TWI896991B - 雷射加工系統及雷射加工方法 - Google Patents

雷射加工系統及雷射加工方法

Info

Publication number
TWI896991B
TWI896991B TW112123412A TW112123412A TWI896991B TW I896991 B TWI896991 B TW I896991B TW 112123412 A TW112123412 A TW 112123412A TW 112123412 A TW112123412 A TW 112123412A TW I896991 B TWI896991 B TW I896991B
Authority
TW
Taiwan
Prior art keywords
laser
mode
laser processing
processor
workpiece
Prior art date
Application number
TW112123412A
Other languages
English (en)
Chinese (zh)
Other versions
TW202400342A (zh
Inventor
和泉貴士
Original Assignee
日商發那科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商發那科股份有限公司 filed Critical 日商發那科股份有限公司
Publication of TW202400342A publication Critical patent/TW202400342A/zh
Application granted granted Critical
Publication of TWI896991B publication Critical patent/TWI896991B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
TW112123412A 2022-06-28 2023-06-21 雷射加工系統及雷射加工方法 TWI896991B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/025800 WO2024004044A1 (ja) 2022-06-28 2022-06-28 レーザ加工システム、及びレーザ加工方法
WOPCT/JP2022/025800 2022-06-28

Publications (2)

Publication Number Publication Date
TW202400342A TW202400342A (zh) 2024-01-01
TWI896991B true TWI896991B (zh) 2025-09-11

Family

ID=84974459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112123412A TWI896991B (zh) 2022-06-28 2023-06-21 雷射加工系統及雷射加工方法

Country Status (6)

Country Link
US (1) US20250367758A1 (https=)
JP (1) JP7208445B1 (https=)
CN (1) CN119317503A (https=)
DE (1) DE112022006984T5 (https=)
TW (1) TWI896991B (https=)
WO (1) WO2024004044A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071542A (ja) * 1996-06-17 1998-03-17 Amada Co Ltd 工作機械の動作状態設定方法、及び動作状態設定装置
WO2000054925A1 (en) 1998-09-09 2000-09-21 Gsi Lumonics Robotically operated laser head
JP2008043989A (ja) * 2006-08-21 2008-02-28 Omron Laserfront Inc レーザ加工装置及びこれを使用したレーザ加工方法
JP2011173170A (ja) * 2011-04-08 2011-09-08 Keyence Corp レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工システム
CN105014235A (zh) * 2014-04-30 2015-11-04 发那科株式会社 激光加工系统
JP2019005800A (ja) * 2017-06-28 2019-01-17 コマツ産機株式会社 三次元レーザ加工機および三次元レーザ加工機の制御方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6268364B2 (ja) 2014-03-07 2018-01-31 パナソニックＩｐマネジメント株式会社 レーザ加工システム
BE1028012B1 (nl) * 2020-01-27 2021-08-24 Netalux Nv Laserbehandelingsapparaat en werkwijze voor laserbehandeling

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071542A (ja) * 1996-06-17 1998-03-17 Amada Co Ltd 工作機械の動作状態設定方法、及び動作状態設定装置
WO2000054925A1 (en) 1998-09-09 2000-09-21 Gsi Lumonics Robotically operated laser head
JP2008043989A (ja) * 2006-08-21 2008-02-28 Omron Laserfront Inc レーザ加工装置及びこれを使用したレーザ加工方法
JP2011173170A (ja) * 2011-04-08 2011-09-08 Keyence Corp レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工システム
CN105014235A (zh) * 2014-04-30 2015-11-04 发那科株式会社 激光加工系统
JP2019005800A (ja) * 2017-06-28 2019-01-17 コマツ産機株式会社 三次元レーザ加工機および三次元レーザ加工機の制御方法

Also Published As

Publication number Publication date
US20250367758A1 (en) 2025-12-04
CN119317503A (zh) 2025-01-14
WO2024004044A1 (ja) 2024-01-04
JP7208445B1 (ja) 2023-01-19
DE112022006984T5 (de) 2025-02-20
JPWO2024004044A1 (https=) 2024-01-04
TW202400342A (zh) 2024-01-01

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