KR102953014B1 - 접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법 - Google Patents

접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법

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Publication number
KR102953014B1
KR102953014B1 KR1020227037361A KR20227037361A KR102953014B1 KR 102953014 B1 KR102953014 B1 KR 102953014B1 KR 1020227037361 A KR1020227037361 A KR 1020227037361A KR 20227037361 A KR20227037361 A KR 20227037361A KR 102953014 B1 KR102953014 B1 KR 102953014B1
Authority
KR
South Korea
Prior art keywords
adhesive composition
adhesive
electrode
film
aromatic heterocyclic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227037361A
Other languages
English (en)
Korean (ko)
Other versions
KR20220162734A (ko
Inventor
겐타 기쿠치
히로유키 이자와
다카시 다츠자와
다카히로 후쿠이
Original Assignee
가부시끼가이샤 레조낙
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Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20220162734A publication Critical patent/KR20220162734A/ko
Application granted granted Critical
Publication of KR102953014B1 publication Critical patent/KR102953014B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
KR1020227037361A 2020-04-10 2021-04-07 접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법 Active KR102953014B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-070801 2020-04-10
JP2020070801 2020-04-10
PCT/JP2021/014718 WO2021206115A1 (ja) 2020-04-10 2021-04-07 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
KR20220162734A KR20220162734A (ko) 2022-12-08
KR102953014B1 true KR102953014B1 (ko) 2026-04-14

Family

ID=78024142

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227037361A Active KR102953014B1 (ko) 2020-04-10 2021-04-07 접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법

Country Status (5)

Country Link
JP (2) JP7845178B2 (https=)
KR (1) KR102953014B1 (https=)
CN (1) CN115349003B (https=)
TW (1) TWI877344B (https=)
WO (1) WO2021206115A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023165280A (ja) * 2022-05-02 2023-11-15 株式会社レゾナック フィルム状接着剤、及び、回路接続構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009508290A (ja) * 2005-08-19 2009-02-26 チェイル インダストリーズ インコーポレイテッド 異方性導電フィルムおよびこれを用いた電子回路およびデバイス
JP2020009922A (ja) * 2018-07-09 2020-01-16 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5865936A (en) * 1997-03-28 1999-02-02 National Starch And Chemical Investment Holding Corporation Rapid curing structural acrylic adhesive
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JP4916677B2 (ja) 1999-08-25 2012-04-18 日立化成工業株式会社 配線接続材料及びそれを用いた配線板製造方法
JP4743322B2 (ja) 2007-05-15 2011-08-10 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
JP2010077317A (ja) * 2008-09-26 2010-04-08 Three M Innovative Properties Co 接着剤組成物、接着フィルム及びその使用方法
JP2011100605A (ja) 2009-11-05 2011-05-19 Hitachi Chem Co Ltd 回路接続材料及び、これを用いた回路部材の接続構造
JP2012241063A (ja) 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009508290A (ja) * 2005-08-19 2009-02-26 チェイル インダストリーズ インコーポレイテッド 異方性導電フィルムおよびこれを用いた電子回路およびデバイス
JP2020009922A (ja) * 2018-07-09 2020-01-16 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板

Also Published As

Publication number Publication date
JP7845178B2 (ja) 2026-04-14
CN115349003B (zh) 2024-02-06
CN115349003A (zh) 2022-11-15
KR20220162734A (ko) 2022-12-08
JPWO2021206115A1 (https=) 2021-10-14
TW202140710A (zh) 2021-11-01
JP2026009305A (ja) 2026-01-19
TWI877344B (zh) 2025-03-21
WO2021206115A1 (ja) 2021-10-14

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