TWI864140B - 配線電路基板及其製造方法 - Google Patents

配線電路基板及其製造方法 Download PDF

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Publication number
TWI864140B
TWI864140B TW109135621A TW109135621A TWI864140B TW I864140 B TWI864140 B TW I864140B TW 109135621 A TW109135621 A TW 109135621A TW 109135621 A TW109135621 A TW 109135621A TW I864140 B TWI864140 B TW I864140B
Authority
TW
Taiwan
Prior art keywords
wiring
terminal
insulating layer
thickness direction
layer
Prior art date
Application number
TW109135621A
Other languages
English (en)
Chinese (zh)
Other versions
TW202133284A (zh
Inventor
福島理人
高倉隼人
柴田直樹
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202133284A publication Critical patent/TW202133284A/zh
Application granted granted Critical
Publication of TWI864140B publication Critical patent/TWI864140B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW109135621A 2019-11-12 2020-10-15 配線電路基板及其製造方法 TWI864140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019204942A JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法
JP2019-204942 2019-11-12

Publications (2)

Publication Number Publication Date
TW202133284A TW202133284A (zh) 2021-09-01
TWI864140B true TWI864140B (zh) 2024-12-01

Family

ID=75898316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109135621A TWI864140B (zh) 2019-11-12 2020-10-15 配線電路基板及其製造方法

Country Status (6)

Country Link
US (1) US12279367B2 (https=)
JP (2) JP7657543B2 (https=)
KR (1) KR102871731B1 (https=)
CN (1) CN114651534A (https=)
TW (1) TWI864140B (https=)
WO (1) WO2021095421A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082302A (ja) * 2009-10-06 2011-04-21 Dainippon Printing Co Ltd 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP2015158963A (ja) * 2014-02-25 2015-09-03 日東電工株式会社 配線回路基板およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129490A (ja) 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5581644B2 (ja) * 2009-10-06 2014-09-03 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5652115B2 (ja) 2010-10-20 2015-01-14 大日本印刷株式会社 配線付フレキシャー基板、配線付フレキシャー基板の製造方法、配線付フレキシャー、素子付配線付フレキシャーおよびハードディスクドライブ
JP5712717B2 (ja) * 2011-03-18 2015-05-07 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6466680B2 (ja) * 2014-10-14 2019-02-06 日東電工株式会社 回路付サスペンション基板
CN108464061A (zh) 2016-01-12 2018-08-28 名幸电子有限公司 元件内置基板及元件内置基板的制造方法
KR102508462B1 (ko) * 2016-08-30 2023-03-09 삼성디스플레이 주식회사 표시 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082302A (ja) * 2009-10-06 2011-04-21 Dainippon Printing Co Ltd 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP2015158963A (ja) * 2014-02-25 2015-09-03 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
JP2024128157A (ja) 2024-09-20
US12279367B2 (en) 2025-04-15
US20220386459A1 (en) 2022-12-01
KR20220098735A (ko) 2022-07-12
JP7657543B2 (ja) 2025-04-07
TW202133284A (zh) 2021-09-01
JP2021077806A (ja) 2021-05-20
WO2021095421A1 (ja) 2021-05-20
CN114651534A (zh) 2022-06-21
KR102871731B1 (ko) 2025-10-15

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