JP7682288B2 - 可変ピッチアクセス用真空ロボット装置 - Google Patents

可変ピッチアクセス用真空ロボット装置 Download PDF

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Publication number
JP7682288B2
JP7682288B2 JP2023551144A JP2023551144A JP7682288B2 JP 7682288 B2 JP7682288 B2 JP 7682288B2 JP 2023551144 A JP2023551144 A JP 2023551144A JP 2023551144 A JP2023551144 A JP 2023551144A JP 7682288 B2 JP7682288 B2 JP 7682288B2
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Japan
Prior art keywords
end effector
axis
rotation
forearm
pitch
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JP2023551144A
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English (en)
Japanese (ja)
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JP2024509519A5 (enExample
JP2024509519A (ja
Inventor
ライクマール タヌ，
ジェフリー シー． ハジェンズ，
カルパッサミー ムータカマッチ，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2024509519A5 publication Critical patent/JP2024509519A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2023551144A 2021-03-01 2022-02-11 可変ピッチアクセス用真空ロボット装置 Active JP7682288B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/188,374 2021-03-01
US17/188,374 US11358809B1 (en) 2021-03-01 2021-03-01 Vacuum robot apparatus for variable pitch access
PCT/US2022/016209 WO2022186968A1 (en) 2021-03-01 2022-02-11 Vacuum robot apparatus for variable pitch access

Publications (3)

Publication Number Publication Date
JP2024509519A JP2024509519A (ja) 2024-03-04
JP2024509519A5 JP2024509519A5 (enExample) 2024-04-19
JP7682288B2 true JP7682288B2 (ja) 2025-05-23

Family

ID=81944143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551144A Active JP7682288B2 (ja) 2021-03-01 2022-02-11 可変ピッチアクセス用真空ロボット装置

Country Status (6)

Country Link
US (2) US11358809B1 (enExample)
JP (1) JP7682288B2 (enExample)
KR (1) KR102834294B1 (enExample)
CN (1) CN116940445A (enExample)
TW (1) TWI861471B (enExample)
WO (1) WO2022186968A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102833850B1 (ko) * 2020-03-24 2025-07-14 주식회사 원익아이피에스 이송로봇 및 이를 포함하는 기판처리시스템
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US12226896B2 (en) 2021-10-22 2025-02-18 Applied Materials, Inc. Operations of robot apparatuses within rectangular mainframes
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016815A (ja) 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2018523307A (ja) 2015-07-13 2018-08-16 ブルックス オートメーション インコーポレイテッド オンザフライ方式の自動ウェハセンタリング方法および装置
JP2020035954A (ja) 2018-08-31 2020-03-05 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP2020038880A (ja) 2018-09-03 2020-03-12 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
WO2020054386A1 (ja) 2018-09-11 2020-03-19 川崎重工業株式会社 基板移載装置及びその制御方法
US20200384634A1 (en) 2019-06-07 2020-12-10 Applied Materials, Inc. Robot apparatus including dual end effectors with variable pitch and methods

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JP2002184834A (ja) * 2000-12-15 2002-06-28 Yaskawa Electric Corp 基板搬送用ロボット
AU2002327249A1 (en) * 2001-07-13 2003-01-29 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
JP4979530B2 (ja) * 2007-09-28 2012-07-18 日本電産サンキョー株式会社 産業用ロボット
JP5610952B2 (ja) * 2010-09-24 2014-10-22 日本電産サンキョー株式会社 産業用ロボット
CN201913647U (zh) * 2010-12-21 2011-08-03 沈阳新松机器人自动化股份有限公司 机器人手臂机构
KR102359364B1 (ko) * 2012-02-10 2022-02-07 브룩스 오토메이션 인코퍼레이티드 기판 프로세싱 장치
CN104380452B (zh) * 2012-04-12 2016-10-19 应用材料公司 具有独立能旋转机身中段的机械手系统、设备及方法
US10427303B2 (en) * 2013-03-15 2019-10-01 Applied Materials, Inc. Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing
US10424498B2 (en) * 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US20160332301A1 (en) * 2015-05-13 2016-11-17 Boris Kesil Method of handling and transporting flat objects between a plurality of flat object pocessing units at robotic station
US10099377B2 (en) * 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
KR101929872B1 (ko) * 2016-08-19 2019-03-15 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
US10453725B2 (en) * 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
US20200384636A1 (en) 2019-06-07 2020-12-10 Applied Materials, Inc. Dual pitch end effector robot apparatus, dual pitch load locks, systems, and methods
US11031269B2 (en) * 2019-08-22 2021-06-08 Kawasaki Jukogyo Kabushiki Kaisha Substrate transport robot, substrate transport system, and substrate transport method
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016815A (ja) 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2018523307A (ja) 2015-07-13 2018-08-16 ブルックス オートメーション インコーポレイテッド オンザフライ方式の自動ウェハセンタリング方法および装置
JP2020035954A (ja) 2018-08-31 2020-03-05 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP2020038880A (ja) 2018-09-03 2020-03-12 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
WO2020054386A1 (ja) 2018-09-11 2020-03-19 川崎重工業株式会社 基板移載装置及びその制御方法
US20200384634A1 (en) 2019-06-07 2020-12-10 Applied Materials, Inc. Robot apparatus including dual end effectors with variable pitch and methods

Also Published As

Publication number Publication date
KR20230152116A (ko) 2023-11-02
CN116940445A (zh) 2023-10-24
TW202241659A (zh) 2022-11-01
US11358809B1 (en) 2022-06-14
WO2022186968A1 (en) 2022-09-09
KR102834294B1 (ko) 2025-07-14
US20220274788A1 (en) 2022-09-01
TWI861471B (zh) 2024-11-11
JP2024509519A (ja) 2024-03-04

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