TWI864366B - 含有酚性羥基之樹脂及其製造方法 - Google Patents

含有酚性羥基之樹脂及其製造方法 Download PDF

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Publication number
TWI864366B
TWI864366B TW111105946A TW111105946A TWI864366B TW I864366 B TWI864366 B TW I864366B TW 111105946 A TW111105946 A TW 111105946A TW 111105946 A TW111105946 A TW 111105946A TW I864366 B TWI864366 B TW I864366B
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TW
Taiwan
Prior art keywords
resin
group
phenolic hydroxyl
aliphatic hydrocarbon
resist
Prior art date
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TW111105946A
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English (en)
Chinese (zh)
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TW202244094A (zh
Inventor
長田裕仁
今田知之
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日商Ｄｉｃ股份有限公司
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Publication of TW202244094A publication Critical patent/TW202244094A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Materials For Photolithography (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW111105946A 2021-05-14 2022-02-18 含有酚性羥基之樹脂及其製造方法 TWI864366B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021082506 2021-05-14
JP2021-082506 2021-05-14

Publications (2)

Publication Number Publication Date
TW202244094A TW202244094A (zh) 2022-11-16
TWI864366B true TWI864366B (zh) 2024-12-01

Family

ID=84028213

Family Applications (1)

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TW111105946A TWI864366B (zh) 2021-05-14 2022-02-18 含有酚性羥基之樹脂及其製造方法

Country Status (5)

Country Link
JP (1) JP7380951B2 (https=)
KR (1) KR102804147B1 (https=)
CN (1) CN117321109A (https=)
TW (1) TWI864366B (https=)
WO (1) WO2022239597A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03503781A (ja) * 1989-01-25 1991-08-22 セカ　エス．アー． フェノール／重質アルデヒド型の新規なノボラック
CN102741306A (zh) * 2009-10-20 2012-10-17 罗地亚经营管理公司 包含至少一种酚类化合物的改性聚酰胺组合物
JP2018532027A (ja) * 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2231860A (en) * 1937-09-27 1941-02-11 Monsanto Chemicals Phenol-butyraldehyde-formaldehyde resins
JP2559245B2 (ja) * 1987-10-14 1996-12-04 富士写真フイルム株式会社 ハロゲン化銀写真感光材料
FR2665165B1 (fr) * 1990-07-25 1995-02-24 Ceca Sa Nouvelles resines novolaques de para-alkylphenols. leur procede de preparation.
JP3710717B2 (ja) 2001-03-06 2005-10-26 東京応化工業株式会社 厚膜用ポジ型ホトレジスト組成物、ホトレジスト膜およびこれを用いたバンプ形成方法
US7074861B2 (en) * 2003-02-18 2006-07-11 Indspec Chemical Corporation Modified resorcinol resins and applications thereof
JP2008088197A (ja) 2006-09-29 2008-04-17 Sumitomo Bakelite Co Ltd フォトレジスト用フェノール樹脂とその製造方法、及びフォトレジスト用樹脂組成物
CN107531858B (zh) 2015-05-20 2020-05-08 Dic株式会社 酚醛清漆型含酚性羟基树脂以及抗蚀膜
WO2017029935A1 (ja) 2015-08-18 2017-02-23 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
WO2020153048A1 (ja) * 2019-01-21 2020-07-30 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03503781A (ja) * 1989-01-25 1991-08-22 セカ　エス．アー． フェノール／重質アルデヒド型の新規なノボラック
CN102741306A (zh) * 2009-10-20 2012-10-17 罗地亚经营管理公司 包含至少一种酚类化合物的改性聚酰胺组合物
JP2018532027A (ja) * 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法

Also Published As

Publication number Publication date
WO2022239597A1 (ja) 2022-11-17
TW202244094A (zh) 2022-11-16
JP7380951B2 (ja) 2023-11-15
KR102804147B1 (ko) 2025-05-09
CN117321109A (zh) 2023-12-29
KR20230156418A (ko) 2023-11-14
JPWO2022239597A1 (https=) 2022-11-17

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