CN116113664A - 导电性组合物、晶片连接材料、加压烧结型晶片连接材料以及电子部件 - Google Patents

导电性组合物、晶片连接材料、加压烧结型晶片连接材料以及电子部件 Download PDF

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Publication number
CN116113664A
CN116113664A CN202180057640.4A CN202180057640A CN116113664A CN 116113664 A CN116113664 A CN 116113664A CN 202180057640 A CN202180057640 A CN 202180057640A CN 116113664 A CN116113664 A CN 116113664A
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CN
China
Prior art keywords
silver
conductive composition
silver particles
thermosetting resin
acid
Prior art date
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Pending
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CN202180057640.4A
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English (en)
Chinese (zh)
Inventor
佐佐木幸司
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Namics Corp
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Namics Corp
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Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN116113664A publication Critical patent/CN116113664A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Die Bonding (AREA)
CN202180057640.4A 2020-08-04 2021-06-02 导电性组合物、晶片连接材料、加压烧结型晶片连接材料以及电子部件 Pending CN116113664A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020132286 2020-08-04
JP2020-132286 2020-08-04
PCT/JP2021/020998 WO2022030089A1 (ja) 2020-08-04 2021-06-02 導電性組成物、ダイアタッチ材、加圧焼結型ダイアタッチ材及び電子部品

Publications (1)

Publication Number Publication Date
CN116113664A true CN116113664A (zh) 2023-05-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180057640.4A Pending CN116113664A (zh) 2020-08-04 2021-06-02 导电性组合物、晶片连接材料、加压烧结型晶片连接材料以及电子部件

Country Status (7)

Country Link
US (1) US20240047406A1 (https=)
EP (1) EP4194495A4 (https=)
JP (1) JP7619656B2 (https=)
KR (1) KR102929924B1 (https=)
CN (1) CN116113664A (https=)
TW (1) TWI871480B (https=)
WO (1) WO2022030089A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022202505A1 (ja) * 2021-03-23 2022-09-29 住友ベークライト株式会社 導電性樹脂組成物、高熱伝導性材料および半導体装置
WO2023145668A1 (ja) * 2022-01-28 2023-08-03 ナミックス株式会社 導電性組成物、導電性ペースト、硬化物及び太陽電池

Citations (5)

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US4829141A (en) * 1987-07-31 1989-05-09 Shell Oil Company Epoxy fusion catalyst and process
CN102473485A (zh) * 2009-07-21 2012-05-23 日亚化学工业株式会社 导电性材料的制造方法、通过该方法得到的导电性材料、包含该导电性材料的电子设备以及发光装置
CN104684956A (zh) * 2012-09-27 2015-06-03 三之星机带株式会社 导电性组合物及导电性成形体
CN106795375A (zh) * 2014-10-24 2017-05-31 纳美仕股份有限公司 导电性组合物和使用该导电性组合物的电子部件
US20180002576A1 (en) * 2015-02-04 2018-01-04 Namics Corporation Heat conductive paste and method for producing the same

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JPS601221A (ja) * 1983-06-17 1985-01-07 Sumitomo Bakelite Co Ltd 導電性樹脂ペ−スト
JPH0649817B2 (ja) * 1986-07-09 1994-06-29 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
JP4487143B2 (ja) 2004-12-27 2010-06-23 ナミックス株式会社 銀微粒子及びその製造方法並びに導電ペースト及びその製造方法
JP4470193B2 (ja) 2008-05-01 2010-06-02 ニホンハンダ株式会社 加熱焼結性銀粒子の製造方法、固形状銀の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法
JP4685145B2 (ja) 2008-09-10 2011-05-18 ニホンハンダ株式会社 金属製部材接合体の製造方法および金属製部材接合体
EP2390903B1 (en) 2009-01-23 2016-11-02 Nichia Corporation Method of producing a semiconductor device by bonding silver oxide or silver on a surface of a semiconductor element with silver oxide or silver on a surface of a lead frame or of a wiring substrate, at least one of said surfaces being provided with silver oxide
JP5426413B2 (ja) 2010-01-28 2014-02-26 ハリマ化成株式会社 銀ナノ粒子の製造方法
JP6132400B2 (ja) * 2013-06-21 2017-05-24 日本化薬株式会社 導電性材料
TW201531528A (zh) * 2013-12-27 2015-08-16 Nippon Kayaku Kk 導電性糊及導電性膜
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US4829141A (en) * 1987-07-31 1989-05-09 Shell Oil Company Epoxy fusion catalyst and process
CN102473485A (zh) * 2009-07-21 2012-05-23 日亚化学工业株式会社 导电性材料的制造方法、通过该方法得到的导电性材料、包含该导电性材料的电子设备以及发光装置
CN104684956A (zh) * 2012-09-27 2015-06-03 三之星机带株式会社 导电性组合物及导电性成形体
CN106795375A (zh) * 2014-10-24 2017-05-31 纳美仕股份有限公司 导电性组合物和使用该导电性组合物的电子部件
US20170243849A1 (en) * 2014-10-24 2017-08-24 Namics Corporation Conductive composition and electronic parts using the same
US20180002576A1 (en) * 2015-02-04 2018-01-04 Namics Corporation Heat conductive paste and method for producing the same

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Publication number Publication date
JPWO2022030089A1 (https=) 2022-02-10
TW202207245A (zh) 2022-02-16
TWI871480B (zh) 2025-02-01
EP4194495A1 (en) 2023-06-14
EP4194495A4 (en) 2024-09-25
JP7619656B2 (ja) 2025-01-22
WO2022030089A1 (ja) 2022-02-10
KR20230048009A (ko) 2023-04-10
US20240047406A1 (en) 2024-02-08
KR102929924B1 (ko) 2026-02-23

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