TWM403749U - Schottky diode structure - Google Patents

Schottky diode structure Download PDF

Info

Publication number
TWM403749U
TWM403749U TW099224484U TW99224484U TWM403749U TW M403749 U TWM403749 U TW M403749U TW 099224484 U TW099224484 U TW 099224484U TW 99224484 U TW99224484 U TW 99224484U TW M403749 U TWM403749 U TW M403749U
Authority
TW
Taiwan
Prior art keywords
layer
diode structure
schottky diode
doped
high concentration
Prior art date
Application number
TW099224484U
Other languages
English (en)
Chinese (zh)
Inventor
yong-zhong Li
Zong-Ming Pan
Original Assignee
Taiwan Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Co Ltd filed Critical Taiwan Semiconductor Co Ltd
Priority to TW099224484U priority Critical patent/TWM403749U/zh
Publication of TWM403749U publication Critical patent/TWM403749U/zh
Priority to CN2011203865081U priority patent/CN202307900U/zh
Priority to DE202011107497U priority patent/DE202011107497U1/de
Priority to KR2020110010229U priority patent/KR200470297Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/872Schottky diodes
    • H01L29/8725Schottky diodes of the trench MOS barrier type [TMBS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/872Schottky diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6609Diodes
    • H01L29/66143Schottky diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
TW099224484U 2010-12-17 2010-12-17 Schottky diode structure TWM403749U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW099224484U TWM403749U (en) 2010-12-17 2010-12-17 Schottky diode structure
CN2011203865081U CN202307900U (zh) 2010-12-17 2011-10-12 肖特基二极管结构
DE202011107497U DE202011107497U1 (de) 2010-12-17 2011-11-03 Struktur einer Schottky-Diode
KR2020110010229U KR200470297Y1 (ko) 2010-12-17 2011-11-18 쇼트키 다이오드 구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099224484U TWM403749U (en) 2010-12-17 2010-12-17 Schottky diode structure

Publications (1)

Publication Number Publication Date
TWM403749U true TWM403749U (en) 2011-05-11

Family

ID=45077618

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099224484U TWM403749U (en) 2010-12-17 2010-12-17 Schottky diode structure

Country Status (4)

Country Link
KR (1) KR200470297Y1 (ko)
CN (1) CN202307900U (ko)
DE (1) DE202011107497U1 (ko)
TW (1) TWM403749U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956684A (zh) * 2011-08-25 2013-03-06 万国半导体股份有限公司 集成晶胞的掩埋场环场效应晶体管植入空穴供应通路

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM435716U (en) * 2012-04-13 2012-08-11 Taiwan Semiconductor Co Ltd The active region of the trench distributed arrangement of the semiconductor device structure
TWM439885U (en) 2012-04-13 2012-10-21 Taiwan Semiconductor Co Ltd Semiconductor component trench structure
CN103515450B (zh) * 2012-06-29 2017-02-08 朱江 一种沟槽电荷补偿肖特基半导体装置及其制造方法
CN103413836A (zh) * 2013-05-27 2013-11-27 上海恺创电子有限公司 沟槽栅肖特基势垒二极管

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5612567A (en) * 1996-05-13 1997-03-18 North Carolina State University Schottky barrier rectifiers and methods of forming same
US6303969B1 (en) 1998-05-01 2001-10-16 Allen Tan Schottky diode with dielectric trench
JP2006120979A (ja) * 2004-10-25 2006-05-11 Sanyo Electric Co Ltd 保護素子およびそれを用いた半導体装置
CN2811144Y (zh) 2005-04-25 2006-08-30 张希华 自行车直拉滚动斜楔增力盘式制动器
CN2820570Y (zh) 2005-07-22 2006-09-27 齐济 节约型墨水瓶

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956684A (zh) * 2011-08-25 2013-03-06 万国半导体股份有限公司 集成晶胞的掩埋场环场效应晶体管植入空穴供应通路
TWI466194B (zh) * 2011-08-25 2014-12-21 Alpha & Omega Semiconductor 集成晶胞的掩埋場環場效應電晶體植入空穴供應通路
CN102956684B (zh) * 2011-08-25 2015-11-18 万国半导体股份有限公司 集成晶胞的掩埋场环场效应晶体管植入空穴供应通路

Also Published As

Publication number Publication date
CN202307900U (zh) 2012-07-04
KR20120004645U (ko) 2012-06-27
DE202011107497U1 (de) 2012-02-27
KR200470297Y1 (ko) 2013-12-06

Similar Documents

Publication Publication Date Title
US10937784B2 (en) Method of manufacturing a semiconductor device
JP5550589B2 (ja) 半導体装置
JP4994261B2 (ja) 低減されたオン抵抗を有するダイオード、および関連する製造方法
US8823128B2 (en) Semiconductor structure and circuit with embedded Schottky diode
JP2008172008A (ja) SiCショットキー障壁半導体装置
TW201208039A (en) Semiconductor device
TWM403749U (en) Schottky diode structure
TWI533450B (zh) 半導體裝置與其製造方法
TWI332711B (en) Semicondutor device
JP6673439B2 (ja) 半導体装置
TW200913225A (en) Semiconductor device having electrostatic discharge protection circuit and method of manufacturing the same
JP5106604B2 (ja) 半導体装置およびその製造方法
CN105789331B (zh) 半导体整流器件及其制作方法
CN107017255A (zh) 氮化物半导体装置及其制造方法
TW201015702A (en) Electrostatic discharge projection semiconductor device and method for manufacturing the same
US8993426B2 (en) Semiconductor device with junction termination extension structure on mesa and method of fabricating the same
TW202335308A (zh) 寬能隙半導體元件與其製造方法
JPS58148469A (ja) シヨツトキダイオ−ド
JP6658560B2 (ja) 半導体装置
JP6930113B2 (ja) 半導体装置および半導体装置の製造方法
TW201421703A (zh) 具有終端結構之金氧半二極體元件及其製法
US8916935B2 (en) ESD clamp in integrated circuits
JP5552249B2 (ja) 3端子サイリスタ
TWI443805B (zh) 內嵌蕭基二極體之雙載子接面電晶體半導體結構及電路
CN205428945U (zh) 一种快恢复二极管

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model