TWI894283B - 支撐玻璃基板及使用此之層積基板 - Google Patents

支撐玻璃基板及使用此之層積基板

Info

Publication number
TWI894283B
TWI894283B TW110119191A TW110119191A TWI894283B TW I894283 B TWI894283 B TW I894283B TW 110119191 A TW110119191 A TW 110119191A TW 110119191 A TW110119191 A TW 110119191A TW I894283 B TWI894283 B TW I894283B
Authority
TW
Taiwan
Prior art keywords
glass substrate
less
substrate
supporting
supporting glass
Prior art date
Application number
TW110119191A
Other languages
English (en)
Chinese (zh)
Other versions
TW202212285A (zh
Inventor
鈴木良太
結城健
村田哲哉
市丸智憲
永野雄太
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW202212285A publication Critical patent/TW202212285A/zh
Application granted granted Critical
Publication of TWI894283B publication Critical patent/TWI894283B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
    • C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/11—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Glass Compositions (AREA)
TW110119191A 2020-05-28 2021-05-27 支撐玻璃基板及使用此之層積基板 TWI894283B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020093161 2020-05-28
JP2020-093161 2020-05-28

Publications (2)

Publication Number Publication Date
TW202212285A TW202212285A (zh) 2022-04-01
TWI894283B true TWI894283B (zh) 2025-08-21

Family

ID=78745338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119191A TWI894283B (zh) 2020-05-28 2021-05-27 支撐玻璃基板及使用此之層積基板

Country Status (6)

Country Link
US (1) US20230212061A1 (https=)
JP (1) JP7814673B2 (https=)
KR (1) KR20230017178A (https=)
CN (2) CN121517102A (https=)
TW (1) TWI894283B (https=)
WO (1) WO2021241312A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024219379A1 (https=) * 2023-04-17 2024-10-24

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187441B1 (en) * 1996-12-26 2001-02-13 Hoya Corporation Glass substrate for information recording medium and magnetic recording medium having the substrate
US20030109370A1 (en) * 2001-05-31 2003-06-12 Mikio Ikenishi Glass substrate for information recording medium and magnetic information recording medium to which the glass substrate is applied
TW200817298A (en) * 2006-06-08 2008-04-16 Hoya Corp Glass for substrate for information recording medium, substrate for information recording medium, information recording medium and method for making the glass, substrate and information recording medium
TW201910284A (zh) * 2017-07-26 2019-03-16 日商Ａｇｃ股份有限公司 半導體封裝用支撐玻璃

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07206467A (ja) * 1994-01-12 1995-08-08 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス
JPH10241134A (ja) * 1996-12-26 1998-09-11 Hoya Corp 情報記録媒体用ガラス基板及びこれを用いた磁気記録媒体
JP2002274881A (ja) * 2001-03-13 2002-09-25 Central Glass Co Ltd プレス成形用ガラスおよび該ガラスを用いた情報記録媒体用基板ガラス
CN104261675A (zh) * 2005-08-15 2015-01-07 安瀚视特股份有限公司 玻璃组合物以及玻璃组合物的制造方法
WO2016190303A1 (ja) * 2015-05-28 2016-12-01 旭硝子株式会社 ガラス基板、および積層基板
WO2017104513A1 (ja) * 2015-12-17 2017-06-22 日本電気硝子株式会社 支持ガラス基板の製造方法
JP6819613B2 (ja) * 2015-12-28 2021-01-27 Ａｇｃ株式会社 ガラス基板、積層基板、積層体、および半導体パッケージの製造方法
WO2018110163A1 (ja) * 2016-12-14 2018-06-21 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層体
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
JP6798629B2 (ja) * 2018-02-05 2020-12-09 Ａｇｃ株式会社 化学強化用ガラス
US10829412B2 (en) * 2018-07-13 2020-11-10 Corning Incorporated Carriers for microelectronics fabrication
WO2020149040A1 (ja) * 2019-01-17 2020-07-23 日本板硝子株式会社 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法
WO2020161949A1 (ja) * 2019-02-08 2020-08-13 Ａｇｃ株式会社 結晶化ガラス、化学強化ガラスおよび半導体支持基板
CN110845153B (zh) * 2019-12-03 2022-02-18 重庆鑫景特种玻璃有限公司 一种具有高压应力层深度的强化微晶玻璃及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187441B1 (en) * 1996-12-26 2001-02-13 Hoya Corporation Glass substrate for information recording medium and magnetic recording medium having the substrate
US20030109370A1 (en) * 2001-05-31 2003-06-12 Mikio Ikenishi Glass substrate for information recording medium and magnetic information recording medium to which the glass substrate is applied
TW200817298A (en) * 2006-06-08 2008-04-16 Hoya Corp Glass for substrate for information recording medium, substrate for information recording medium, information recording medium and method for making the glass, substrate and information recording medium
TW201910284A (zh) * 2017-07-26 2019-03-16 日商Ａｇｃ股份有限公司 半導體封裝用支撐玻璃

Also Published As

Publication number Publication date
CN115667164A (zh) 2023-01-31
WO2021241312A1 (ja) 2021-12-02
JPWO2021241312A1 (https=) 2021-12-02
KR20230017178A (ko) 2023-02-03
JP7814673B2 (ja) 2026-02-17
TW202212285A (zh) 2022-04-01
US20230212061A1 (en) 2023-07-06
CN121517102A (zh) 2026-02-13

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