TWI879532B - 基板 - Google Patents

基板 Download PDF

Info

Publication number
TWI879532B
TWI879532B TW113113934A TW113113934A TWI879532B TW I879532 B TWI879532 B TW I879532B TW 113113934 A TW113113934 A TW 113113934A TW 113113934 A TW113113934 A TW 113113934A TW I879532 B TWI879532 B TW I879532B
Authority
TW
Taiwan
Prior art keywords
layer
electrode
substrate
sample
thickness
Prior art date
Application number
TW113113934A
Other languages
English (en)
Chinese (zh)
Other versions
TW202446176A (zh
Inventor
菅井広一朗
杉本健治
池内裕子
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202446176A publication Critical patent/TW202446176A/zh
Application granted granted Critical
Publication of TWI879532B publication Critical patent/TWI879532B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/052Electrodes comprising one or more electrocatalytic coatings on a substrate
    • C25B11/053Electrodes comprising one or more electrocatalytic coatings on a substrate characterised by multilayer electrocatalytic coatings
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/055Electrodes formed of electrocatalysts on a substrate or carrier characterised by the substrate or carrier material
    • C25B11/057Electrodes formed of electrocatalysts on a substrate or carrier characterised by the substrate or carrier material consisting of a single element or compound
    • C25B11/067Inorganic compound e.g. ITO, silica or titania
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/081Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/089Alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/091Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
    • C25B11/097Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds comprising two or more noble metals or noble metal alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Thermistors And Varistors (AREA)
TW113113934A 2023-04-18 2024-04-15 基板 TWI879532B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023068000 2023-04-18
JP2023-068000 2023-04-18

Publications (2)

Publication Number Publication Date
TW202446176A TW202446176A (zh) 2024-11-16
TWI879532B true TWI879532B (zh) 2025-04-01

Family

ID=93152343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113113934A TWI879532B (zh) 2023-04-18 2024-04-15 基板

Country Status (3)

Country Link
JP (1) JPWO2024219268A1 (https=)
TW (1) TWI879532B (https=)
WO (1) WO2024219268A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580020A (ja) * 1991-09-24 1993-03-30 Hitachi Ltd 炭酸ガスセンサ
TW540116B (en) * 1997-12-26 2003-07-01 Canon Kk Anodizing apparatus and method and porous substrate
JP2010048867A (ja) * 2008-08-19 2010-03-04 Canon Inc 反射型表示装置
US20140342255A1 (en) * 2012-01-10 2014-11-20 The Regents Of The University Of California Microstructured cathode for self-regulated oxygen generation and consumption

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5166017B2 (ja) * 2005-02-07 2013-03-21 株式会社東芝 セラミックス配線基板の製造方法、およびそれを用いた半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580020A (ja) * 1991-09-24 1993-03-30 Hitachi Ltd 炭酸ガスセンサ
TW540116B (en) * 1997-12-26 2003-07-01 Canon Kk Anodizing apparatus and method and porous substrate
JP2010048867A (ja) * 2008-08-19 2010-03-04 Canon Inc 反射型表示装置
US20140342255A1 (en) * 2012-01-10 2014-11-20 The Regents Of The University Of California Microstructured cathode for self-regulated oxygen generation and consumption

Also Published As

Publication number Publication date
WO2024219268A1 (ja) 2024-10-24
TW202446176A (zh) 2024-11-16
JPWO2024219268A1 (https=) 2024-10-24

Similar Documents

Publication Publication Date Title
CN101911232B (zh) 触摸屏传感器
CA2630535C (en) Method and apparatus for using flex circuit technology to create an electrode
US8126530B2 (en) Offset electrode
KR101496494B1 (ko) 이방 도전성 접합 패키지의 제조방법
CN115066085B (zh) 柔性电路板、柔性电路板封装芯片和包括柔性电路板的电子设备
JP4620298B2 (ja) 銀若しくは銀合金配線及びその形成方法並びに表示パネル基板
JP5215305B2 (ja) 電子部品の製造方法及び該方法により製造する電子部品
JP5220766B2 (ja) 実装基板
KR100874743B1 (ko) 프린트 배선 기판, 그 제조 방법 및 반도체 장치
TWI879532B (zh) 基板
US6174606B1 (en) Corrosion and dissolution protection of a conductive silver/polymer composite
TW569656B (en) Method for manufacturing a flexible printed wiring board, and a flexible printed wiring board obtained through the manufacturing method
KR20090031441A (ko) 배선용 적층막 및 배선 회로
JP3050199B2 (ja) 配線端子およびその形成方法
JP6369393B2 (ja) 導電性基板、及び導電性基板の製造方法
JP4590527B2 (ja) 薄膜電極基板の作製方法
JP5489049B2 (ja) 箔状導体及び配線部材並びに配線部材の製造方法
JP2004014888A (ja) プリント配線板の製造方法及びその製造方法で得られたプリント配線板
JP2006108057A (ja) コネクタ接続端子
JPS6117126A (ja) 液晶セル
JP2010129730A (ja) 配線基板及びこれを用いたプローブカード
JP5032791B2 (ja) 電子部品の製造方法
JP2006005166A (ja) 半導体装置の製造方法
JP2006278825A (ja) フレキシブルプリント配線板及びその製造方法
JP2025164389A (ja) 電気化学センサ