TWI906513B - 導電性粒子、導電材料及連接構造體 - Google Patents
導電性粒子、導電材料及連接構造體Info
- Publication number
- TWI906513B TWI906513B TW111117783A TW111117783A TWI906513B TW I906513 B TWI906513 B TW I906513B TW 111117783 A TW111117783 A TW 111117783A TW 111117783 A TW111117783 A TW 111117783A TW I906513 B TWI906513 B TW I906513B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- particles
- flux
- aforementioned
- particle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021081123 | 2021-05-12 | ||
| JP2021-081123 | 2021-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202248385A TW202248385A (zh) | 2022-12-16 |
| TWI906513B true TWI906513B (zh) | 2025-12-01 |
Family
ID=84029665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111117783A TWI906513B (zh) | 2021-05-12 | 2022-05-12 | 導電性粒子、導電材料及連接構造體 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7780436B2 (https=) |
| KR (1) | KR20240006491A (https=) |
| CN (1) | CN117296109A (https=) |
| TW (1) | TWI906513B (https=) |
| WO (1) | WO2022239776A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20260016866A (ko) * | 2024-02-09 | 2026-02-04 | 엔젯 주식회사 | 용융도전볼 배열필름 및 그 제조방법 |
| KR20250124010A (ko) * | 2024-02-09 | 2025-08-19 | 엔젯 주식회사 | 미세 전기 접속 구조체 |
| WO2025225643A1 (ja) * | 2024-04-23 | 2025-10-30 | 積水化学工業株式会社 | 樹脂粒子、金属被覆粒子及び樹脂材料 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998006007A1 (en) * | 1996-08-01 | 1998-02-12 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
| JP2010069495A (ja) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | フラックス内包カプセル、フラックス内包カプセル付き導電性粒子及び接続構造体 |
| JP2013251345A (ja) * | 2012-05-30 | 2013-12-12 | Panasonic Corp | 電子部品実装構造体の製造方法および電子部品実装装置 |
| CN110125386A (zh) * | 2019-05-29 | 2019-08-16 | 深圳第三代半导体研究院 | 一种表面进行抗氧化保护的铜颗粒的形成方法、低温烧结铜膏及使用其的烧结工艺 |
| JP2020145206A (ja) * | 2015-01-16 | 2020-09-10 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011113804A (ja) * | 2009-11-26 | 2011-06-09 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| WO2012102077A1 (ja) | 2011-01-27 | 2012-08-02 | 日立化成工業株式会社 | 導電性接着剤組成物、接続体及び太陽電池モジュール |
| JP6458503B2 (ja) | 2015-01-13 | 2019-01-30 | デクセリアルズ株式会社 | 異方性導電フィルム、その製造方法及び接続構造体 |
-
2022
- 2022-05-10 KR KR1020237026386A patent/KR20240006491A/ko active Pending
- 2022-05-10 WO PCT/JP2022/019834 patent/WO2022239776A1/ja not_active Ceased
- 2022-05-10 JP JP2022538328A patent/JP7780436B2/ja active Active
- 2022-05-10 CN CN202280034394.5A patent/CN117296109A/zh active Pending
- 2022-05-12 TW TW111117783A patent/TWI906513B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998006007A1 (en) * | 1996-08-01 | 1998-02-12 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
| JP2010069495A (ja) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | フラックス内包カプセル、フラックス内包カプセル付き導電性粒子及び接続構造体 |
| JP2013251345A (ja) * | 2012-05-30 | 2013-12-12 | Panasonic Corp | 電子部品実装構造体の製造方法および電子部品実装装置 |
| JP2020145206A (ja) * | 2015-01-16 | 2020-09-10 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| CN110125386A (zh) * | 2019-05-29 | 2019-08-16 | 深圳第三代半导体研究院 | 一种表面进行抗氧化保护的铜颗粒的形成方法、低温烧结铜膏及使用其的烧结工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202248385A (zh) | 2022-12-16 |
| JP7780436B2 (ja) | 2025-12-04 |
| JPWO2022239776A1 (https=) | 2022-11-17 |
| CN117296109A (zh) | 2023-12-26 |
| WO2022239776A1 (ja) | 2022-11-17 |
| KR20240006491A (ko) | 2024-01-15 |
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