TWI902865B - 著色感光性樹脂組成物、硬化物、顯示裝置及硬化物之製造方法 - Google Patents

著色感光性樹脂組成物、硬化物、顯示裝置及硬化物之製造方法

Info

Publication number
TWI902865B
TWI902865B TW110129396A TW110129396A TWI902865B TW I902865 B TWI902865 B TW I902865B TW 110129396 A TW110129396 A TW 110129396A TW 110129396 A TW110129396 A TW 110129396A TW I902865 B TWI902865 B TW I902865B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
acid
less
dye
Prior art date
Application number
TW110129396A
Other languages
English (en)
Chinese (zh)
Other versions
TW202214745A (zh
Inventor
西岡拓紀
小森悠佑
三好一登
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202214745A publication Critical patent/TW202214745A/zh
Application granted granted Critical
Publication of TWI902865B publication Critical patent/TWI902865B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
TW110129396A 2020-08-18 2021-08-10 著色感光性樹脂組成物、硬化物、顯示裝置及硬化物之製造方法 TWI902865B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-137896 2020-08-18
JP2020137896 2020-08-18

Publications (2)

Publication Number Publication Date
TW202214745A TW202214745A (zh) 2022-04-16
TWI902865B true TWI902865B (zh) 2025-11-01

Family

ID=80322690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110129396A TWI902865B (zh) 2020-08-18 2021-08-10 著色感光性樹脂組成物、硬化物、顯示裝置及硬化物之製造方法

Country Status (5)

Country Link
JP (1) JP7750093B2 (https=)
KR (1) KR102903882B1 (https=)
CN (1) CN116034318A (https=)
TW (1) TWI902865B (https=)
WO (1) WO2022039034A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119547016A (zh) 2022-08-19 2025-02-28 东丽株式会社 正型感光性组合物、固化膜、有机el显示装置及色素
TW202412021A (zh) * 2022-09-02 2024-03-16 日商Ｊｓｒ股份有限公司 導電膜的製造方法、分散液、感放射線性樹脂組成物、發光元件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004326094A (ja) * 2003-04-07 2004-11-18 Toray Ind Inc 感光性樹脂組成物
TW201003305A (en) * 2008-01-24 2010-01-16 Sumitomo Chemical Co Colored photosensitive composition, and color filter array and solid image pickup device using the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06230215A (ja) 1993-02-05 1994-08-19 Sumitomo Chem Co Ltd ブラックマトリックス用ポジ型レジスト組成物
JP3508199B2 (ja) 1994-03-25 2004-03-22 住友化学工業株式会社 ブラックマトリックス用レジスト組成物、当該組成物により得られるブラックマトリックス
JPH10254129A (ja) 1997-03-07 1998-09-25 Toray Ind Inc 感光性黒色ペーストおよびそれを用いたブラックマトリックス基板の製造方法
JP2003119381A (ja) 2001-10-17 2003-04-23 Hitachi Cable Ltd 黒色ポリイミド組成物及びブラックマトリックス
JP4122189B2 (ja) * 2002-08-13 2008-07-23 コダックグラフィックコミュニケーションズ株式会社 ネガ型感光性組成物およびネガ型感光性平版印刷版
JP4360168B2 (ja) 2002-10-01 2009-11-11 東レ株式会社 ポジ型感光性樹脂組成物
TWI333127B (en) * 2003-04-07 2010-11-11 Toray Industries Positive-type photosensitive resin composition
JP6119282B2 (ja) * 2013-02-12 2017-04-26 大日本印刷株式会社 白色発光有機ｅｌディスプレイ用のカラーフィルタ及び着色レジスト組成物、並びに白色発光有機ｅｌディスプレイ
JP6160286B2 (ja) * 2013-06-17 2017-07-12 東洋インキＳｃホールディングス株式会社 カラーフィルタ用着色組成物及びカラーフィルタ
JP6295600B2 (ja) * 2013-10-23 2018-03-20 大日本印刷株式会社 色材、色材分散液、カラーフィルタ用着色樹脂組成物、カラーフィルタ、液晶表示装置、及び有機発光表示装置
KR102510370B1 (ko) * 2014-10-06 2023-03-17 도레이 카부시키가이샤 수지 조성물, 내열성 수지막의 제조 방법, 및 표시 장치
KR102398257B1 (ko) * 2016-08-01 2022-05-13 토요잉크Sc홀딩스주식회사 감광성 착색 조성물 및 컬러 필터
KR102548102B1 (ko) * 2017-09-25 2023-06-28 도레이 카부시키가이샤 착색 수지 조성물, 착색막, 컬러필터 및 액정 표시 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004326094A (ja) * 2003-04-07 2004-11-18 Toray Ind Inc 感光性樹脂組成物
TW201003305A (en) * 2008-01-24 2010-01-16 Sumitomo Chemical Co Colored photosensitive composition, and color filter array and solid image pickup device using the same

Also Published As

Publication number Publication date
KR20230051765A (ko) 2023-04-18
JP7750093B2 (ja) 2025-10-07
WO2022039034A1 (ja) 2022-02-24
KR102903882B1 (ko) 2025-12-26
JPWO2022039034A1 (https=) 2022-02-24
CN116034318A (zh) 2023-04-28
TW202214745A (zh) 2022-04-16

Similar Documents

Publication Publication Date Title
TWI345575B (en) Photosensitive resin composition and menufacturing method of heat-resistant resin and organic electroluminescent device using it
JP6195018B2 (ja) ジアミン化合物に由来する構造を有する耐熱性樹脂または耐熱性樹脂前駆体
JP4390028B2 (ja) ポジ型感光性ポリイミド樹脂組成物
CN103186048B (zh) 正性光敏树脂组合物，及使用其的光敏树脂层和显示装置
JP4120584B2 (ja) ポリアミック酸樹脂組成物
JP4834949B2 (ja) 熱硬化性樹脂組成物およびそれを用いた電子部品
CN1577088B (zh) 感光性树脂前体组合物
JP4595412B2 (ja) 感光性樹脂前駆体組成物
CN109863206A (zh) 树脂组合物、树脂片材、固化膜、有机el显示装置、半导体电子部件、半导体器件及有机el显示装置的制造方法
JP7106863B2 (ja) 有機ｅｌ表示装置用感光性樹脂組成物
JP4360168B2 (ja) ポジ型感光性樹脂組成物
CN104040430B (zh) 正性光敏树脂组合物
TWI902865B (zh) 著色感光性樹脂組成物、硬化物、顯示裝置及硬化物之製造方法
JP4677887B2 (ja) 感光性樹脂組成物
TW202106760A (zh) 感光性樹脂組成物、感光性樹脂薄片、硬化膜、硬化膜之製造方法、有機el顯示裝置、及電子零件
JP2023134943A (ja) 感光性樹脂組成物、硬化物および有機ｅｌディスプレイ
KR20240045164A (ko) 화합물, 수지 조성물, 경화물, 및 표시 장치
JP2008040324A (ja) 樹脂組成物およびそれを用いたパターン化樹脂膜の製造方法
WO2018029746A1 (ja) ジアミン化合物、それを用いた耐熱性樹脂または耐熱性樹脂前駆体
JP3365108B2 (ja) 感光性ポリアミドを用いたパターン形成方法
TWI915584B (zh) 化合物、樹脂組成物、硬化物、硬化物之製造方法、有機el顯示裝置及顯示裝置
JP2025066413A (ja) 感光性樹脂組成物、硬化物、表示装置
TWI533087B (zh) 用於顯示裝置絕緣膜之光敏樹脂組成物、使用其之絕緣膜、及使用其之顯示裝置（二）
JP7679022B2 (ja) ポジ型感光性樹脂組成物、ドライフィルム、パターン塗膜及び電子部品
TW202319381A (zh) 化合物、樹脂組成物、硬化物、硬化物之製造方法、有機el顯示裝置及顯示裝置