CN121517102A - 支承玻璃基板及使用该支承玻璃基板的层叠基板 - Google Patents

支承玻璃基板及使用该支承玻璃基板的层叠基板

Info

Publication number
CN121517102A
CN121517102A CN202511580684.1A CN202511580684A CN121517102A CN 121517102 A CN121517102 A CN 121517102A CN 202511580684 A CN202511580684 A CN 202511580684A CN 121517102 A CN121517102 A CN 121517102A
Authority
CN
China
Prior art keywords
glass substrate
less
glass
supporting
supporting glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202511580684.1A
Other languages
English (en)
Chinese (zh)
Inventor
铃木良太
结城健
村田哲哉
市丸智宪
永野雄太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Publication of CN121517102A publication Critical patent/CN121517102A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
    • C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/11—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Glass Compositions (AREA)
CN202511580684.1A 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板 Pending CN121517102A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020093161 2020-05-28
JP2020-093161 2020-05-28
CN202180038287.5A CN115667164A (zh) 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板
PCT/JP2021/018705 WO2021241312A1 (ja) 2020-05-28 2021-05-18 支持ガラス基板及びこれを用いた積層基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202180038287.5A Division CN115667164A (zh) 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板

Publications (1)

Publication Number Publication Date
CN121517102A true CN121517102A (zh) 2026-02-13

Family

ID=78745338

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202511580684.1A Pending CN121517102A (zh) 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板
CN202180038287.5A Pending CN115667164A (zh) 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202180038287.5A Pending CN115667164A (zh) 2020-05-28 2021-05-18 支承玻璃基板及使用该支承玻璃基板的层叠基板

Country Status (6)

Country Link
US (1) US20230212061A1 (https=)
JP (1) JP7814673B2 (https=)
KR (1) KR20230017178A (https=)
CN (2) CN121517102A (https=)
TW (1) TWI894283B (https=)
WO (1) WO2021241312A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024219379A1 (https=) * 2023-04-17 2024-10-24

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07206467A (ja) * 1994-01-12 1995-08-08 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス
US6187441B1 (en) * 1996-12-26 2001-02-13 Hoya Corporation Glass substrate for information recording medium and magnetic recording medium having the substrate
JPH10241134A (ja) * 1996-12-26 1998-09-11 Hoya Corp 情報記録媒体用ガラス基板及びこれを用いた磁気記録媒体
JP2002274881A (ja) * 2001-03-13 2002-09-25 Central Glass Co Ltd プレス成形用ガラスおよび該ガラスを用いた情報記録媒体用基板ガラス
JP3995902B2 (ja) * 2001-05-31 2007-10-24 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板及びそれを用いた磁気情報記録媒体
CN104261675A (zh) * 2005-08-15 2015-01-07 安瀚视特股份有限公司 玻璃组合物以及玻璃组合物的制造方法
WO2007142324A1 (ja) * 2006-06-08 2007-12-13 Hoya Corporation 情報記録媒体用基板に供するためのガラス、情報記録媒体用基板および情報記録媒体とそれらの製造方法
WO2016190303A1 (ja) * 2015-05-28 2016-12-01 旭硝子株式会社 ガラス基板、および積層基板
WO2017104513A1 (ja) * 2015-12-17 2017-06-22 日本電気硝子株式会社 支持ガラス基板の製造方法
JP6819613B2 (ja) * 2015-12-28 2021-01-27 Ａｇｃ株式会社 ガラス基板、積層基板、積層体、および半導体パッケージの製造方法
WO2018110163A1 (ja) * 2016-12-14 2018-06-21 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層体
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
WO2019021911A1 (ja) * 2017-07-26 2019-01-31 Ａｇｃ株式会社 半導体パッケージ用支持ガラス
JP6798629B2 (ja) * 2018-02-05 2020-12-09 Ａｇｃ株式会社 化学強化用ガラス
US10829412B2 (en) * 2018-07-13 2020-11-10 Corning Incorporated Carriers for microelectronics fabrication
WO2020149040A1 (ja) * 2019-01-17 2020-07-23 日本板硝子株式会社 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法
WO2020161949A1 (ja) * 2019-02-08 2020-08-13 Ａｇｃ株式会社 結晶化ガラス、化学強化ガラスおよび半導体支持基板
CN110845153B (zh) * 2019-12-03 2022-02-18 重庆鑫景特种玻璃有限公司 一种具有高压应力层深度的强化微晶玻璃及其制备方法

Also Published As

Publication number Publication date
CN115667164A (zh) 2023-01-31
WO2021241312A1 (ja) 2021-12-02
TWI894283B (zh) 2025-08-21
JPWO2021241312A1 (https=) 2021-12-02
KR20230017178A (ko) 2023-02-03
JP7814673B2 (ja) 2026-02-17
TW202212285A (zh) 2022-04-01
US20230212061A1 (en) 2023-07-06

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