DE112022006984T5 - Laserbearbeitungssystem und laserbearbeitungsverfahren - Google Patents

Laserbearbeitungssystem und laserbearbeitungsverfahren Download PDF

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Publication number
DE112022006984T5
DE112022006984T5 DE112022006984.8T DE112022006984T DE112022006984T5 DE 112022006984 T5 DE112022006984 T5 DE 112022006984T5 DE 112022006984 T DE112022006984 T DE 112022006984T DE 112022006984 T5 DE112022006984 T5 DE 112022006984T5
Authority
DE
Germany
Prior art keywords
laser processing
laser
drive mode
processor
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022006984.8T
Other languages
German (de)
English (en)
Inventor
Takashi Izumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE112022006984T5 publication Critical patent/DE112022006984T5/de
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
DE112022006984.8T 2022-06-28 2022-06-28 Laserbearbeitungssystem und laserbearbeitungsverfahren Pending DE112022006984T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025800 WO2024004044A1 (ja) 2022-06-28 2022-06-28 レーザ加工システム、及びレーザ加工方法

Publications (1)

Publication Number Publication Date
DE112022006984T5 true DE112022006984T5 (de) 2025-02-20

Family

ID=84974459

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022006984.8T Pending DE112022006984T5 (de) 2022-06-28 2022-06-28 Laserbearbeitungssystem und laserbearbeitungsverfahren

Country Status (6)

Country Link
US (1) US20250367758A1 (https=)
JP (1) JP7208445B1 (https=)
CN (1) CN119317503A (https=)
DE (1) DE112022006984T5 (https=)
TW (1) TWI896991B (https=)
WO (1) WO2024004044A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015167974A (ja) 2014-03-07 2015-09-28 パナソニックＩｐマネジメント株式会社 レーザ加工システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071542A (ja) * 1996-06-17 1998-03-17 Amada Co Ltd 工作機械の動作状態設定方法、及び動作状態設定装置
JP2002538971A (ja) 1998-09-09 2002-11-19 ジーエスアイ ルモニクス ロボット的に動作するレーザ・ヘッド
JP2008043989A (ja) * 2006-08-21 2008-02-28 Omron Laserfront Inc レーザ加工装置及びこれを使用したレーザ加工方法
JP5226823B2 (ja) * 2011-04-08 2013-07-03 株式会社キーエンス レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工システム
JP5902747B2 (ja) * 2014-04-30 2016-04-13 ファナック株式会社 加工再開準備機能を有するレーザ加工システム
JP6918603B2 (ja) * 2017-06-28 2021-08-11 コマツ産機株式会社 三次元レーザ加工機および三次元レーザ加工機の制御方法
BE1028012B1 (nl) * 2020-01-27 2021-08-24 Netalux Nv Laserbehandelingsapparaat en werkwijze voor laserbehandeling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015167974A (ja) 2014-03-07 2015-09-28 パナソニックＩｐマネジメント株式会社 レーザ加工システム

Also Published As

Publication number Publication date
US20250367758A1 (en) 2025-12-04
CN119317503A (zh) 2025-01-14
TWI896991B (zh) 2025-09-11
WO2024004044A1 (ja) 2024-01-04
JP7208445B1 (ja) 2023-01-19
JPWO2024004044A1 (https=) 2024-01-04
TW202400342A (zh) 2024-01-01

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