TWI862897B - 異向性導電膜及連接構造體 - Google Patents

異向性導電膜及連接構造體 Download PDF

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Publication number
TWI862897B
TWI862897B TW111104942A TW111104942A TWI862897B TW I862897 B TWI862897 B TW I862897B TW 111104942 A TW111104942 A TW 111104942A TW 111104942 A TW111104942 A TW 111104942A TW I862897 B TWI862897 B TW I862897B
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TW
Taiwan
Prior art keywords
conductive particles
conductive
anisotropic conductive
conductive film
lattice point
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TW111104942A
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English (en)
Chinese (zh)
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TW202219987A (zh
Inventor
阿久津恭志
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
TW111104942A 2014-11-17 2015-11-17 異向性導電膜及連接構造體 TWI862897B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2014-232934 2014-11-17
JP2014232934 2014-11-17

Publications (2)

Publication Number Publication Date
TW202219987A TW202219987A (zh) 2022-05-16
TWI862897B true TWI862897B (zh) 2024-11-21

Family

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Family Applications (5)

Application Number Title Priority Date Filing Date
TW111104942A TWI862897B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW104137995A TWI732746B (zh) 2014-11-17 2015-11-17 異向性導電膜之製造方法
TW110121248A TWI785642B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW104137995A TWI732746B (zh) 2014-11-17 2015-11-17 異向性導電膜之製造方法
TW110121248A TWI785642B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Country Status (6)

Country Link
US (4) US10026709B2 (https=)
JP (3) JP6746898B2 (https=)
KR (3) KR102677632B1 (https=)
CN (5) CN111029875B (https=)
TW (5) TWI862897B (https=)
WO (1) WO2016080379A1 (https=)

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JP6169914B2 (ja) 2012-08-01 2017-07-26 デクセリアルズ株式会社 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体
KR101843226B1 (ko) * 2012-08-29 2018-03-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
TWI824740B (zh) * 2014-10-28 2023-12-01 日商迪睿合股份有限公司 異向性導電膜、連接構造體、及連接構造體之製造方法
TWI862897B (zh) * 2014-11-17 2024-11-21 日商迪睿合股份有限公司 異向性導電膜及連接構造體
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
WO2017191779A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
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TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
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JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
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KR102362816B1 (ko) 2022-02-15
TW202312190A (zh) 2023-03-16
JP7440789B2 (ja) 2024-02-29
US10304796B2 (en) 2019-05-28
CN107078420A (zh) 2017-08-18
CN111029875A (zh) 2020-04-17
CN112421262A (zh) 2021-02-26
TW202137244A (zh) 2021-10-01
JP2016103476A (ja) 2016-06-02
JP6746898B2 (ja) 2020-08-26
US12087722B2 (en) 2024-09-10
TWI732746B (zh) 2021-07-11
CN114512832A (zh) 2022-05-17
KR102677632B1 (ko) 2024-06-21
CN111029875B (zh) 2022-05-10
US20190237426A1 (en) 2019-08-01
CN107078420B (zh) 2022-04-08
KR20220025194A (ko) 2022-03-03
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