TWI881107B - Ｎｉ糊膏及積層陶瓷電容器、暨積層陶瓷電容器中擴散區域之形成方法 - Google Patents

Ｎｉ糊膏及積層陶瓷電容器、暨積層陶瓷電容器中擴散區域之形成方法 Download PDF

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Publication number
TWI881107B
TWI881107B TW110113028A TW110113028A TWI881107B TW I881107 B TWI881107 B TW I881107B TW 110113028 A TW110113028 A TW 110113028A TW 110113028 A TW110113028 A TW 110113028A TW I881107 B TWI881107 B TW I881107B
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TW
Taiwan
Prior art keywords
internal electrode
paste
parts
ceramic
mass
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TW110113028A
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English (en)
Chinese (zh)
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TW202147346A (zh
Inventor
岡村寛志
立野隼人
Original Assignee
日商昭榮化學工業股份有限公司
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Publication of TW202147346A publication Critical patent/TW202147346A/zh
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Publication of TWI881107B publication Critical patent/TWI881107B/zh

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
TW110113028A 2020-04-13 2021-04-12 Ｎｉ糊膏及積層陶瓷電容器、暨積層陶瓷電容器中擴散區域之形成方法 TWI881107B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020071829 2020-04-13
JP2020-071829 2020-04-13
JP2020-119273 2020-07-10
JP2020119273 2020-07-10
JP2020205713 2020-12-11
JP2020-205713 2020-12-11

Publications (2)

Publication Number Publication Date
TW202147346A TW202147346A (zh) 2021-12-16
TWI881107B true TWI881107B (zh) 2025-04-21

Family

ID=78085331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113028A TWI881107B (zh) 2020-04-13 2021-04-12 Ｎｉ糊膏及積層陶瓷電容器、暨積層陶瓷電容器中擴散區域之形成方法

Country Status (3)

Country Link
JP (1) JP7655311B2 (https=)
TW (1) TWI881107B (https=)
WO (1) WO2021210455A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240092272A (ko) * 2022-12-14 2024-06-24 삼성전기주식회사 적층형 전자 부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049031A (ja) * 1998-07-30 2000-02-18 Toshiba Corp コンデンサの電極組成物及びそれを用いた電極ペースト
TW200418051A (en) * 2002-11-25 2004-09-16 Tdk Corp Conductive composition and ceramic electronic component
TW201821387A (zh) * 2016-10-17 2018-06-16 日商昭榮化學工業股份有限公司 介電體磁器組成物及陶瓷電子零件
CN110698725A (zh) * 2019-10-10 2020-01-17 深圳市峰泳科技有限公司 无机填料及其制备方法和在介电材料中的应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08241828A (ja) * 1995-03-02 1996-09-17 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP4147434B2 (ja) * 1997-07-02 2008-09-10 住友金属鉱山株式会社 ＭＬＣＣの内部電極用Ｎｉ粉末及びＭＬＣＣの内部電極用Ｎｉペースト
JP2000063901A (ja) * 1998-08-24 2000-02-29 Sumitomo Metal Mining Co Ltd 粉体材料とその製造方法およびこの粉体材料を用いた厚膜導電性ペーストとこのペーストを用いた積層セラミックコンデンサ
JP3772726B2 (ja) * 2001-10-25 2006-05-10 株式会社村田製作所 ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品
JP4337501B2 (ja) * 2003-10-27 2009-09-30 株式会社村田製作所 導電性ペーストおよび積層セラミック電子部品
JPWO2006041030A1 (ja) * 2004-10-08 2008-05-15 三井金属鉱業株式会社 導電性インク
JP2014232850A (ja) * 2013-05-30 2014-12-11 京セラ株式会社 積層型電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049031A (ja) * 1998-07-30 2000-02-18 Toshiba Corp コンデンサの電極組成物及びそれを用いた電極ペースト
TW200418051A (en) * 2002-11-25 2004-09-16 Tdk Corp Conductive composition and ceramic electronic component
TW201821387A (zh) * 2016-10-17 2018-06-16 日商昭榮化學工業股份有限公司 介電體磁器組成物及陶瓷電子零件
CN110698725A (zh) * 2019-10-10 2020-01-17 深圳市峰泳科技有限公司 无机填料及其制备方法和在介电材料中的应用

Also Published As

Publication number Publication date
JPWO2021210455A1 (https=) 2021-10-21
WO2021210455A1 (ja) 2021-10-21
JP7655311B2 (ja) 2025-04-02
TW202147346A (zh) 2021-12-16

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