CN111029875B - 各向异性导电膜、连接结构体及其制造方法 - Google Patents

各向异性导电膜、连接结构体及其制造方法 Download PDF

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Publication number
CN111029875B
CN111029875B CN201911284496.9A CN201911284496A CN111029875B CN 111029875 B CN111029875 B CN 111029875B CN 201911284496 A CN201911284496 A CN 201911284496A CN 111029875 B CN111029875 B CN 111029875B
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conductive particles
conductive
anisotropic conductive
conductive film
particle group
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CN111029875A (zh
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阿久津恭志
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
CN201911284496.9A 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法 Active CN111029875B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-232934 2014-11-17
JP2014232934 2014-11-17
CN201580058276.8A CN107078420B (zh) 2014-11-17 2015-11-17 各向异性导电膜
PCT/JP2015/082221 WO2016080379A1 (ja) 2014-11-17 2015-11-17 異方性導電フィルム

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CN201580058276.8A Division CN107078420B (zh) 2014-11-17 2015-11-17 各向异性导电膜

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CN111029875A CN111029875A (zh) 2020-04-17
CN111029875B true CN111029875B (zh) 2022-05-10

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CN201911284496.9A Active CN111029875B (zh) 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法
CN201580058276.8A Active CN107078420B (zh) 2014-11-17 2015-11-17 各向异性导电膜
CN202210283888.9A Active CN114512832B (zh) 2014-11-17 2015-11-17 各向异性导电膜及其制造方法、连接结构体
CN202011324120.9A Active CN112421262B (zh) 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法
CN202011324300.7A Active CN112421263B (zh) 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法

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CN201580058276.8A Active CN107078420B (zh) 2014-11-17 2015-11-17 各向异性导电膜
CN202210283888.9A Active CN114512832B (zh) 2014-11-17 2015-11-17 各向异性导电膜及其制造方法、连接结构体
CN202011324120.9A Active CN112421262B (zh) 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法
CN202011324300.7A Active CN112421263B (zh) 2014-11-17 2015-11-17 各向异性导电膜、连接结构体及其制造方法

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US (4) US10026709B2 (https=)
JP (3) JP6746898B2 (https=)
KR (3) KR102677632B1 (https=)
CN (5) CN111029875B (https=)
TW (5) TWI862897B (https=)
WO (1) WO2016080379A1 (https=)

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TWI824740B (zh) * 2014-10-28 2023-12-01 日商迪睿合股份有限公司 異向性導電膜、連接構造體、及連接構造體之製造方法
TWI862897B (zh) * 2014-11-17 2024-11-21 日商迪睿合股份有限公司 異向性導電膜及連接構造體
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
WO2017191779A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
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TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
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JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
JP2024146277A (ja) 2023-03-31 2024-10-15 デクセリアルズ株式会社 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
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JP2003286457A (ja) * 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

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