TWI799486B - 化學機械拋光液 - Google Patents

化學機械拋光液 Download PDF

Info

Publication number
TWI799486B
TWI799486B TW107147271A TW107147271A TWI799486B TW I799486 B TWI799486 B TW I799486B TW 107147271 A TW107147271 A TW 107147271A TW 107147271 A TW107147271 A TW 107147271A TW I799486 B TWI799486 B TW I799486B
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
polishing slurry
slurry
chemical
Prior art date
Application number
TW107147271A
Other languages
English (en)
Other versions
TW201927955A (zh
Inventor
周文婷
Original Assignee
大陸商安集微電子(上海)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商安集微電子(上海)有限公司 filed Critical 大陸商安集微電子(上海)有限公司
Publication of TW201927955A publication Critical patent/TW201927955A/zh
Application granted granted Critical
Publication of TWI799486B publication Critical patent/TWI799486B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107147271A 2017-12-27 2018-12-26 化學機械拋光液 TWI799486B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201711439535.9A CN109971356A (zh) 2017-12-27 2017-12-27 一种化学机械抛光液
??201711439535.9 2017-12-27
CN201711439535.9 2017-12-27

Publications (2)

Publication Number Publication Date
TW201927955A TW201927955A (zh) 2019-07-16
TWI799486B true TWI799486B (zh) 2023-04-21

Family

ID=67066680

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147271A TWI799486B (zh) 2017-12-27 2018-12-26 化學機械拋光液

Country Status (4)

Country Link
US (1) US11898063B2 (zh)
CN (1) CN109971356A (zh)
TW (1) TWI799486B (zh)
WO (1) WO2019129106A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118185478A (zh) * 2022-12-13 2024-06-14 安集微电子科技（上海）股份有限公司 一种轻擦抛光组合物
CN118256150A (zh) * 2022-12-28 2024-06-28 安集微电子科技（上海）股份有限公司 一种化学机械抛光液
CN118620527A (zh) * 2024-08-14 2024-09-10 齐芯微(绍兴)电子材料科技有限公司 一种化学机械抛光液及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101457125A (zh) * 2007-12-14 2009-06-17 安集微电子（上海）有限公司 一种化学机械抛光液
CN102093818A (zh) * 2009-12-11 2011-06-15 安集微电子（上海）有限公司 一种化学机械抛光浆料及其应用
WO2012030752A2 (en) * 2010-09-02 2012-03-08 Cabot Microelectronics Corporation Silicon polishing compositions with high rate and low defectivity
WO2012083115A2 (en) * 2010-12-17 2012-06-21 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
CN103131330A (zh) * 2008-02-01 2013-06-05 福吉米株式会社 研磨用组合物以及使用其的研磨方法
CN105297025A (zh) * 2014-07-23 2016-02-03 安集微电子科技(上海)有限公司 一种含氮化合物在提高钽抛光速率中的应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101463226A (zh) * 2007-12-21 2009-06-24 安集微电子（上海）有限公司 一种化学机械抛光液
US8652350B2 (en) * 2008-02-27 2014-02-18 Jsr Corporation Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion
WO2010069149A1 (zh) * 2008-12-19 2010-06-24 安集微电子（上海）有限公司 一种化学机械抛光液
CN101747843A (zh) * 2008-12-19 2010-06-23 安集微电子（上海）有限公司 一种化学机械抛光液
CN102101982A (zh) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 一种化学机械抛光液
US8492277B2 (en) 2010-03-16 2013-07-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride
US8491808B2 (en) 2010-03-16 2013-07-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
JP6096670B2 (ja) * 2010-12-10 2017-03-15 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 酸化ケイ素誘電体膜およびポリシリコン膜を含有する基板を化学的機械的に研磨するための水性研磨組成物および方法
CN103160207A (zh) * 2011-12-16 2013-06-19 安集微电子（上海）有限公司 一种金属化学机械抛光浆料及其应用
JP5943072B2 (ja) * 2012-05-22 2016-06-29 日立化成株式会社 スラリー、研磨液セット、研磨液及び基体の研磨方法
CN103450810B (zh) * 2012-05-30 2018-03-13 安集微电子（上海）有限公司 一种化学机械平坦化浆料及其应用
CN103865400A (zh) * 2012-12-10 2014-06-18 安集微电子（上海）有限公司 一种磷酸酯表面活性剂在自停止抛光中的应用
CN104449398B (zh) * 2014-11-25 2017-06-23 河北工业大学 一种适用于钴阻挡层的碱性化学机械抛光液
WO2018056122A1 (ja) * 2016-09-21 2018-03-29 日立化成株式会社 スラリ及び研磨方法
CN108117839B (zh) * 2016-11-29 2021-09-17 安集微电子科技（上海）股份有限公司 一种具有高氮化硅选择性的化学机械抛光液

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101457125A (zh) * 2007-12-14 2009-06-17 安集微电子（上海）有限公司 一种化学机械抛光液
CN103131330A (zh) * 2008-02-01 2013-06-05 福吉米株式会社 研磨用组合物以及使用其的研磨方法
CN102093818A (zh) * 2009-12-11 2011-06-15 安集微电子（上海）有限公司 一种化学机械抛光浆料及其应用
WO2012030752A2 (en) * 2010-09-02 2012-03-08 Cabot Microelectronics Corporation Silicon polishing compositions with high rate and low defectivity
WO2012083115A2 (en) * 2010-12-17 2012-06-21 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
CN105297025A (zh) * 2014-07-23 2016-02-03 安集微电子科技(上海)有限公司 一种含氮化合物在提高钽抛光速率中的应用

Also Published As

Publication number Publication date
US11898063B2 (en) 2024-02-13
CN109971356A (zh) 2019-07-05
WO2019129106A1 (zh) 2019-07-04
US20210163786A1 (en) 2021-06-03
TW201927955A (zh) 2019-07-16

Similar Documents

Publication Publication Date Title
EP3685432A4 (en) CHEMICAL-MECHANICAL POLISHING FOR HYBRID CONNECTION
GB2571687B (en) Slurry design process
EP3631045A4 (en) MECHANICAL-CHEMICAL POLISHING CONCENTRATE SUSPENSION FOR COBALT APPLICATIONS
EP3161098A4 (en) Tungsten chemical-mechanical polishing composition
EP3112436A4 (en) Polishing composition
TWI800562B (zh) 化學機械研磨組成物
IL249516A0 (en) Chemical mechanical polishing preparation
EP3216839A4 (en) Polishing composition
EP3124570A4 (en) Polishing composition
EP3099756A4 (en) A chemical mechanical polishing (cmp) composition comprising a poly(aminoacid)
EP3315577A4 (en) Polishing composition
EP3560252A4 (en) RECEPTION DIAGRAM
EP3366746A4 (en) Polishing composition
EP3296376A4 (en) Polishing composition
EP3479953A4 (en) POLISHING DEVICE
EP3604475A4 (en) POLISHING COMPOSITION
EP3775076A4 (en) CHEMICAL-MECHANICAL POLISHING SUSPENSION WITH RUTHENIUM BARRIER
EP3417997A4 (en) GRINDING DEVICE
EP3094186A4 (en) Grinder assembly
EP3366747A4 (en) Polishing composition
EP3516002A4 (en) SLURDS FOR CHEMICAL-MECHANICAL POLISHING AND METHOD FOR SHAPING THEREOF
TWI799485B (zh) 化學機械拋光液
TWI799486B (zh) 化學機械拋光液
EP3605588A4 (en) POLISHING COMPOSITION
EP3530409A4 (en) GRINDING STONE