TWI871505B - 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 - Google Patents

低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 Download PDF

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Publication number
TWI871505B
TWI871505B TW111110831A TW111110831A TWI871505B TW I871505 B TWI871505 B TW I871505B TW 111110831 A TW111110831 A TW 111110831A TW 111110831 A TW111110831 A TW 111110831A TW I871505 B TWI871505 B TW I871505B
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TW
Taiwan
Prior art keywords
low dielectric
resin composition
group
dielectric material
aromatic
Prior art date
Application number
TW111110831A
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English (en)
Chinese (zh)
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TW202306771A (zh
Inventor
大石好行
芝﨑祐二
塚本匡
Original Assignee
國立大學法人岩手大學
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Publication of TW202306771A publication Critical patent/TW202306771A/zh
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Publication of TWI871505B publication Critical patent/TWI871505B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111110831A 2021-03-24 2022-03-23 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 TWI871505B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-050694 2021-03-24
JP2021050694 2021-03-24

Publications (2)

Publication Number Publication Date
TW202306771A TW202306771A (zh) 2023-02-16
TWI871505B true TWI871505B (zh) 2025-02-01

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TW111110831A TWI871505B (zh) 2021-03-24 2022-03-23 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法

Country Status (3)

Country Link
JP (1) JPWO2022202894A1 (https=)
TW (1) TWI871505B (https=)
WO (1) WO2022202894A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201632563A (zh) * 2015-03-13 2016-09-16 新日鐵住金化學股份有限公司 含有噁唑烷酮環的環氧樹脂、其製造方法、環氧樹脂組成物、其固化物及其應用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116286B2 (ja) * 1987-05-02 1995-12-13 住友化学工業株式会社 トリアジン環含有樹脂
JPH06184300A (ja) * 1992-12-17 1994-07-05 Idemitsu Kosan Co Ltd 芳香族ポリエーテル及びその製造方法並びにトリアジン化合物
JP3205848B2 (ja) * 1993-10-21 2001-09-04 科学技術振興事業団 ポリエ−テル樹脂及びその製造方法
JP2001503077A (ja) * 1996-09-16 2001-03-06 バイエル・アクチエンゲゼルシヤフト トリアジン重合体そして電界発光装置におけるそれの使用
JPWO2011155528A1 (ja) * 2010-06-11 2013-08-01 Jsr株式会社 スルホン酸基を有する芳香族系共重合体、ならびにその用途
CN106589348B (zh) * 2016-11-03 2019-01-08 大连理工大学 主链含双苯基芴与三芳基均三嗪结构的聚芳醚及其制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201632563A (zh) * 2015-03-13 2016-09-16 新日鐵住金化學股份有限公司 含有噁唑烷酮環的環氧樹脂、其製造方法、環氧樹脂組成物、其固化物及其應用

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Publication number Publication date
TW202306771A (zh) 2023-02-16
JPWO2022202894A1 (https=) 2022-09-29
WO2022202894A1 (ja) 2022-09-29

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