JP7208445B1 - レーザ加工システム、及びレーザ加工方法 - Google Patents

レーザ加工システム、及びレーザ加工方法 Download PDF

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Publication number
JP7208445B1
JP7208445B1 JP2022563496A JP2022563496A JP7208445B1 JP 7208445 B1 JP7208445 B1 JP 7208445B1 JP 2022563496 A JP2022563496 A JP 2022563496A JP 2022563496 A JP2022563496 A JP 2022563496A JP 7208445 B1 JP7208445 B1 JP 7208445B1
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Japan
Prior art keywords
laser
laser processing
operation mode
processor
mode
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Active
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JP2022563496A
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English (en)
Japanese (ja)
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JPWO2024004044A5 (https=
JPWO2024004044A1 (https=
Inventor
貴士 和泉
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Fanuc Corp
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Fanuc Corp
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Publication of JPWO2024004044A1 publication Critical patent/JPWO2024004044A1/ja
Publication of JPWO2024004044A5 publication Critical patent/JPWO2024004044A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
JP2022563496A 2022-06-28 2022-06-28 レーザ加工システム、及びレーザ加工方法 Active JP7208445B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025800 WO2024004044A1 (ja) 2022-06-28 2022-06-28 レーザ加工システム、及びレーザ加工方法

Publications (3)

Publication Number Publication Date
JP7208445B1 true JP7208445B1 (ja) 2023-01-19
JPWO2024004044A1 JPWO2024004044A1 (https=) 2024-01-04
JPWO2024004044A5 JPWO2024004044A5 (https=) 2024-06-04

Family

ID=84974459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022563496A Active JP7208445B1 (ja) 2022-06-28 2022-06-28 レーザ加工システム、及びレーザ加工方法

Country Status (6)

Country Link
US (1) US20250367758A1 (https=)
JP (1) JP7208445B1 (https=)
CN (1) CN119317503A (https=)
DE (1) DE112022006984T5 (https=)
TW (1) TWI896991B (https=)
WO (1) WO2024004044A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071542A (ja) * 1996-06-17 1998-03-17 Amada Co Ltd 工作機械の動作状態設定方法、及び動作状態設定装置
JP2008043989A (ja) * 2006-08-21 2008-02-28 Omron Laserfront Inc レーザ加工装置及びこれを使用したレーザ加工方法
JP2019005800A (ja) * 2017-06-28 2019-01-17 コマツ産機株式会社 三次元レーザ加工機および三次元レーザ加工機の制御方法
WO2021152450A1 (en) * 2020-01-27 2021-08-05 Netalux Nv Laser treatment device and procedure for laser treatment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002538971A (ja) 1998-09-09 2002-11-19 ジーエスアイ ルモニクス ロボット的に動作するレーザ・ヘッド
JP5226823B2 (ja) * 2011-04-08 2013-07-03 株式会社キーエンス レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工システム
JP6268364B2 (ja) 2014-03-07 2018-01-31 パナソニックＩｐマネジメント株式会社 レーザ加工システム
JP5902747B2 (ja) * 2014-04-30 2016-04-13 ファナック株式会社 加工再開準備機能を有するレーザ加工システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071542A (ja) * 1996-06-17 1998-03-17 Amada Co Ltd 工作機械の動作状態設定方法、及び動作状態設定装置
JP2008043989A (ja) * 2006-08-21 2008-02-28 Omron Laserfront Inc レーザ加工装置及びこれを使用したレーザ加工方法
JP2019005800A (ja) * 2017-06-28 2019-01-17 コマツ産機株式会社 三次元レーザ加工機および三次元レーザ加工機の制御方法
WO2021152450A1 (en) * 2020-01-27 2021-08-05 Netalux Nv Laser treatment device and procedure for laser treatment

Also Published As

Publication number Publication date
US20250367758A1 (en) 2025-12-04
CN119317503A (zh) 2025-01-14
TWI896991B (zh) 2025-09-11
WO2024004044A1 (ja) 2024-01-04
DE112022006984T5 (de) 2025-02-20
JPWO2024004044A1 (https=) 2024-01-04
TW202400342A (zh) 2024-01-01

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