TWI861471B - 用於移送基板的方法及真空機器人裝置，以及包括其的電子元件處理系統 - Google Patents

用於移送基板的方法及真空機器人裝置，以及包括其的電子元件處理系統 Download PDF

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Publication number
TWI861471B
TWI861471B TW111106360A TW111106360A TWI861471B TW I861471 B TWI861471 B TW I861471B TW 111106360 A TW111106360 A TW 111106360A TW 111106360 A TW111106360 A TW 111106360A TW I861471 B TWI861471 B TW I861471B
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TW
Taiwan
Prior art keywords
end effector
rotation axis
forearm
upper arm
lower arm
Prior art date
Application number
TW111106360A
Other languages
English (en)
Chinese (zh)
Other versions
TW202241659A (zh
Inventor
拉杰庫瑪 薩努
傑佛瑞Ｃ 休根斯
卡魯帕薩米 穆杜卡瑪奇
Original Assignee
美商應用材料股份有限公司
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Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202241659A publication Critical patent/TW202241659A/zh
Application granted granted Critical
Publication of TWI861471B publication Critical patent/TWI861471B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW111106360A 2021-03-01 2022-02-22 用於移送基板的方法及真空機器人裝置，以及包括其的電子元件處理系統 TWI861471B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/188,374 2021-03-01
US17/188,374 US11358809B1 (en) 2021-03-01 2021-03-01 Vacuum robot apparatus for variable pitch access

Publications (2)

Publication Number Publication Date
TW202241659A TW202241659A (zh) 2022-11-01
TWI861471B true TWI861471B (zh) 2024-11-11

Family

ID=81944143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106360A TWI861471B (zh) 2021-03-01 2022-02-22 用於移送基板的方法及真空機器人裝置，以及包括其的電子元件處理系統

Country Status (6)

Country Link
US (2) US11358809B1 (enExample)
JP (1) JP7682288B2 (enExample)
KR (1) KR102834294B1 (enExample)
CN (1) CN116940445A (enExample)
TW (1) TWI861471B (enExample)
WO (1) WO2022186968A1 (enExample)

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* Cited by examiner, † Cited by third party
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KR102833850B1 (ko) * 2020-03-24 2025-07-14 주식회사 원익아이피에스 이송로봇 및 이를 포함하는 기판처리시스템
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US12226896B2 (en) 2021-10-22 2025-02-18 Applied Materials, Inc. Operations of robot apparatuses within rectangular mainframes
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置

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CN201913647U (zh) * 2010-12-21 2011-08-03 沈阳新松机器人自动化股份有限公司 机器人手臂机构
US8888435B2 (en) * 2010-09-24 2014-11-18 Nidec Sankyo Corporation Industrial robot with overlapping first hand and second hand during time of linear transport

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US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
KR20080004118A (ko) * 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
JP4979530B2 (ja) * 2007-09-28 2012-07-18 日本電産サンキョー株式会社 産業用ロボット
KR102359364B1 (ko) * 2012-02-10 2022-02-07 브룩스 오토메이션 인코퍼레이티드 기판 프로세싱 장치
CN104380452B (zh) * 2012-04-12 2016-10-19 应用材料公司 具有独立能旋转机身中段的机械手系统、设备及方法
US10427303B2 (en) * 2013-03-15 2019-10-01 Applied Materials, Inc. Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing
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JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US20160332301A1 (en) * 2015-05-13 2016-11-17 Boris Kesil Method of handling and transporting flat objects between a plurality of flat object pocessing units at robotic station
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
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JP7225613B2 (ja) * 2018-09-03 2023-02-21 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
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* Cited by examiner, † Cited by third party
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US6893204B1 (en) * 2000-12-15 2005-05-17 Kabushiki Kaisha Yaskawa Denki Substrate delivering robot
US8888435B2 (en) * 2010-09-24 2014-11-18 Nidec Sankyo Corporation Industrial robot with overlapping first hand and second hand during time of linear transport
CN201913647U (zh) * 2010-12-21 2011-08-03 沈阳新松机器人自动化股份有限公司 机器人手臂机构

Also Published As

Publication number Publication date
KR20230152116A (ko) 2023-11-02
CN116940445A (zh) 2023-10-24
TW202241659A (zh) 2022-11-01
JP7682288B2 (ja) 2025-05-23
US11358809B1 (en) 2022-06-14
WO2022186968A1 (en) 2022-09-09
KR102834294B1 (ko) 2025-07-14
US20220274788A1 (en) 2022-09-01
JP2024509519A (ja) 2024-03-04

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