TWI877344B - 接著劑組成物、接著劑膜、連接結構體及其製造方法 - Google Patents

接著劑組成物、接著劑膜、連接結構體及其製造方法 Download PDF

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Publication number
TWI877344B
TWI877344B TW110112635A TW110112635A TWI877344B TW I877344 B TWI877344 B TW I877344B TW 110112635 A TW110112635 A TW 110112635A TW 110112635 A TW110112635 A TW 110112635A TW I877344 B TWI877344 B TW I877344B
Authority
TW
Taiwan
Prior art keywords
adhesive
electrode
film
adhesive film
aromatic heterocyclic
Prior art date
Application number
TW110112635A
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English (en)
Chinese (zh)
Other versions
TW202140710A (zh
Inventor
菊地健太
伊澤弘行
立澤貴
福井崇洋
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202140710A publication Critical patent/TW202140710A/zh
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Publication of TWI877344B publication Critical patent/TWI877344B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
TW110112635A 2020-04-10 2021-04-08 接著劑組成物、接著劑膜、連接結構體及其製造方法 TWI877344B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-070801 2020-04-10
JP2020070801 2020-04-10

Publications (2)

Publication Number Publication Date
TW202140710A TW202140710A (zh) 2021-11-01
TWI877344B true TWI877344B (zh) 2025-03-21

Family

ID=78024142

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110112635A TWI877344B (zh) 2020-04-10 2021-04-08 接著劑組成物、接著劑膜、連接結構體及其製造方法

Country Status (5)

Country Link
JP (2) JP7845178B2 (https=)
KR (1) KR102953014B1 (https=)
CN (1) CN115349003B (https=)
TW (1) TWI877344B (https=)
WO (1) WO2021206115A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023165280A (ja) * 2022-05-02 2023-11-15 株式会社レゾナック フィルム状接着剤、及び、回路接続構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200709231A (en) * 2005-08-19 2007-03-01 Cheil Ind Inc Film for anisotropic conductivity and electronic circuits and devices using the film
TW201247815A (en) * 2011-05-17 2012-12-01 Nitto Denko Corp Adhesive sheet for fabrication of semiconductor apparatus
CN110708940A (zh) * 2018-07-09 2020-01-17 信越聚合物株式会社 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷线路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5865936A (en) * 1997-03-28 1999-02-02 National Starch And Chemical Investment Holding Corporation Rapid curing structural acrylic adhesive
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JP4916677B2 (ja) 1999-08-25 2012-04-18 日立化成工業株式会社 配線接続材料及びそれを用いた配線板製造方法
JP4743322B2 (ja) 2007-05-15 2011-08-10 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
JP2010077317A (ja) * 2008-09-26 2010-04-08 Three M Innovative Properties Co 接着剤組成物、接着フィルム及びその使用方法
JP2011100605A (ja) 2009-11-05 2011-05-19 Hitachi Chem Co Ltd 回路接続材料及び、これを用いた回路部材の接続構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200709231A (en) * 2005-08-19 2007-03-01 Cheil Ind Inc Film for anisotropic conductivity and electronic circuits and devices using the film
TW201247815A (en) * 2011-05-17 2012-12-01 Nitto Denko Corp Adhesive sheet for fabrication of semiconductor apparatus
CN110708940A (zh) * 2018-07-09 2020-01-17 信越聚合物株式会社 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷线路板

Also Published As

Publication number Publication date
JP7845178B2 (ja) 2026-04-14
CN115349003B (zh) 2024-02-06
CN115349003A (zh) 2022-11-15
KR20220162734A (ko) 2022-12-08
KR102953014B1 (ko) 2026-04-14
JPWO2021206115A1 (https=) 2021-10-14
TW202140710A (zh) 2021-11-01
JP2026009305A (ja) 2026-01-19
WO2021206115A1 (ja) 2021-10-14

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