JP7599833B2 - 磁性組成物 - Google Patents
磁性組成物 Download PDFInfo
- Publication number
- JP7599833B2 JP7599833B2 JP2020060278A JP2020060278A JP7599833B2 JP 7599833 B2 JP7599833 B2 JP 7599833B2 JP 2020060278 A JP2020060278 A JP 2020060278A JP 2020060278 A JP2020060278 A JP 2020060278A JP 7599833 B2 JP7599833 B2 JP 7599833B2
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- JP
- Japan
- Prior art keywords
- magnetic
- less
- mass
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- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Soft Magnetic Materials (AREA)
- Powder Metallurgy (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020060278A JP7599833B2 (ja) | 2020-03-30 | 2020-03-30 | 磁性組成物 |
| TW110107473A TWI881060B (zh) | 2020-03-30 | 2021-03-03 | 磁性組成物 |
| CN202110326114.5A CN113470918A (zh) | 2020-03-30 | 2021-03-26 | 磁性组合物 |
| JP2023134763A JP2023164858A (ja) | 2020-03-30 | 2023-08-22 | 磁性組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020060278A JP7599833B2 (ja) | 2020-03-30 | 2020-03-30 | 磁性組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023134763A Division JP2023164858A (ja) | 2020-03-30 | 2023-08-22 | 磁性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021158316A JP2021158316A (ja) | 2021-10-07 |
| JP7599833B2 true JP7599833B2 (ja) | 2024-12-16 |
Family
ID=77868334
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020060278A Active JP7599833B2 (ja) | 2020-03-30 | 2020-03-30 | 磁性組成物 |
| JP2023134763A Pending JP2023164858A (ja) | 2020-03-30 | 2023-08-22 | 磁性組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023134763A Pending JP2023164858A (ja) | 2020-03-30 | 2023-08-22 | 磁性組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7599833B2 (https=) |
| CN (1) | CN113470918A (https=) |
| TW (1) | TWI881060B (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340143B (zh) * | 2021-12-30 | 2024-06-18 | Oppo广东移动通信有限公司 | 电路板集成电感、其制备方法及电子设备 |
| WO2023176284A1 (ja) * | 2022-03-17 | 2023-09-21 | 味の素株式会社 | 樹脂組成物及びその製造方法 |
| TW202423683A (zh) * | 2022-09-02 | 2024-06-16 | 日商味之素股份有限公司 | 磁性基板的製造方法及磁性基板 |
| WO2024247506A1 (ja) * | 2023-05-26 | 2024-12-05 | 株式会社レゾナック | 磁性ペースト、回路部材、回路部材の製造方法 |
| WO2025110186A1 (ja) * | 2023-11-20 | 2025-05-30 | 株式会社レゾナック | 磁性組成物、磁性膜、積層体及び回路部材 |
| WO2025253812A1 (ja) * | 2024-06-06 | 2025-12-11 | 株式会社レゾナック | 磁性粉組成物及び電子部品 |
| WO2025263444A1 (ja) * | 2024-06-17 | 2025-12-26 | 味の素株式会社 | 樹脂組成物 |
| WO2026028929A1 (ja) * | 2024-07-31 | 2026-02-05 | 味の素株式会社 | 樹脂組成物 |
| CN120264573B (zh) * | 2025-02-28 | 2025-11-28 | 九江德福科技股份有限公司 | 一种复合线路板材料及其制备方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231481A (ja) | 2008-03-21 | 2009-10-08 | Hitachi Metals Ltd | 圧粉磁心用軟磁性粉末のシリカ被覆形成方法および圧粉磁心の製造方法 |
| JP2013212642A (ja) | 2012-04-02 | 2013-10-17 | Panasonic Corp | 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ |
| JP2017123433A (ja) | 2016-01-08 | 2017-07-13 | 株式会社村田製作所 | 金属磁性粉含有シート、インダクタの製造方法及びインダクタ |
| JP2018113436A (ja) | 2017-01-12 | 2018-07-19 | Tdk株式会社 | 軟磁性材料、コア及びインダクタ |
| JP2018178254A (ja) | 2017-04-13 | 2018-11-15 | Dowaエレクトロニクス株式会社 | Fe−Ni系合金粉末およびその製造方法 |
| JP2019143241A (ja) | 2018-02-20 | 2019-08-29 | Dowaエレクトロニクス株式会社 | シリコン酸化物被覆軟磁性粉末およびその製造方法 |
| WO2019181463A1 (ja) | 2018-03-23 | 2019-09-26 | 味の素株式会社 | スルーホール充填用ペースト |
| WO2020022393A1 (ja) | 2018-07-25 | 2020-01-30 | 味の素株式会社 | 磁性ペースト |
| WO2020040250A1 (ja) | 2018-08-23 | 2020-02-27 | 日立金属株式会社 | 磁心用の粉末、それを用いた磁心及びコイル部品、並びに磁心用の粉末の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009071248A (ja) * | 2007-09-18 | 2009-04-02 | Hitachi Metals Ltd | リアクトルおよびパワーコンディショナ装置 |
| JP5032711B1 (ja) * | 2011-07-05 | 2012-09-26 | 太陽誘電株式会社 | 磁性材料およびそれを用いたコイル部品 |
| JP5949051B2 (ja) * | 2012-03-29 | 2016-07-06 | セイコーエプソン株式会社 | 射出成形用組成物および焼結体の製造方法 |
| JP2016197624A (ja) * | 2015-04-02 | 2016-11-24 | イビデン株式会社 | インダクタ部品、インダクタ部品の製造方法、インダクタ部品を内蔵するプリント配線板 |
| JP2019016777A (ja) * | 2017-07-05 | 2019-01-31 | パナソニックIpマネジメント株式会社 | 軟磁性粉末とその製造方法、およびそれを用いた圧粉磁心 |
| WO2019031464A1 (ja) * | 2017-08-07 | 2019-02-14 | 日立金属株式会社 | 結晶質Fe基合金粉末及びその製造方法 |
-
2020
- 2020-03-30 JP JP2020060278A patent/JP7599833B2/ja active Active
-
2021
- 2021-03-03 TW TW110107473A patent/TWI881060B/zh active
- 2021-03-26 CN CN202110326114.5A patent/CN113470918A/zh active Pending
-
2023
- 2023-08-22 JP JP2023134763A patent/JP2023164858A/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231481A (ja) | 2008-03-21 | 2009-10-08 | Hitachi Metals Ltd | 圧粉磁心用軟磁性粉末のシリカ被覆形成方法および圧粉磁心の製造方法 |
| JP2013212642A (ja) | 2012-04-02 | 2013-10-17 | Panasonic Corp | 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ |
| JP2017123433A (ja) | 2016-01-08 | 2017-07-13 | 株式会社村田製作所 | 金属磁性粉含有シート、インダクタの製造方法及びインダクタ |
| JP2018113436A (ja) | 2017-01-12 | 2018-07-19 | Tdk株式会社 | 軟磁性材料、コア及びインダクタ |
| JP2018178254A (ja) | 2017-04-13 | 2018-11-15 | Dowaエレクトロニクス株式会社 | Fe−Ni系合金粉末およびその製造方法 |
| JP2019143241A (ja) | 2018-02-20 | 2019-08-29 | Dowaエレクトロニクス株式会社 | シリコン酸化物被覆軟磁性粉末およびその製造方法 |
| WO2019181463A1 (ja) | 2018-03-23 | 2019-09-26 | 味の素株式会社 | スルーホール充填用ペースト |
| WO2020022393A1 (ja) | 2018-07-25 | 2020-01-30 | 味の素株式会社 | 磁性ペースト |
| WO2020040250A1 (ja) | 2018-08-23 | 2020-02-27 | 日立金属株式会社 | 磁心用の粉末、それを用いた磁心及びコイル部品、並びに磁心用の粉末の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023164858A (ja) | 2023-11-14 |
| TW202138591A (zh) | 2021-10-16 |
| TWI881060B (zh) | 2025-04-21 |
| JP2021158316A (ja) | 2021-10-07 |
| CN113470918A (zh) | 2021-10-01 |
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