example, as shown in a cross-sectional view from above in FIG. 12, the first blocks 31 are arranged at positions corresponding to the four corners of the chip 11, and the respective first blocks 31 are arranged in the direction indicated by arrows D1 in FIG. By moving in the direction, it is possible to narrow the space A as described above and cause the chip 11 to be initially delaminated. In addition, the first block 31 moves in the direction of the arrow D2 along with the descent of each block described above, thereby expanding the peeling range of the chip 11 . However, a first block that moves vertically or horizontally in the figure may be further provided between the first blocks 31 .

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

In the above description, the case where there is no step between the first stage and the second stage has been shown, but the present invention is not necessarily limited to this, and there may be a step between the two.

REFERENCE SIGNS LIST 1 chip peeling device 10 wafer 11 chip 12 adhesive sheet 15 collet (holding mechanism)
16 base stage (first stage)
16a concave portion 16b negative pressure passage 17 movable stage (second stage)
18 negative pressure generating mechanism 29 moving mechanism 30 base stage (first stage)
31 Block 1 (Second Stage)
32 Block 2 (contact and separation stage)
33 Block 3 (contact and separation stage)
39 pushing block (moving mechanism)
40 block part A space part

Claims (5)

A chip peeling method for peeling a chip from an adhesive sheet having a chip attached to the top surface, comprising:
After arranging the adhesive sheet to which the chip is attached so that the outer peripheral edge side of the chip to be peeled off is arranged at a position corresponding to the space between the first stage and the second stage,
At least one of the first stage and the second stage is moved in a direction in which the space is narrowed in a state in which the pressure in the space is negative and the adhesive sheet is sucked. from the adhesive sheet. The first stage includes a negative pressure passage for applying a negative pressure to the space at a position corresponding to the space,
The second stage is slidable with respect to the first stage in a direction to widen and narrow the space,
The chip to be peeled is arranged at a position corresponding to the second stage,
2. The chip is further peeled from the adhesive sheet by sliding the second stage with respect to the first stage in a direction in which the space is widened after the outer peripheral edge side of the chip is peeled off. The described chip stripping method. the chip to be peeled is arranged at a position corresponding to the second stage and one or more contact/separation stages;
The contact/separation stage is movable in a direction contacting/separating from the adhesive sheet,
The second stage is disposed between the contact/separation stage and the first stage, and is configured to narrow the space in a direction approaching the first stage and to move away from the first stage. It can move horizontally in the direction of expanding the space,
After peeling off the outer peripheral edge of the chip, the contact/separation stage arranged outside the chip is sequentially moved in the direction away from the adhesive sheet, and the second stage is moved in the direction in which the space expands. 2. The chip peeling method according to claim 1, wherein said chip is further peeled from said adhesive sheet by moving horizontally to. 4. A method of manufacturing a semiconductor device using the chip separation method according to any one of claims 1 to 3. A chip peeling device for peeling a chip from an adhesive sheet having a chip attached to the top surface thereof,
a first stage and a second stage on which the adhesive sheet is arranged so that the outer peripheral edge side of the chip to be peeled is arranged in the space between the stages;
a negative pressure generating mechanism for generating negative pressure in the space to attract the adhesive sheet;
With the negative pressure generating mechanism generating a negative pressure in the space, at least one of the first stage and the second stage is moved in a direction to narrow the space, and the outer peripheral end side of the chip is moved to the above-mentioned position. and a moving mechanism for separating the chip from the adhesive sheet.

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