TWI855356B - 第1連接器及連接器模組 - Google Patents
第1連接器及連接器模組 Download PDFInfo
- Publication number
- TWI855356B TWI855356B TW111127176A TW111127176A TWI855356B TW I855356 B TWI855356 B TW I855356B TW 111127176 A TW111127176 A TW 111127176A TW 111127176 A TW111127176 A TW 111127176A TW I855356 B TWI855356 B TW I855356B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- connector
- contact portion
- insulator
- connection object
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 136
- 239000002184 metal Substances 0.000 claims abstract description 136
- 239000012212 insulator Substances 0.000 claims abstract description 77
- 238000003780 insertion Methods 0.000 description 19
- 230000037431 insertion Effects 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 14
- 230000008054 signal transmission Effects 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6597—Specific features or arrangements of connection of shield to conductive members the conductive member being a contact of the connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/771—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/771—Details
- H01R12/775—Ground or shield arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021178123 | 2021-10-29 | ||
| JP2021-178123 | 2021-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202318738A TW202318738A (zh) | 2023-05-01 |
| TWI855356B true TWI855356B (zh) | 2024-09-11 |
Family
ID=86159323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111127176A TWI855356B (zh) | 2021-10-29 | 2022-07-20 | 第1連接器及連接器模組 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12537346B2 (https=) |
| EP (1) | EP4425719A4 (https=) |
| JP (1) | JP7743532B2 (https=) |
| CN (1) | CN118251808A (https=) |
| TW (1) | TWI855356B (https=) |
| WO (1) | WO2023074053A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025047381A1 (ja) * | 2023-08-28 | 2025-03-06 | 京セラ株式会社 | コネクタモジュール及び電子機器 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3451393B2 (ja) * | 1998-01-30 | 2003-09-29 | 日本航空電子工業株式会社 | プラグコネクタ及びソケットコネクタ |
| JP4036378B2 (ja) * | 2004-06-07 | 2008-01-23 | 日本航空電子工業株式会社 | コネクタ |
| JP2006054102A (ja) * | 2004-08-11 | 2006-02-23 | Jst Mfg Co Ltd | コネクタ及びケーブル保持部材 |
| JP4090060B2 (ja) * | 2004-12-20 | 2008-05-28 | 日本航空電子工業株式会社 | コネクタ |
| JP4889243B2 (ja) * | 2005-06-09 | 2012-03-07 | モレックス インコーポレイテド | コネクタ装置 |
| TW200803057A (en) * | 2006-06-27 | 2008-01-01 | P Two Ind Inc | Electrical connector |
| WO2009031631A1 (ja) * | 2007-09-06 | 2009-03-12 | Fujikura Ltd. | コネクタ |
| WO2010082593A1 (ja) * | 2009-01-16 | 2010-07-22 | 株式会社フジクラ | コネクタ及びケーブルアセンブリ |
| US7833049B2 (en) * | 2009-01-21 | 2010-11-16 | P-Two Industries, Inc. | Electrical connector with changeover of circuit board |
| JP2011008978A (ja) * | 2009-06-24 | 2011-01-13 | Kyocera Elco Corp | 中継コネクタ |
| JP4792517B2 (ja) * | 2009-07-07 | 2011-10-12 | 日本航空電子工業株式会社 | コネクタ組立体 |
| TW201103207A (en) * | 2009-07-15 | 2011-01-16 | Adv Flexible Circuits Co Ltd | Shielded insertion and connection structure of flat cable connector |
| JP5182334B2 (ja) * | 2010-08-02 | 2013-04-17 | 第一精工株式会社 | 電気コネクタ |
| JP5154624B2 (ja) * | 2010-09-27 | 2013-02-27 | 京セラコネクタプロダクツ株式会社 | コネクタ |
| US8231407B1 (en) * | 2011-01-13 | 2012-07-31 | Hon Hai Precision Ind. Co., Ltd. | Cable assembly with improved grounding bar |
| TWI472101B (zh) | 2011-07-11 | 2015-02-01 | Dai Ichi Seiko Co Ltd | 連接器裝置 |
| JP5507507B2 (ja) * | 2011-08-11 | 2014-05-28 | ヒロセ電機株式会社 | 電気コネクタ装置及びこの電気コネクタ装置に用いられるコネクタ |
| JP5826565B2 (ja) * | 2011-08-31 | 2015-12-02 | 日本航空電子工業株式会社 | コネクタ |
| JP6113853B2 (ja) * | 2013-09-30 | 2017-04-12 | 京セラ株式会社 | 光コネクタおよび光伝送モジュール |
| JP6015971B2 (ja) * | 2014-10-02 | 2016-10-26 | 第一精工株式会社 | プラグコネクタ |
| CN109478746B (zh) * | 2016-07-13 | 2020-06-30 | 京瓷株式会社 | 连接器 |
| JP6807028B2 (ja) * | 2017-12-20 | 2021-01-06 | Ｉ−Ｐｅｘ株式会社 | 電気コネクタ及び電気コネクタの接続構造 |
| JP7040265B2 (ja) * | 2018-04-27 | 2022-03-23 | 住友電気工業株式会社 | シールドフラットケーブル |
| JP7144282B2 (ja) * | 2018-11-01 | 2022-09-29 | 日本航空電子工業株式会社 | コネクタ及びコネクタ組立体 |
| JP7446094B2 (ja) * | 2019-12-03 | 2024-03-08 | 日本航空電子工業株式会社 | 接続対象物、コネクタ、及びハーネス |
| CN211605519U (zh) | 2020-04-16 | 2020-09-29 | 立讯精密工业(苏州)有限公司 | 一种内嵌金属壳体的高强度连接器 |
-
2022
- 2022-07-06 JP JP2023556124A patent/JP7743532B2/ja active Active
- 2022-07-06 WO PCT/JP2022/026886 patent/WO2023074053A1/ja not_active Ceased
- 2022-07-06 EP EP22886390.8A patent/EP4425719A4/en active Pending
- 2022-07-06 CN CN202280069269.8A patent/CN118251808A/zh active Pending
- 2022-07-20 TW TW111127176A patent/TWI855356B/zh active
-
2023
- 2023-04-20 US US18/137,264 patent/US12537346B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20230261426A1 (en) | 2023-08-17 |
| EP4425719A4 (en) | 2025-02-26 |
| TW202318738A (zh) | 2023-05-01 |
| US12537346B2 (en) | 2026-01-27 |
| CN118251808A (zh) | 2024-06-25 |
| JP7743532B2 (ja) | 2025-09-24 |
| EP4425719A1 (en) | 2024-09-04 |
| WO2023074053A1 (ja) | 2023-05-04 |
| JPWO2023074053A1 (https=) | 2023-05-04 |
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