KR20240006491A - 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents
도전성 입자, 도전 재료 및 접속 구조체 Download PDFInfo
- Publication number
- KR20240006491A KR20240006491A KR1020237026386A KR20237026386A KR20240006491A KR 20240006491 A KR20240006491 A KR 20240006491A KR 1020237026386 A KR1020237026386 A KR 1020237026386A KR 20237026386 A KR20237026386 A KR 20237026386A KR 20240006491 A KR20240006491 A KR 20240006491A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- particles
- flux
- particle
- containing particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021081123 | 2021-05-12 | ||
| JPJP-P-2021-081123 | 2021-05-12 | ||
| PCT/JP2022/019834 WO2022239776A1 (ja) | 2021-05-12 | 2022-05-10 | 導電性粒子、導電材料及び接続構造体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240006491A true KR20240006491A (ko) | 2024-01-15 |
Family
ID=84029665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237026386A Pending KR20240006491A (ko) | 2021-05-12 | 2022-05-10 | 도전성 입자, 도전 재료 및 접속 구조체 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7780436B2 (https=) |
| KR (1) | KR20240006491A (https=) |
| CN (1) | CN117296109A (https=) |
| TW (1) | TWI906513B (https=) |
| WO (1) | WO2022239776A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025170381A1 (ko) * | 2024-02-09 | 2025-08-14 | 엔젯 주식회사 | 용융도전볼 배열필름 및 그 제조방법 |
| WO2025170382A1 (ko) * | 2024-02-09 | 2025-08-14 | 엔젯 주식회사 | 미세피치 전기 접속 구조체 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025225643A1 (ja) * | 2024-04-23 | 2025-10-30 | 積水化学工業株式会社 | 樹脂粒子、金属被覆粒子及び樹脂材料 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012102077A1 (ja) | 2011-01-27 | 2012-08-02 | 日立化成工業株式会社 | 導電性接着剤組成物、接続体及び太陽電池モジュール |
| WO2016114160A1 (ja) | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | 異方性導電フィルム、その製造方法及び接続構造体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR9706597A (pt) * | 1996-08-01 | 1999-07-20 | Loctite Ireland Ltd | Processo para formação de uma monocamada de partículas e produtos formados desse modo |
| JP5139932B2 (ja) * | 2008-09-17 | 2013-02-06 | 積水化学工業株式会社 | フラックス内包カプセル、フラックス内包カプセル付き導電性粒子及び接続構造体 |
| JP2011113804A (ja) * | 2009-11-26 | 2011-06-09 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| JP5828095B2 (ja) * | 2012-05-30 | 2015-12-02 | パナソニックIpマネジメント株式会社 | 電子部品実装構造体の製造方法および電子部品実装装置 |
| JP6734055B2 (ja) * | 2015-01-16 | 2020-08-05 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| CN110125386B (zh) * | 2019-05-29 | 2022-01-11 | 深圳第三代半导体研究院 | 一种表面进行抗氧化保护的铜颗粒的形成方法、低温烧结铜膏及使用其的烧结工艺 |
-
2022
- 2022-05-10 KR KR1020237026386A patent/KR20240006491A/ko active Pending
- 2022-05-10 WO PCT/JP2022/019834 patent/WO2022239776A1/ja not_active Ceased
- 2022-05-10 JP JP2022538328A patent/JP7780436B2/ja active Active
- 2022-05-10 CN CN202280034394.5A patent/CN117296109A/zh active Pending
- 2022-05-12 TW TW111117783A patent/TWI906513B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012102077A1 (ja) | 2011-01-27 | 2012-08-02 | 日立化成工業株式会社 | 導電性接着剤組成物、接続体及び太陽電池モジュール |
| WO2016114160A1 (ja) | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | 異方性導電フィルム、その製造方法及び接続構造体 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025170381A1 (ko) * | 2024-02-09 | 2025-08-14 | 엔젯 주식회사 | 용융도전볼 배열필름 및 그 제조방법 |
| WO2025170382A1 (ko) * | 2024-02-09 | 2025-08-14 | 엔젯 주식회사 | 미세피치 전기 접속 구조체 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202248385A (zh) | 2022-12-16 |
| JP7780436B2 (ja) | 2025-12-04 |
| JPWO2022239776A1 (https=) | 2022-11-17 |
| CN117296109A (zh) | 2023-12-26 |
| WO2022239776A1 (ja) | 2022-11-17 |
| TWI906513B (zh) | 2025-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20230802 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20250317 Comment text: Request for Examination of Application |