TWI881169B - 研磨裝置、及研磨墊之交換時期之決定方法 - Google Patents

研磨裝置、及研磨墊之交換時期之決定方法 Download PDF

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Publication number
TWI881169B
TWI881169B TW110135246A TW110135246A TWI881169B TW I881169 B TWI881169 B TW I881169B TW 110135246 A TW110135246 A TW 110135246A TW 110135246 A TW110135246 A TW 110135246A TW I881169 B TWI881169 B TW I881169B
Authority
TW
Taiwan
Prior art keywords
grinding
polishing
index value
dresser
pad
Prior art date
Application number
TW110135246A
Other languages
English (en)
Chinese (zh)
Other versions
TW202215521A (zh
Inventor
鈴木佑多
高橋太郎
大滝裕史
鳥越恒男
西田弘明
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202215521A publication Critical patent/TW202215521A/zh
Application granted granted Critical
Publication of TWI881169B publication Critical patent/TWI881169B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW110135246A 2020-09-29 2021-09-23 研磨裝置、及研磨墊之交換時期之決定方法 TWI881169B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-163274 2020-09-29
JP2020163274A JP7421460B2 (ja) 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法

Publications (2)

Publication Number Publication Date
TW202215521A TW202215521A (zh) 2022-04-16
TWI881169B true TWI881169B (zh) 2025-04-21

Family

ID=80951343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135246A TWI881169B (zh) 2020-09-29 2021-09-23 研磨裝置、及研磨墊之交換時期之決定方法

Country Status (6)

Country Link
US (1) US20230356350A1 (https=)
JP (1) JP7421460B2 (https=)
KR (1) KR102772031B1 (https=)
CN (1) CN116209543A (https=)
TW (1) TWI881169B (https=)
WO (1) WO2022070607A1 (https=)

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KR102909307B1 (ko) * 2020-10-26 2026-01-08 주식회사 케이씨텍 연마 패드 모니터링 장치 및 이를 포함하는 기판 연마 시스템
CN115541703B (zh) * 2022-09-27 2025-07-18 厦门理工学院 一种风电叶片连接处细小缺陷的检测方法和装置以及设备
KR102748383B1 (ko) * 2022-10-26 2024-12-31 주식회사 슈텍 화학기계적 연마장비용 검사 모니터링 장치, 이를 포함하는 화학기계적 연마장비 및 이의 제어방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
CN119141329A (zh) * 2024-09-30 2024-12-17 东风汽车集团股份有限公司 一种汽车车身自动化精饰方法及系统

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JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
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TW201900334A (zh) * 2017-05-17 2019-01-01 日商荏原製作所股份有限公司 研磨裝置及研磨方法
JP2020028955A (ja) * 2018-08-23 2020-02-27 株式会社荏原製作所 研磨パッド高さを決定する方法、および研磨システム

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KR100877386B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
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JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
JP2010226007A (ja) * 2009-03-25 2010-10-07 Renesas Electronics Corp 研磨工程制御方法および半導体ウエハ研磨システム
TW201813770A (zh) * 2016-09-30 2018-04-16 日商荏原製作所股份有限公司 研磨裝置及研磨方法
TW201900334A (zh) * 2017-05-17 2019-01-01 日商荏原製作所股份有限公司 研磨裝置及研磨方法
JP2020028955A (ja) * 2018-08-23 2020-02-27 株式会社荏原製作所 研磨パッド高さを決定する方法、および研磨システム

Also Published As

Publication number Publication date
US20230356350A1 (en) 2023-11-09
JP7421460B2 (ja) 2024-01-24
CN116209543A (zh) 2023-06-02
TW202215521A (zh) 2022-04-16
WO2022070607A1 (ja) 2022-04-07
JP2022055703A (ja) 2022-04-08
KR20230078720A (ko) 2023-06-02
KR102772031B1 (ko) 2025-02-26

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