JP7421460B2 - 研磨装置、および研磨パッドの交換時期を決定する方法 - Google Patents

研磨装置、および研磨パッドの交換時期を決定する方法 Download PDF

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Publication number
JP7421460B2
JP7421460B2 JP2020163274A JP2020163274A JP7421460B2 JP 7421460 B2 JP7421460 B2 JP 7421460B2 JP 2020163274 A JP2020163274 A JP 2020163274A JP 2020163274 A JP2020163274 A JP 2020163274A JP 7421460 B2 JP7421460 B2 JP 7421460B2
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JP
Japan
Prior art keywords
polishing
polishing pad
detection sensor
dresser
index value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020163274A
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English (en)
Japanese (ja)
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JP2022055703A5 (https=
JP2022055703A (ja
Inventor
佑多 鈴木
太郎 高橋
裕史 大滝
恒男 鳥越
弘明 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2020163274A priority Critical patent/JP7421460B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to KR1020237013821A priority patent/KR102772031B1/ko
Priority to PCT/JP2021/029120 priority patent/WO2022070607A1/ja
Priority to US18/246,366 priority patent/US20230356350A1/en
Priority to CN202180065798.6A priority patent/CN116209543A/zh
Priority to TW110135246A priority patent/TWI881169B/zh
Publication of JP2022055703A publication Critical patent/JP2022055703A/ja
Publication of JP2022055703A5 publication Critical patent/JP2022055703A5/ja
Application granted granted Critical
Publication of JP7421460B2 publication Critical patent/JP7421460B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2020163274A 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法 Active JP7421460B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020163274A JP7421460B2 (ja) 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法
PCT/JP2021/029120 WO2022070607A1 (ja) 2020-09-29 2021-08-05 研磨装置、および研磨パッドの交換時期を決定する方法
US18/246,366 US20230356350A1 (en) 2020-09-29 2021-08-05 Polishing apparatus and method of determining a time to replace polishing pad
CN202180065798.6A CN116209543A (zh) 2020-09-29 2021-08-05 研磨装置及研磨垫的更换时期的决定方法
KR1020237013821A KR102772031B1 (ko) 2020-09-29 2021-08-05 연마 장치, 및 연마 패드의 교환 시기를 결정하는 방법
TW110135246A TWI881169B (zh) 2020-09-29 2021-09-23 研磨裝置、及研磨墊之交換時期之決定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020163274A JP7421460B2 (ja) 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法

Publications (3)

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JP2022055703A JP2022055703A (ja) 2022-04-08
JP2022055703A5 JP2022055703A5 (https=) 2023-05-09
JP7421460B2 true JP7421460B2 (ja) 2024-01-24

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JP2020163274A Active JP7421460B2 (ja) 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法

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Country Link
US (1) US20230356350A1 (https=)
JP (1) JP7421460B2 (https=)
KR (1) KR102772031B1 (https=)
CN (1) CN116209543A (https=)
TW (1) TWI881169B (https=)
WO (1) WO2022070607A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102909307B1 (ko) * 2020-10-26 2026-01-08 주식회사 케이씨텍 연마 패드 모니터링 장치 및 이를 포함하는 기판 연마 시스템
CN115541703B (zh) * 2022-09-27 2025-07-18 厦门理工学院 一种风电叶片连接处细小缺陷的检测方法和装置以及设备
KR102748383B1 (ko) * 2022-10-26 2024-12-31 주식회사 슈텍 화학기계적 연마장비용 검사 모니터링 장치, 이를 포함하는 화학기계적 연마장비 및 이의 제어방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
CN119141329A (zh) * 2024-09-30 2024-12-17 东风汽车集团股份有限公司 一种汽车车身自动化精饰方法及系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022028A (ja) 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
JP2006255851A (ja) 2005-03-18 2006-09-28 Ebara Corp 研磨装置
JP2009255250A (ja) 2008-04-18 2009-11-05 Tokyo Seimitsu Co Ltd 砥石成形状態判定装置及び砥石成形状態判定方法
JP2010226007A (ja) 2009-03-25 2010-10-07 Renesas Electronics Corp 研磨工程制御方法および半導体ウエハ研磨システム
JP2014042968A (ja) 2012-08-28 2014-03-13 Ebara Corp ドレッシングプロセスの監視方法および研磨装置
JP2017100254A (ja) 2015-12-03 2017-06-08 株式会社ディスコ 研磨装置
JP2020028955A (ja) 2018-08-23 2020-02-27 株式会社荏原製作所 研磨パッド高さを決定する方法、および研磨システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP2001079752A (ja) * 1999-09-08 2001-03-27 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
KR100877386B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
JP5511600B2 (ja) 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
CN102248486B (zh) * 2011-07-25 2013-01-30 清华大学 抛光垫修整方法
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
CN204954631U (zh) * 2015-09-21 2016-01-13 青岛理工大学 一种声发射和测力仪集成的砂轮堵塞检测清洗装置
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
CN106826565B (zh) * 2017-03-16 2018-11-02 中国人民解放军装甲兵工程学院 一种利用磨削力监控砂轮磨损与磨削烧伤的方法
JP6829653B2 (ja) * 2017-05-17 2021-02-10 株式会社荏原製作所 研磨装置および研磨方法
KR20200043216A (ko) * 2018-10-17 2020-04-27 주식회사 케이씨텍 화학 기계적 연마 장치의 컨디셔너
JP7420530B2 (ja) * 2018-10-31 2024-01-23 株式会社ノリタケカンパニーリミテド ドレッシング面評価装置、ドレッシング装置、および、研削加工装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022028A (ja) 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
JP2006255851A (ja) 2005-03-18 2006-09-28 Ebara Corp 研磨装置
JP2009255250A (ja) 2008-04-18 2009-11-05 Tokyo Seimitsu Co Ltd 砥石成形状態判定装置及び砥石成形状態判定方法
JP2010226007A (ja) 2009-03-25 2010-10-07 Renesas Electronics Corp 研磨工程制御方法および半導体ウエハ研磨システム
JP2014042968A (ja) 2012-08-28 2014-03-13 Ebara Corp ドレッシングプロセスの監視方法および研磨装置
JP2017100254A (ja) 2015-12-03 2017-06-08 株式会社ディスコ 研磨装置
JP2020028955A (ja) 2018-08-23 2020-02-27 株式会社荏原製作所 研磨パッド高さを決定する方法、および研磨システム

Also Published As

Publication number Publication date
US20230356350A1 (en) 2023-11-09
CN116209543A (zh) 2023-06-02
TW202215521A (zh) 2022-04-16
WO2022070607A1 (ja) 2022-04-07
TWI881169B (zh) 2025-04-21
JP2022055703A (ja) 2022-04-08
KR20230078720A (ko) 2023-06-02
KR102772031B1 (ko) 2025-02-26

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