JP7845178B2 - 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法 - Google Patents

接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Info

Publication number
JP7845178B2
JP7845178B2 JP2022514103A JP2022514103A JP7845178B2 JP 7845178 B2 JP7845178 B2 JP 7845178B2 JP 2022514103 A JP2022514103 A JP 2022514103A JP 2022514103 A JP2022514103 A JP 2022514103A JP 7845178 B2 JP7845178 B2 JP 7845178B2
Authority
JP
Japan
Prior art keywords
adhesive
adhesive composition
electrode
film
circuit member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022514103A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021206115A1 (https=
Inventor
健太 菊地
弘行 伊澤
貴 立澤
崇洋 福井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021206115A1 publication Critical patent/JPWO2021206115A1/ja
Priority to JP2025185524A priority Critical patent/JP2026009305A/ja
Application granted granted Critical
Publication of JP7845178B2 publication Critical patent/JP7845178B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
JP2022514103A 2020-04-10 2021-04-07 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法 Active JP7845178B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025185524A JP2026009305A (ja) 2020-04-10 2025-11-04 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020070801 2020-04-10
JP2020070801 2020-04-10
PCT/JP2021/014718 WO2021206115A1 (ja) 2020-04-10 2021-04-07 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025185524A Division JP2026009305A (ja) 2020-04-10 2025-11-04 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021206115A1 JPWO2021206115A1 (https=) 2021-10-14
JP7845178B2 true JP7845178B2 (ja) 2026-04-14

Family

ID=78024142

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022514103A Active JP7845178B2 (ja) 2020-04-10 2021-04-07 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法
JP2025185524A Pending JP2026009305A (ja) 2020-04-10 2025-11-04 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025185524A Pending JP2026009305A (ja) 2020-04-10 2025-11-04 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Country Status (5)

Country Link
JP (2) JP7845178B2 (https=)
KR (1) KR102953014B1 (https=)
CN (1) CN115349003B (https=)
TW (1) TWI877344B (https=)
WO (1) WO2021206115A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023165280A (ja) * 2022-05-02 2023-11-15 株式会社レゾナック フィルム状接着剤、及び、回路接続構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322938A (ja) 1999-08-25 2005-11-17 Hitachi Chem Co Ltd 配線接続材料及びそれを用いた配線板製造方法
JP2009508290A (ja) 2005-08-19 2009-02-26 チェイル インダストリーズ インコーポレイテッド 異方性導電フィルムおよびこれを用いた電子回路およびデバイス
JP2012241063A (ja) 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
JP2020009922A (ja) 2018-07-09 2020-01-16 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5865936A (en) * 1997-03-28 1999-02-02 National Starch And Chemical Investment Holding Corporation Rapid curing structural acrylic adhesive
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JP4743322B2 (ja) 2007-05-15 2011-08-10 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
JP2010077317A (ja) * 2008-09-26 2010-04-08 Three M Innovative Properties Co 接着剤組成物、接着フィルム及びその使用方法
JP2011100605A (ja) 2009-11-05 2011-05-19 Hitachi Chem Co Ltd 回路接続材料及び、これを用いた回路部材の接続構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322938A (ja) 1999-08-25 2005-11-17 Hitachi Chem Co Ltd 配線接続材料及びそれを用いた配線板製造方法
JP2009508290A (ja) 2005-08-19 2009-02-26 チェイル インダストリーズ インコーポレイテッド 異方性導電フィルムおよびこれを用いた電子回路およびデバイス
JP2012241063A (ja) 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
JP2020009922A (ja) 2018-07-09 2020-01-16 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板

Also Published As

Publication number Publication date
CN115349003B (zh) 2024-02-06
CN115349003A (zh) 2022-11-15
KR20220162734A (ko) 2022-12-08
KR102953014B1 (ko) 2026-04-14
JPWO2021206115A1 (https=) 2021-10-14
TW202140710A (zh) 2021-11-01
JP2026009305A (ja) 2026-01-19
TWI877344B (zh) 2025-03-21
WO2021206115A1 (ja) 2021-10-14

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