TWM533308U - CMP system and retaining ring for lower wafer defects - Google Patents

CMP system and retaining ring for lower wafer defects

Info

Publication number
TWM533308U
TWM533308U TW105203828U TW105203828U TWM533308U TW M533308 U TWM533308 U TW M533308U TW 105203828 U TW105203828 U TW 105203828U TW 105203828 U TW105203828 U TW 105203828U TW M533308 U TWM533308 U TW M533308U
Authority
TW
Taiwan
Prior art keywords
retaining ring
lower wafer
cmp system
wafer defects
inner diameter
Prior art date
Application number
TW105203828U
Other languages
English (en)
Inventor
Yongqi Hu
Simon Yavelberg
Gangadhar Sheelavant
Kadthala R Narendrnath
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TWM533308U publication Critical patent/TWM533308U/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW105203828U 2015-03-19 2016-03-18 CMP system and retaining ring for lower wafer defects TWM533308U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562135677P 2015-03-19 2015-03-19

Publications (1)

Publication Number Publication Date
TWM533308U true TWM533308U (en) 2016-12-01

Family

ID=56924291

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105203828U TWM533308U (en) 2015-03-19 2016-03-18 CMP system and retaining ring for lower wafer defects
TW105108502A TWI693985B (zh) 2015-03-19 2016-03-18 用於減少晶圓缺陷的保持環

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105108502A TWI693985B (zh) 2015-03-19 2016-03-18 用於減少晶圓缺陷的保持環

Country Status (6)

Country Link
US (1) US10399202B2 (zh)
JP (1) JP6352326B2 (zh)
KR (1) KR101841580B1 (zh)
CN (2) CN105983901B (zh)
SG (1) SG10201601379WA (zh)
TW (2) TWM533308U (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
SG10201601379WA (en) * 2015-03-19 2016-10-28 Applied Materials Inc Retaining ring for lower wafer defects
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
CN109420969B (zh) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
CN109693174A (zh) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
CN107953242A (zh) * 2017-12-22 2018-04-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光修整装置及抛光系统
KR102702996B1 (ko) * 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
TWI840511B (zh) * 2019-02-28 2024-05-01 美商應用材料股份有限公司 用於化學機械研磨承載頭的固定器
CN112548846B (zh) * 2019-09-25 2022-10-28 夏泰鑫半导体(青岛)有限公司 用于化学机械研磨之固定环
CN118163032A (zh) * 2019-09-30 2024-06-11 清华大学 一种化学机械抛光保持环和化学机械抛光承载头
CN111318959B (zh) * 2020-04-16 2024-02-06 清华大学 一种用于化学机械抛光的保持环和承载头
CN111482893A (zh) * 2020-04-16 2020-08-04 华海清科股份有限公司 一种化学机械抛光保持环和化学机械抛光承载头
CN111531464B (zh) * 2020-05-08 2022-04-08 西安奕斯伟材料科技有限公司 研磨头及研磨设备
JP7099614B1 (ja) 2021-11-25 2022-07-12 信越半導体株式会社 テンプレートアセンブリ、研磨ヘッド及びウェーハの研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
DE10208414B4 (de) * 2002-02-27 2013-01-10 Advanced Micro Devices, Inc. Vorrichtung mit einem verbesserten Polierkissenaufbereiter für das chemisch mechanische Polieren
ATE468941T1 (de) * 2003-11-13 2010-06-15 Applied Materials Inc Haltering mit geformter fläche
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US7134948B2 (en) * 2005-01-15 2006-11-14 Applied Materials, Inc. Magnetically secured retaining ring
DE112005003420T5 (de) * 2005-04-12 2008-02-07 Nippon Seimitsu Denshi Co., Ltd., Yokohama Haltering für CMP-Vorrichtung und Herstellungsverfahren dafür, und CMP-Vorrichtung
JP2007158135A (ja) * 2005-12-07 2007-06-21 Nippon Seimitsu Denshi Co Ltd Ｃｍｐ装置用リテーナリング
JP2008006526A (ja) * 2006-06-28 2008-01-17 Konica Minolta Opto Inc 研磨キャリア
JP2009034745A (ja) * 2007-07-31 2009-02-19 Nippon Seimitsu Denshi Co Ltd Ｃｍｐ装置用リテーナリング
SG10201601379WA (en) * 2015-03-19 2016-10-28 Applied Materials Inc Retaining ring for lower wafer defects

Also Published As

Publication number Publication date
SG10201601379WA (en) 2016-10-28
JP2016178304A (ja) 2016-10-06
US10399202B2 (en) 2019-09-03
CN105983901A (zh) 2016-10-05
JP6352326B2 (ja) 2018-07-04
KR101841580B1 (ko) 2018-03-23
TW201702001A (zh) 2017-01-16
CN205734411U (zh) 2016-11-30
KR20160113017A (ko) 2016-09-28
US20160271750A1 (en) 2016-09-22
CN105983901B (zh) 2021-01-29
TWI693985B (zh) 2020-05-21

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