JPWO2021241312A1 - - Google Patents
Info
- Publication number
- JPWO2021241312A1 JPWO2021241312A1 JP2022526909A JP2022526909A JPWO2021241312A1 JP WO2021241312 A1 JPWO2021241312 A1 JP WO2021241312A1 JP 2022526909 A JP2022526909 A JP 2022526909A JP 2022526909 A JP2022526909 A JP 2022526909A JP WO2021241312 A1 JPWO2021241312 A1 JP WO2021241312A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/11—Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020093161 | 2020-05-28 | ||
| JP2020093161 | 2020-05-28 | ||
| PCT/JP2021/018705 WO2021241312A1 (ja) | 2020-05-28 | 2021-05-18 | 支持ガラス基板及びこれを用いた積層基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026015862A Division JP2026074133A (ja) | 2020-05-28 | 2026-02-03 | ガラス基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021241312A1 true JPWO2021241312A1 (https=) | 2021-12-02 |
| JP7814673B2 JP7814673B2 (ja) | 2026-02-17 |
Family
ID=78745338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022526909A Active JP7814673B2 (ja) | 2020-05-28 | 2021-05-18 | 支持ガラス基板及びこれを用いた積層基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230212061A1 (https=) |
| JP (1) | JP7814673B2 (https=) |
| KR (1) | KR20230017178A (https=) |
| CN (2) | CN121517102A (https=) |
| TW (1) | TWI894283B (https=) |
| WO (1) | WO2021241312A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024219379A1 (https=) * | 2023-04-17 | 2024-10-24 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07206467A (ja) * | 1994-01-12 | 1995-08-08 | Nippon Electric Glass Co Ltd | 固体撮像素子用カバーガラス |
| JPH10241134A (ja) * | 1996-12-26 | 1998-09-11 | Hoya Corp | 情報記録媒体用ガラス基板及びこれを用いた磁気記録媒体 |
| JP2002274881A (ja) * | 2001-03-13 | 2002-09-25 | Central Glass Co Ltd | プレス成形用ガラスおよび該ガラスを用いた情報記録媒体用基板ガラス |
| JP2002358626A (ja) * | 2001-05-31 | 2002-12-13 | Hoya Corp | 情報記録媒体用ガラス基板及びそれを用いた磁気情報記録媒体 |
| WO2007020824A1 (ja) * | 2005-08-15 | 2007-02-22 | Nippon Sheet Glass Company, Limited | ガラス組成物およびガラス組成物の製造方法 |
| WO2007142324A1 (ja) * | 2006-06-08 | 2007-12-13 | Hoya Corporation | 情報記録媒体用基板に供するためのガラス、情報記録媒体用基板および情報記録媒体とそれらの製造方法 |
| WO2018110163A1 (ja) * | 2016-12-14 | 2018-06-21 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層体 |
| WO2019021672A1 (ja) * | 2017-07-26 | 2019-01-31 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層基板 |
| WO2019021911A1 (ja) * | 2017-07-26 | 2019-01-31 | Ａｇｃ株式会社 | 半導体パッケージ用支持ガラス |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6187441B1 (en) * | 1996-12-26 | 2001-02-13 | Hoya Corporation | Glass substrate for information recording medium and magnetic recording medium having the substrate |
| WO2016190303A1 (ja) * | 2015-05-28 | 2016-12-01 | 旭硝子株式会社 | ガラス基板、および積層基板 |
| WO2017104513A1 (ja) * | 2015-12-17 | 2017-06-22 | 日本電気硝子株式会社 | 支持ガラス基板の製造方法 |
| JP6819613B2 (ja) * | 2015-12-28 | 2021-01-27 | Ａｇｃ株式会社 | ガラス基板、積層基板、積層体、および半導体パッケージの製造方法 |
| JP6798629B2 (ja) * | 2018-02-05 | 2020-12-09 | Ａｇｃ株式会社 | 化学強化用ガラス |
| US10829412B2 (en) * | 2018-07-13 | 2020-11-10 | Corning Incorporated | Carriers for microelectronics fabrication |
| WO2020149040A1 (ja) * | 2019-01-17 | 2020-07-23 | 日本板硝子株式会社 | 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法 |
| WO2020161949A1 (ja) * | 2019-02-08 | 2020-08-13 | Ａｇｃ株式会社 | 結晶化ガラス、化学強化ガラスおよび半導体支持基板 |
| CN110845153B (zh) * | 2019-12-03 | 2022-02-18 | 重庆鑫景特种玻璃有限公司 | 一种具有高压应力层深度的强化微晶玻璃及其制备方法 |
-
2021
- 2021-05-18 CN CN202511580684.1A patent/CN121517102A/zh active Pending
- 2021-05-18 CN CN202180038287.5A patent/CN115667164A/zh active Pending
- 2021-05-18 WO PCT/JP2021/018705 patent/WO2021241312A1/ja not_active Ceased
- 2021-05-18 KR KR1020227039444A patent/KR20230017178A/ko active Pending
- 2021-05-18 US US17/927,190 patent/US20230212061A1/en active Pending
- 2021-05-18 JP JP2022526909A patent/JP7814673B2/ja active Active
- 2021-05-27 TW TW110119191A patent/TWI894283B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07206467A (ja) * | 1994-01-12 | 1995-08-08 | Nippon Electric Glass Co Ltd | 固体撮像素子用カバーガラス |
| JPH10241134A (ja) * | 1996-12-26 | 1998-09-11 | Hoya Corp | 情報記録媒体用ガラス基板及びこれを用いた磁気記録媒体 |
| JP2002274881A (ja) * | 2001-03-13 | 2002-09-25 | Central Glass Co Ltd | プレス成形用ガラスおよび該ガラスを用いた情報記録媒体用基板ガラス |
| JP2002358626A (ja) * | 2001-05-31 | 2002-12-13 | Hoya Corp | 情報記録媒体用ガラス基板及びそれを用いた磁気情報記録媒体 |
| WO2007020824A1 (ja) * | 2005-08-15 | 2007-02-22 | Nippon Sheet Glass Company, Limited | ガラス組成物およびガラス組成物の製造方法 |
| WO2007142324A1 (ja) * | 2006-06-08 | 2007-12-13 | Hoya Corporation | 情報記録媒体用基板に供するためのガラス、情報記録媒体用基板および情報記録媒体とそれらの製造方法 |
| WO2018110163A1 (ja) * | 2016-12-14 | 2018-06-21 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層体 |
| WO2019021672A1 (ja) * | 2017-07-26 | 2019-01-31 | 日本電気硝子株式会社 | 支持ガラス基板及びこれを用いた積層基板 |
| WO2019021911A1 (ja) * | 2017-07-26 | 2019-01-31 | Ａｇｃ株式会社 | 半導体パッケージ用支持ガラス |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115667164A (zh) | 2023-01-31 |
| WO2021241312A1 (ja) | 2021-12-02 |
| TWI894283B (zh) | 2025-08-21 |
| KR20230017178A (ko) | 2023-02-03 |
| JP7814673B2 (ja) | 2026-02-17 |
| TW202212285A (zh) | 2022-04-01 |
| US20230212061A1 (en) | 2023-07-06 |
| CN121517102A (zh) | 2026-02-13 |
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