KR102871731B1 - 배선 회로 기판 및 그 제조 방법 - Google Patents

배선 회로 기판 및 그 제조 방법

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Publication number
KR102871731B1
KR102871731B1 KR1020227015155A KR20227015155A KR102871731B1 KR 102871731 B1 KR102871731 B1 KR 102871731B1 KR 1020227015155 A KR1020227015155 A KR 1020227015155A KR 20227015155 A KR20227015155 A KR 20227015155A KR 102871731 B1 KR102871731 B1 KR 102871731B1
Authority
KR
South Korea
Prior art keywords
wiring
terminal
insulating layer
thickness direction
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227015155A
Other languages
English (en)
Korean (ko)
Other versions
KR20220098735A (ko
Inventor
리히토 후쿠시마
하야토 다카쿠라
나오키 시바타
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20220098735A publication Critical patent/KR20220098735A/ko
Application granted granted Critical
Publication of KR102871731B1 publication Critical patent/KR102871731B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020227015155A 2019-11-12 2020-10-13 배선 회로 기판 및 그 제조 방법 Active KR102871731B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019204942A JP7657543B2 (ja) 2019-11-12 2019-11-12 配線回路基板およびその製造方法
JPJP-P-2019-204942 2019-11-12
PCT/JP2020/038643 WO2021095421A1 (ja) 2019-11-12 2020-10-13 配線回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
KR20220098735A KR20220098735A (ko) 2022-07-12
KR102871731B1 true KR102871731B1 (ko) 2025-10-15

Family

ID=75898316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227015155A Active KR102871731B1 (ko) 2019-11-12 2020-10-13 배선 회로 기판 및 그 제조 방법

Country Status (6)

Country Link
US (1) US12279367B2 (https=)
JP (2) JP7657543B2 (https=)
KR (1) KR102871731B1 (https=)
CN (1) CN114651534A (https=)
TW (1) TWI864140B (https=)
WO (1) WO2021095421A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150245472A1 (en) * 2014-02-25 2015-08-27 Nitto Denko Corporation Wired circuit board and producing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129490A (ja) 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5581644B2 (ja) * 2009-10-06 2014-09-03 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5699311B2 (ja) * 2009-10-06 2015-04-08 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
JP5652115B2 (ja) 2010-10-20 2015-01-14 大日本印刷株式会社 配線付フレキシャー基板、配線付フレキシャー基板の製造方法、配線付フレキシャー、素子付配線付フレキシャーおよびハードディスクドライブ
JP5712717B2 (ja) * 2011-03-18 2015-05-07 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6466680B2 (ja) * 2014-10-14 2019-02-06 日東電工株式会社 回路付サスペンション基板
CN108464061A (zh) 2016-01-12 2018-08-28 名幸电子有限公司 元件内置基板及元件内置基板的制造方法
KR102508462B1 (ko) * 2016-08-30 2023-03-09 삼성디스플레이 주식회사 표시 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150245472A1 (en) * 2014-02-25 2015-08-27 Nitto Denko Corporation Wired circuit board and producing method thereof

Also Published As

Publication number Publication date
TWI864140B (zh) 2024-12-01
JP2024128157A (ja) 2024-09-20
US12279367B2 (en) 2025-04-15
US20220386459A1 (en) 2022-12-01
KR20220098735A (ko) 2022-07-12
JP7657543B2 (ja) 2025-04-07
TW202133284A (zh) 2021-09-01
JP2021077806A (ja) 2021-05-20
WO2021095421A1 (ja) 2021-05-20
CN114651534A (zh) 2022-06-21

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