TWI871480B - 導電組合物、貼片材料、壓力燒結貼片材料和電子零件 - Google Patents

導電組合物、貼片材料、壓力燒結貼片材料和電子零件 Download PDF

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Publication number
TWI871480B
TWI871480B TW110124112A TW110124112A TWI871480B TW I871480 B TWI871480 B TW I871480B TW 110124112 A TW110124112 A TW 110124112A TW 110124112 A TW110124112 A TW 110124112A TW I871480 B TWI871480 B TW I871480B
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TW
Taiwan
Prior art keywords
silver
silver particles
conductive composition
acid
thermosetting resin
Prior art date
Application number
TW110124112A
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English (en)
Chinese (zh)
Other versions
TW202207245A (zh
Inventor
佐佐木幸司
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日商納美仕有限公司
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Publication of TW202207245A publication Critical patent/TW202207245A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Die Bonding (AREA)
TW110124112A 2020-08-04 2021-06-30 導電組合物、貼片材料、壓力燒結貼片材料和電子零件 TWI871480B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-132286 2020-08-04
JP2020132286 2020-08-04

Publications (2)

Publication Number Publication Date
TW202207245A TW202207245A (zh) 2022-02-16
TWI871480B true TWI871480B (zh) 2025-02-01

Family

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TW110124112A TWI871480B (zh) 2020-08-04 2021-06-30 導電組合物、貼片材料、壓力燒結貼片材料和電子零件

Country Status (7)

Country Link
US (1) US20240047406A1 (https=)
EP (1) EP4194495A4 (https=)
JP (1) JP7619656B2 (https=)
KR (1) KR102929924B1 (https=)
CN (1) CN116113664A (https=)
TW (1) TWI871480B (https=)
WO (1) WO2022030089A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230159849A (ko) * 2021-03-23 2023-11-22 스미또모 베이크라이트 가부시키가이샤 도전성 수지 조성물, 고열전도성 재료 및 반도체 장치
WO2023145668A1 (ja) * 2022-01-28 2023-08-03 ナミックス株式会社 導電性組成物、導電性ペースト、硬化物及び太陽電池

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015004016A (ja) * 2013-06-21 2015-01-08 日本化薬株式会社 導電性材料
TW201531528A (zh) * 2013-12-27 2015-08-16 Nippon Kayaku Kk 導電性糊及導電性膜
CN105017508A (zh) * 2015-08-21 2015-11-04 广州聚合电子材料有限公司 抗击穿耐腐蚀的环氧树脂体系及其制备方法和应用
TW201718690A (zh) * 2015-08-18 2017-06-01 日本化藥股份有限公司 環氧樹脂組合物及其接著膜

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JPS601221A (ja) * 1983-06-17 1985-01-07 Sumitomo Bakelite Co Ltd 導電性樹脂ペ−スト
JPH0649817B2 (ja) * 1986-07-09 1994-06-29 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
US4829141A (en) * 1987-07-31 1989-05-09 Shell Oil Company Epoxy fusion catalyst and process
JP4487143B2 (ja) 2004-12-27 2010-06-23 ナミックス株式会社 銀微粒子及びその製造方法並びに導電ペースト及びその製造方法
JP4470193B2 (ja) 2008-05-01 2010-06-02 ニホンハンダ株式会社 加熱焼結性銀粒子の製造方法、固形状銀の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法
JP4685145B2 (ja) 2008-09-10 2011-05-18 ニホンハンダ株式会社 金属製部材接合体の製造方法および金属製部材接合体
EP3163601B1 (en) 2009-01-23 2020-03-11 Nichia Corporation Method of producing a semiconductor device by directly bonding silver on a surface of a semiconductor element with silver oxide on a surface of a base
JP5673536B2 (ja) * 2009-07-21 2015-02-18 日亜化学工業株式会社 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、および発光装置
JP5426413B2 (ja) 2010-01-28 2014-02-26 ハリマ化成株式会社 銀ナノ粒子の製造方法
JP5859949B2 (ja) * 2012-09-27 2016-02-16 三ツ星ベルト株式会社 導電性組成物
JP6310799B2 (ja) * 2014-07-22 2018-04-11 京セラ株式会社 熱硬化性樹脂組成物、半導体装置、電気・電子部品及びプレート型銀微粒子の製造方法
JP6282616B2 (ja) 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
CN106795375B (zh) * 2014-10-24 2020-08-21 纳美仕股份有限公司 导电性组合物和使用该导电性组合物的电子部件
WO2016125737A1 (ja) * 2015-02-04 2016-08-11 ナミックス株式会社 熱伝導性ペースト及びその製造方法
JP2016160413A (ja) * 2015-03-05 2016-09-05 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
WO2017169534A1 (ja) 2016-03-30 2017-10-05 株式会社大阪ソーダ 導電性接着剤
KR102305794B1 (ko) 2016-05-26 2021-09-28 가부시키가이샤 오사카소다 도전성 접착체

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015004016A (ja) * 2013-06-21 2015-01-08 日本化薬株式会社 導電性材料
TW201531528A (zh) * 2013-12-27 2015-08-16 Nippon Kayaku Kk 導電性糊及導電性膜
TW201718690A (zh) * 2015-08-18 2017-06-01 日本化藥股份有限公司 環氧樹脂組合物及其接著膜
CN105017508A (zh) * 2015-08-21 2015-11-04 广州聚合电子材料有限公司 抗击穿耐腐蚀的环氧树脂体系及其制备方法和应用

Also Published As

Publication number Publication date
US20240047406A1 (en) 2024-02-08
TW202207245A (zh) 2022-02-16
EP4194495A1 (en) 2023-06-14
JP7619656B2 (ja) 2025-01-22
KR102929924B1 (ko) 2026-02-23
JPWO2022030089A1 (https=) 2022-02-10
WO2022030089A1 (ja) 2022-02-10
EP4194495A4 (en) 2024-09-25
CN116113664A (zh) 2023-05-12
KR20230048009A (ko) 2023-04-10

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