TWI881060B - 磁性組成物 - Google Patents

磁性組成物 Download PDF

Info

Publication number
TWI881060B
TWI881060B TW110107473A TW110107473A TWI881060B TW I881060 B TWI881060 B TW I881060B TW 110107473 A TW110107473 A TW 110107473A TW 110107473 A TW110107473 A TW 110107473A TW I881060 B TWI881060 B TW I881060B
Authority
TW
Taiwan
Prior art keywords
magnetic
less
composition
layer
manufactured
Prior art date
Application number
TW110107473A
Other languages
English (en)
Chinese (zh)
Other versions
TW202138591A (zh
Inventor
萩原千尋
大浦一郎
大山秀樹
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202138591A publication Critical patent/TW202138591A/zh
Application granted granted Critical
Publication of TWI881060B publication Critical patent/TWI881060B/zh

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Soft Magnetic Materials (AREA)
  • Powder Metallurgy (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW110107473A 2020-03-30 2021-03-03 磁性組成物 TWI881060B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-060278 2020-03-30
JP2020060278A JP7599833B2 (ja) 2020-03-30 2020-03-30 磁性組成物

Publications (2)

Publication Number Publication Date
TW202138591A TW202138591A (zh) 2021-10-16
TWI881060B true TWI881060B (zh) 2025-04-21

Family

ID=77868334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110107473A TWI881060B (zh) 2020-03-30 2021-03-03 磁性組成物

Country Status (3)

Country Link
JP (2) JP7599833B2 (https=)
CN (1) CN113470918A (https=)
TW (1) TWI881060B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114340143B (zh) * 2021-12-30 2024-06-18 Oppo广东移动通信有限公司 电路板集成电感、其制备方法及电子设备
WO2023176284A1 (ja) * 2022-03-17 2023-09-21 味の素株式会社 樹脂組成物及びその製造方法
TW202423683A (zh) * 2022-09-02 2024-06-16 日商味之素股份有限公司 磁性基板的製造方法及磁性基板
WO2024247506A1 (ja) * 2023-05-26 2024-12-05 株式会社レゾナック 磁性ペースト、回路部材、回路部材の製造方法
WO2025110186A1 (ja) * 2023-11-20 2025-05-30 株式会社レゾナック 磁性組成物、磁性膜、積層体及び回路部材
WO2025253812A1 (ja) * 2024-06-06 2025-12-11 株式会社レゾナック 磁性粉組成物及び電子部品
WO2025263444A1 (ja) * 2024-06-17 2025-12-26 味の素株式会社 樹脂組成物
WO2026028929A1 (ja) * 2024-07-31 2026-02-05 味の素株式会社 樹脂組成物
CN120264573B (zh) * 2025-02-28 2025-11-28 九江德福科技股份有限公司 一种复合线路板材料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876077A (zh) * 2011-07-05 2017-06-20 太阳诱电株式会社 磁性材料及使用其的线圈零件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071248A (ja) * 2007-09-18 2009-04-02 Hitachi Metals Ltd リアクトルおよびパワーコンディショナ装置
JP5263654B2 (ja) 2008-03-21 2013-08-14 日立金属株式会社 圧粉磁心用軟磁性粉末のシリカ被覆形成方法および圧粉磁心の製造方法
JP5949051B2 (ja) * 2012-03-29 2016-07-06 セイコーエプソン株式会社 射出成形用組成物および焼結体の製造方法
JP2013212642A (ja) 2012-04-02 2013-10-17 Panasonic Corp 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ
JP2016197624A (ja) * 2015-04-02 2016-11-24 イビデン株式会社 インダクタ部品、インダクタ部品の製造方法、インダクタ部品を内蔵するプリント配線板
JP6459986B2 (ja) 2016-01-08 2019-01-30 株式会社村田製作所 金属磁性粉含有シート、インダクタの製造方法及びインダクタ
JP7059594B2 (ja) * 2017-01-12 2022-04-26 Tdk株式会社 軟磁性材料、コア及びインダクタ
JP2018178254A (ja) * 2017-04-13 2018-11-15 Dowaエレクトロニクス株式会社 Fe−Ni系合金粉末およびその製造方法
JP2019016777A (ja) * 2017-07-05 2019-01-31 パナソニックIpマネジメント株式会社 軟磁性粉末とその製造方法、およびそれを用いた圧粉磁心
WO2019031464A1 (ja) * 2017-08-07 2019-02-14 日立金属株式会社 結晶質Fe基合金粉末及びその製造方法
CN111683768B (zh) * 2018-02-20 2023-04-18 同和电子科技有限公司 硅氧化物被覆软磁性粉末及其制造方法
JP7304337B2 (ja) 2018-03-23 2023-07-06 味の素株式会社 スルーホール充填用ペースト
KR102617535B1 (ko) 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
WO2020040250A1 (ja) * 2018-08-23 2020-02-27 日立金属株式会社 磁心用の粉末、それを用いた磁心及びコイル部品、並びに磁心用の粉末の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876077A (zh) * 2011-07-05 2017-06-20 太阳诱电株式会社 磁性材料及使用其的线圈零件

Also Published As

Publication number Publication date
JP2023164858A (ja) 2023-11-14
TW202138591A (zh) 2021-10-16
JP2021158316A (ja) 2021-10-07
CN113470918A (zh) 2021-10-01
JP7599833B2 (ja) 2024-12-16

Similar Documents

Publication Publication Date Title
TWI881060B (zh) 磁性組成物
TWI781166B (zh) 樹脂組成物、硬化物、接著薄膜、內載電感元件之配線板、晶片電感零件以及印刷配線板
JP7392743B2 (ja) 磁性ペースト
TWI653312B (zh) 接著薄膜
JP7694633B2 (ja) 樹脂組成物
JP6657865B2 (ja) 樹脂シート
TWI847993B (zh) 磁性糊料、電路基板及電感器零件
WO2018194100A1 (ja) 樹脂組成物
KR102949172B1 (ko) 수지 조성물
KR20240152319A (ko) 수지 조성물
TWI620613B (zh) Manufacturing method of component mounting substrate, thermosetting resin composition, prepreg, multilayer printed wiring board, and component mounting substrate
JP2023111955A (ja) 樹脂組成物
TWI881968B (zh) 電路基板之製造方法及樹脂組成物
TWI838374B (zh) 硬化體層、印刷配線板、半導體裝置、樹脂薄片、印刷配線板之製造方法及樹脂薄片之製造方法
TW202440802A (zh) 樹脂組成物
KR20240090200A (ko) 수지 조성물
KR20240117085A (ko) 수지 시트
TW202446879A (zh) 樹脂組成物
TW202506795A (zh) 電路基板之製造方法
KR20250057798A (ko) 자성 기판의 제조 방법, 및, 자성 기판
KR20240093356A (ko) 수지 조성물층
TW202230402A (zh) 磁性糊料